The present invention relates to a device for heating a room in a building at least in part by means of underfloor heating, the floor comprising a subfloor and an upper floor, between which there are pipe loops in which hot medium is circulated, further as stated in the preamble of claim 1.
Different designs of underfloor heating systems are known. In new construction, the pipe loops are usually cast into concrete, which tiles or other floor coverings are laid with a moisture barrier in between. When renovating or rehabilitating, where the building height must be limited, the pipe loops are usually laid in plastic knob plate or rigid insulation material on the existing floor. In all cases, the heat from the pipe loops must be conducted up through the floor covering, which can thereby have an uncomfortably high temperature during the winter and give a too cold feeling when the system is used for cooling in the summer.
A device as stated in the preamble of claim 1 is known from JP2009216323 A. Here, in the air spaces formed between the beams in the floor, loops of heating pipes are laid, running along the beams from one air space to another while emitting energy to the air flowing along them. This means that the last rooms will be significantly colder than the first, and that everyone will be disproportionately cold on the air intake side.
The invention aims i.a. to reduce these disadvantages and, at the same time, cause a quicker spread of the heat in the room. This is achieved according to the invention by a device as defined in the claims.
By causing the fresh air to be supplied to the room to pass the pipe loops in the chamber between the floors, it is heated, at the same time as it emits some of the heat to the upper floor, so that this has a comfortable temperature and contributes to a certain extent to the room heating. The rest of the heating is caused by the air flowing out of the outlet openings and quickly spreading in the room.
The invention is particularly suitable for use with energy systems of the type described in the applicant's European patent EP 2956723 B1. Here, the invention will make it possible to avoid radiators in the rooms and at the same time achieve a comfortable underfloor heating, as well as optimization of the heat pump that drives the energy system.
For a better understanding of the invention, it is described in the following in the form of the exemplary embodiments which are schematically shown in the accompanying drawings, in which
At a suitable distance above the subfloor 1, an upper floor 8 (partially shown) will be arranged in the room 2, which has outlet openings 9 for the heated air on the opposite side of the room 2 in relation to the inlet openings 7. Further details will appear from
The inlet openings 7 are provided on the outside of the wall 3 with a replaceable filter 14, and on the inside, means 15 (omitted in
The pipe loops 4 and the concrete layer 11 do not extend over the entire room 2, but are terminated at a certain distance from the wall 17 on the opposite side in relation to the outer wall 3. Thereby a portion 18 of the chamber 16 is formed which has a greater height than the rest. This portion 18 of the chamber 16 will then act as a diffuser, the air flowing out of the narrower portion of the chamber being slowed down and thereby recovering some of its original compressive energy. This promotes outflow to the room 2 through the outlet openings 9 in the upper floor 8. The width of the portion 18 can be about half of the total width of the room 2.
When fresh air from the inlet opening 7 flows in through the air opening 22, there will be a small stagnation pressure in the funnel 25. Some of the air will flow out through the slit 26, while most will be deflected and flow out laterally and spread along the outer wall 3 before flowing over the pipe loops 4 towards the outlet.
If the device according to the invention is for instance part of an energy system as mentioned above, the temperature of the return water 5 can be kept as low as 35-40° C. to give maximum efficiency of the heat pump.
Number | Date | Country | Kind |
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20191320 | Nov 2019 | NO | national |
Filing Document | Filing Date | Country | Kind |
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PCT/NO2020/050271 | 11/5/2020 | WO |