TREA

97308047 - NANOMETRICS

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Information

  • Trademark
  • 97308047
  • Serial Number
    97308047
  • Registration Number
    7444130
  • Filing Date
    March 11, 2022
    2 years ago
  • Registration Date
    July 09, 2024
    6 months ago
  • Transaction Date
    July 09, 2024
    6 months ago
  • Status Date
    July 09, 2024
    6 months ago
  • Published for Opposition Date
    April 04, 2023
    a year ago
  • Location Date
    May 31, 2024
    7 months ago
  • First Use Anywhere Date
    March 29, 2024
    9 months ago
  • First Use In Commerce Date
    March 29, 2024
    9 months ago
  • Status Code
    700
  • Current Location
    PUBLICATION AND ISSUE SECTION
    Employee Name
    ALTREE, NICHOLAS
  • Attorney Docket Number
    15067155US02
    Attorney Name
    Heather J. Kliebenstein
    Law Office Assigned Location Code
    L70
  • Owners
Information
Mark Drawing Code
4
Mark Identification
NANOMETRICS
Case File Statements
  • GS0091: Optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; downloadable software for the semiconductor industry, namely, downloadable software for identifying defects in semiconductor structures, downloadable software for identifying semiconductor fabrication process excursions, downloadable software for recording and reviewing defects in semiconductors structures, downloadable software for identifying root causes of defects in semiconductor structures, and downloadable software for controlling and monitoring semiconductor fabrication equipment; metrology inspection equipment for use in the manufacturing, inspection, testing and repair of semiconductor substrates; metrology inspection equipment and devices, namely, instruments and devices that sense and capture images of semiconductor components, semiconductor wafers, semiconductor die, packaged integrated circuits, printed circuit boards, liquid crystal displays, electronic displays, and disk storage media, and inspect these images for defects, coordinate or position determination, identification, or presence or absence of a feature, characteristic or substance thereon; metrology inspection systems comprised of one or more light sources, one or more cameras and/or sensors in communication with embedded computer software and hardware used for the measurement of thickness, adhesion properties, and structural properties of semiconductor materials and for monitoring the performance of semiconductor fabrication processes; optical inspection equipment for 2D and 3D inspection of semiconductor materials; metrology instruments for metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials, consisting of optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometers
  • GS0071: Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; Optical metrology, characterization, and inspection systems comprised of a machine, components and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components
  • GS0421: Providing temporary use on online, non-downloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogenous packaging, and other advanced packaging electronics technologies; providing online non-downloadable software for the semiconductor industry, namely, online non-downloadable software for identifying defects in semiconductor structures, online non-downloadable software for identifying semiconductor fabrication process excursions, online non-downloadable software for recording and reviewing defects in semiconductors structures, online non-downloadable software for identifying root causes of defects in semiconductor structures, and online non-downloadable software for controlling and monitoring semiconductor fabrication equipment
Case File Event Statements
  • 5/2/2022 - 2 years ago
    3 - ASSIGNED TO EXAMINER Type: DOCK
  • 3/15/2022 - 2 years ago
    1 - NEW APPLICATION ENTERED Type: NWAP
  • 3/16/2022 - 2 years ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 8/30/2022 - 2 years ago
    4 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 8/30/2022 - 2 years ago
    5 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 8/30/2022 - 2 years ago
    6 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 3/1/2023 - a year ago
    9 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 2/28/2023 - a year ago
    7 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 2/28/2023 - a year ago
    8 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 3/1/2023 - a year ago
    10 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 3/15/2023 - a year ago
    11 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 4/4/2023 - a year ago
    13 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB
  • 4/4/2023 - a year ago
    12 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 5/30/2023 - a year ago
    14 - NOA E-MAILED - SOU REQUIRED FROM APPLICANT Type: NOAM
  • 11/30/2023 - a year ago
    15 - SOU TEAS EXTENSION RECEIVED Type: EEXT
  • 11/30/2023 - a year ago
    16 - SOU EXTENSION 1 FILED Type: EXT1
  • 11/30/2023 - a year ago
    17 - SOU EXTENSION 1 GRANTED Type: EX1G
  • 12/2/2023 - a year ago
    18 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA
  • 4/30/2024 - 8 months ago
    21 - USE AMENDMENT FILED Type: IUAF
  • 5/28/2024 - 7 months ago
    20 - CASE ASSIGNED TO INTENT TO USE PARALEGAL Type: AITU
  • 5/29/2024 - 7 months ago
    22 - STATEMENT OF USE PROCESSING COMPLETE Type: SUPC
  • 5/31/2024 - 7 months ago
    23 - ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Type: CNPR
  • 5/31/2024 - 7 months ago
    24 - NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED Type: SUNA
  • 7/9/2024 - 6 months ago
    25 - REGISTERED-PRINCIPAL REGISTER Type: R.PR
  • 7/9/2024 - 6 months ago
    26 - NOTICE OF REGISTRATION CONFIRMATION EMAILED Type: NRCC
  • 4/30/2024 - 8 months ago
    19 - TEAS STATEMENT OF USE RECEIVED Type: EISU