88719666 - CMC MATERIALS

Information

• Trademark
• 88719666

• Source

• Serial Number

  88719666

• Registration Number

  6667339

• International Classifications

  • 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
  • 3 - Bleaching preparations and other substances for laundry use
  • 7 - Machines and machine tools

• Filing Date

  December 09, 2019
  5 years ago

• Registration Date

  March 08, 2022
  2 years ago

• Transaction Date

  October 19, 2023
  a year ago

• Status Date

  March 08, 2022
  2 years ago

• Published for Opposition Date

  May 26, 2020
  4 years ago

• Location Date

  February 01, 2022
  2 years ago

• First Use Anywhere Date

  May 24, 2021
  3 years ago

• First Use In Commerce Date

  May 24, 2021
  3 years ago

• Status Code

  700

• Current Location

  PUBLICATION AND ISSUE SECTION

  Employee Name

  CLARK, ROBERT C

• Attorney Docket Number

  461010763001

  Attorney Name

  Cynthia Johnson Walden

  Law Office Assigned Location Code

  L10

• Owners

  • Cabot Microelectronics Corporation
  • CMC MATERIALS, INC

Case File Statements

• DM0000: The mark consists of horizontal wavy line with a horizontal straight line bisecting the wavy line equally to the left of the words "CMC MATERIALS".
• GS0071: Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
• PM0001: CABOT MICROELECTRONICS CORPORATION MATERIALS
• GS0031: Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
• CC0000: Color is not claimed as a feature of the mark.
• GS0011: Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
• D10000: "MATERIALS"

Case File Event Statements

• 10/18/2023 - a year ago

  51 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN

• 8/9/2023 - a year ago

  50 - TEAS CHANGE OF CORRESPONDENCE RECEIVED Type: TCCA

• 8/9/2023 - a year ago

  49 - ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Type: ARAA

• 8/9/2023 - a year ago

  48 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Type: REAP

• 8/9/2023 - a year ago

  47 - APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED Type: CHAN

• 8/9/2023 - a year ago

  46 - TEAS CHANGE OF OWNER ADDRESS RECEIVED Type: COAR

• 3/8/2022 - 2 years ago

  45 - REGISTERED-PRINCIPAL REGISTER Type: R.PR

• 2/2/2022 - 2 years ago

  44 - NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED Type: SUNA

• 2/1/2022 - 2 years ago

  43 - ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Type: CNPR

• 2/1/2022 - 2 years ago

  42 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 1/31/2022 - 2 years ago

  41 - STATEMENT OF USE PROCESSING COMPLETE Type: SUPC

• 1/21/2022 - 2 years ago

  40 - USE AMENDMENT FILED Type: IUAF

• 1/31/2022 - 2 years ago

  39 - SOU EXTENSION 3 GRANTED Type: EX3G

• 1/21/2022 - 2 years ago

  38 - SOU EXTENSION 3 FILED Type: EXT3

• 1/31/2022 - 2 years ago

  37 - CASE ASSIGNED TO INTENT TO USE PARALEGAL Type: AITU

• 1/21/2022 - 2 years ago

  36 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 1/21/2022 - 2 years ago

  35 - TEAS STATEMENT OF USE RECEIVED Type: EISU

• 7/23/2021 - 3 years ago

  34 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 7/21/2021 - 3 years ago

  33 - SOU EXTENSION 2 GRANTED Type: EX2G

• 7/21/2021 - 3 years ago

  32 - SOU EXTENSION 2 FILED Type: EXT2

• 7/21/2021 - 3 years ago

  31 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 5/12/2021 - 3 years ago

  30 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN

• 4/3/2021 - 3 years ago

  29 - PETITION TO DIRECTOR GRANTED Type: PCGR

• 4/13/2021 - 3 years ago

  28 - ASSIGNED TO PETITION STAFF Type: APET

• 4/13/2021 - 3 years ago

  27 - ASSIGNED TO PETITION STAFF Type: APET

• 1/15/2021 - 3 years ago

  26 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 1/13/2021 - 3 years ago

  25 - SOU EXTENSION 1 GRANTED Type: EX1G

• 1/13/2021 - 3 years ago

  24 - SOU EXTENSION 1 FILED Type: EXT1

• 1/13/2021 - 3 years ago

  23 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 1/13/2021 - 3 years ago

  22 - TEAS PETITION TO DIRECTOR RECEIVED Type: TPDR

• 7/21/2020 - 4 years ago

  21 - NOA E-MAILED - SOU REQUIRED FROM APPLICANT Type: NOAM

• 5/26/2020 - 4 years ago

  20 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB

• 5/26/2020 - 4 years ago

  19 - PUBLISHED FOR OPPOSITION Type: PUBO

• 5/6/2020 - 4 years ago

  18 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP

• 4/22/2020 - 4 years ago

  17 - ASSIGNED TO LIE Type: ALIE

• 4/14/2020 - 4 years ago

  16 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA

• 4/13/2020 - 4 years ago

  15 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME

• 4/13/2020 - 4 years ago

  14 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA

• 4/13/2020 - 4 years ago

  13 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA

• 2/25/2020 - 4 years ago

  12 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN

• 2/25/2020 - 4 years ago

  11 - NON-FINAL ACTION E-MAILED Type: GNRT

• 2/25/2020 - 4 years ago

  10 - NON-FINAL ACTION WRITTEN Type: CNRT

• 2/25/2020 - 4 years ago

  9 - NON-FINAL ACTION WRITTEN Type: CNRT

• 2/25/2020 - 4 years ago

  8 - NON-FINAL ACTION WRITTEN Type: CNRT

• 2/24/2020 - 4 years ago

  7 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN

• 2/24/2020 - 4 years ago

  6 - NON-FINAL ACTION E-MAILED Type: GNRT

• 2/24/2020 - 4 years ago

  5 - NON-FINAL ACTION WRITTEN Type: CNRT

• 2/24/2020 - 4 years ago

  4 - ASSIGNED TO EXAMINER Type: DOCK

• 12/13/2019 - 5 years ago

  3 - NOTICE OF DESIGN SEARCH CODE E-MAILED Type: MDSM

• 12/12/2019 - 5 years ago

  2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS

• 12/12/2019 - 5 years ago

  1 - NEW APPLICATION ENTERED Type: NWAP