This document claims priority to Japanese Patent Application Number 2021-210146 filed Dec. 24, 2021, the entire contents of which are hereby incorporated by reference.
In manufacturing of semiconductor devices, a CVD apparatus is used to form a film on a wafer. The CVD apparatus is configured to introduce a process gas, such as dichlorosilane (DCS) or ammonia (NH3), into a process chamber to form a film on a wafer (film formation process). After the film formation process, a purge gas, such as nitrogen gas, is supplied into the process chamber to remove the process gas from the process chamber (purging process). Further, a cleaning gas, such as fluorine gas (F2) or hydrogen fluoride gas (HF), is supplied into the process chamber to clean an interior of the process chamber (cleaning process).
In the CVD apparatus, the film formation process, the purging process, and the cleaning process are repeatedly performed. Since the process gas and the cleaning gas are harmful gases, both gases must be treated with an abatement apparatus. The CVD apparatus typically includes a plurality of process chambers in order to increase productivity. The abatement apparatus is coupled to the plurality of process chambers and treats the process gas and the cleaning gas exhausted from each process chamber.
The process gas, such as dichlorosilane (DCS) or ammonia (NH3), used in the film. formation process is combustible gas, and the cleaning gas, such as fluorine gas (F2) or hydrogen fluoride gas (HF), used in the cleaning process is combustion-supporting gas. When the process gas and the cleaning gas are mixed, the mixture of these gases may explode. For this reason, the plurality of process chambers 500 are separately coupled to the plurality of wet treatment devices 501, as shown in
However, the conventional abatement apparatus shown in
Therefore, there is provided an abatement apparatus capable of treating exhaust gas with less wet treatment devices than a conventional abatement apparatus.
Embodiments, which will be described below, relate to an abatement apparatus for treating process gas and cleaning gas discharged from a film forming device, such as a CVD device, used to manufacture semiconductor devices.
In an embodiment, there is provided an abatement apparatus for exhaust gas including process gas and cleaning gas, comprising: at least one pre-wet treatment device; a combustion treatment device; a plurality of gas introduction lines coupled to process chambers of a film forming device, the number of at least one pre-wet treatment device being less than the number of process chambers; a plurality of first flow-path switching devices coupled to the plurality of gas introduction lines, respectively; a first gas delivery line extending from the plurality of first flow-path switching devices to the pre-wet treatment device; a second gas delivery line extending from the plurality of first flow-path switching devices to the combustion treatment device; and an operation controller configured to control operations of the plurality of first flow-path switching devices to deliver the process gas to the pre-wet treatment device and deliver the cleaning gas to the combustion treatment device.
In an embodiment, the operation controller is configured to: operate a first one of the plurality of first flow-path switching devices to establish fluid communication between a first one of the plurality of gas introduction lines and the first gas delivery line, and cut off fluid communication between the first one of the plurality of gas introduction lines and the second gas delivery line when the operation controller receives, from the film forming device, a process-gas discharge signal indicating that the process gas is discharged from one of the process chambers, which is coupled to the first one of the plurality of first flow-path switching devices and the first one of the plurality of gas introduction lines; and operate a second one of the plurality of first flow-path switching devices to establish fluid communication between a second one of the plurality of gas introduction lines and the second gas delivery line, and cut off fluid communication between the second one of the plurality of gas introduction lines and the first gas delivery line when the operation controller receives, from the film forming device, a cleaning-gas discharge signal indicating that the cleaning gas is discharged from one of the process chambers, which is coupled to the second one of the plurality of first flow-path switching devices and the second one of the plurality of gas introduction lines.
In an embodiment, the plurality of first flow-path switching devices comprise a plurality of three-way valves.
In an embodiment, the operation controller is configured to operate the plurality of first flow-path switching devices to establish fluid communication between the plurality of gas introduction lines and the second gas delivery line and to cut off fluid communication between the plurality of gas introduction lines and the first gas delivery line when clogging of the wet treatment device is detected.
In an embodiment, the abatement apparatus further comprises: at least one second flow-path switching device attached to the second gas delivery line; and a bypass line coupled to the second flow-path switching device, the operation controller being configured to operate the second flow-path switching device.
In an embodiment, the operation controller is configured to operate the plurality of first flow-path switching devices to establish fluid communication between the plurality of gas introduction lines and the second gas delivery line and to cut off fluid communication between the plurality of gas introduction lines and the first gas delivery line, and operate the plurality of second flow-path switching devices to establish fluid communication between the second gas delivery line and the bypass line and to cut off fluid communication between the plurality of first flow-path switching devices and the wet treatment device when clogging of the wet treatment device is detected.
In an embodiment, the abatement apparatus further comprises: a post-wet treatment device provided downstream of the combustion treatment device; and an exhaust line coupled to the post-wet treatment device, the bypass line being coupled to the exhaust line.
In an embodiment, the pre-wet treatment device is a single pre-wet treatment device.
The operation controller can send the process gas to the pre-wet treatment device, while sending the cleaning gas to the combustion treatment device by operating the plurality of first flow-path switching devices separately. Since the cleaning gas is not sent to the pre-wet treatment device, the cleaning gas and the process gas are not mixed in the pre-wet treatment device. Therefore, it is not necessary to provide as many wet treatment devices as there are process chambers. As a result, cost and footprint of the abatement apparatus can be reduced.
Hereinafter, embodiments will be described with reference to the drawings.
In the film forming device 1 which is a CVD device, process gas for forming a film on a wafer (i.e., gas containing material of the film), purge gas for removing the process gas from the process chambers 2A to 2D, and cleaning gas for cleaning interiors of the process chambers 2A to 2D are successively supplied into the process chambers 2A to 2D. Examples of the process gas include dichlorosilane (DCS), ammonia (NH3), etc. Examples of the cleaning gas include fluorine gas (F2), hydrogen fluoride gas (HF), nitrogen trifluoride gas (NF3), and chlorine trifluoride gas (ClF3).
In the film forming device 1, a film forming process, a purging process, and a cleaning process are repeatedly performed in the process chambers 2A to 2D at different cycles. The film forming process is a process of introducing the process gas containing material of a film into the process chambers 2A to 2D to form the film on wafers. After the film formation process, the purging process is performed in which the purge gas, such as nitrogen gas, is supplied into the process chambers 2A to 2D to remove the process gas from the process chambers 2A to 2D. Further, the cleaning process is performed in which the cleaning gas, such as fluorine gas (F2) or hydrogen fluoride gas (HF), is supplied into the process chambers 2A to 2D to clean the process chambers 2A to 2D.
As shown in
The operation controller 15 includes at least one computer. The operation controller 15 includes a memory 15a and an arithmetic device (or a processor) 15b. The arithmetic device 15b includes a CPU (Central Processing Unit) or GPU (Graphic Processing Module) configured to perform arithmetic operations according to instructions contained in programs stored in the memory 15a. The memory 15a includes a main memory (e.g., random access memory) to which the arithmetic device 15b is accessible, and an auxiliary memory (e.g., hard disk drive or solid state drive) for storing data and the programs. However, the specific configurations of the operation controller 15 are not limited to these examples.
The pre-wet treatment device 5 is coupled to the combustion treatment device 6 by a first coupling line 21. Ends of the gas introduction lines 7A to 7D are coupled to the process chambers 2A to 2D, respectively, and other ends of the gas introduction lines 7A to 7D are coupled to the first flow-path switching devices 8A to 8D, respectively. The number of gas introduction lines 7A to 7D is the same as the number of first flow-path switching devices 8A to 8D. In this embodiment, four process chambers 2A to 2D, four gas introduction lines 7A to 7D, and four first flow-path switching devices 8A to 8D are provided, but the numbers of these elements are not limited to this embodiment.
Ends of the first gas delivery lines 9A to 9D are coupled to the first flow-path switching devices 8A to 8D, respectively, and other ends of the first gas delivery lines 9A to 9D are coupled to the pre-wet treatment device 5. In the embodiment shown in
Ends of the second gas delivery lines 10A to 10D are coupled to the first flow-path switching devices 8A to 8D, respectively, and other ends of the second gas delivery lines 10A to 10D are coupled to the combustion treatment device 6. In the embodiment shown in
The first flow-path switching devices 8A to 8D are configured to selectively couple the gas introduction lines 7A to 7D to either the first gas delivery lines 9A to 9D or the second gas delivery lines 10A to 10D. These first flow-path switching devices 8A to 8D are configured to operate independently of each other. In the embodiment shown in
The operation controller 15 is electrically coupled to the first flow-path switching devices 8A to 8D, and is configured to be able to operate the first flow-path switching devices 8A to 8D separately. Therefore, for example, as shown in
The film forming device 1 performs the film forming process, the purging process, and the cleaning process in different cycles in the plurality of process chambers 2A to 2D. Therefore, the process gas, the purge gas, and the cleaning gas are discharged in this order at different timings from the process chambers 2A to 2D. The purge gas is an inert gas, such as nitrogen gas, while the process gas is a combustible gas, and the cleaning gas is a combustion-supporting gas. Therefore, if both the process gas and the cleaning gas are sent to the single pre-wet treatment device 5, both gases may mix in the pre-wet treatment device 5 and may explode.
Thus, the operation controller 15 is configured to control the operations of the first flow-path switching devices 8A to 8D such that the process gas is sent to the pre-wet treatment device 5 while the cleaning gas is sent to the combustion treatment device 6. In other words, the cleaning gas is not sent to the pre-wet treatment device 5. For example, as shown in
At the same time, when the cleaning gas is discharged from the process chamber 2B, the operation controller 15 operates the first flow-path switching device 8B to cut off the fluid communication between the gas introduction line 7B and the first gas delivery line 9B, and establish the fluid communication between the gas introduction line 7B and the second gas delivery line 10B. As a result, the cleaning gas is not sent to the pre-wet treatment device 5, but is sent to the combustion treatment device 6 through the second gas delivery line 10B. In
In this manner, the operation controller 15 operates the first flow-path switching devices 8A to 8D separately to transfer the process gas to the pre-wet treatment device 5, while transferring the cleaning gas to the combustion treatment device 6. Since the cleaning gas is not transferred to the pre-wet treatment device 5, the cleaning gas and the process gas are not mixed in the pre-wet treatment device 5. Therefore, unlike the conventional abatement apparatus shown in
In one embodiment, in order to ensure the process gas to be sent to the pre-wet treatment device 5 and to prevent the cleaning gas from being sent to the pre-wet treatment device 5, the operation controller 15 may operate the first flow-path switching devices 8A to 8D at timings when the purge gas is passing through the first flow-path switching devices 8A to 8D.
The operation controller 15 is electrically coupled to the film forming device 1 and configured to receive a process-gas discharge signal, a purge-gas discharge signal, and a cleaning-gas discharge signal issued from the film forming device 1. The film forming device 1 is configured to generate the process-gas discharge signal and transmit it to the operation controller 15 when the process gas is discharged from any one of the process chambers 2A to 2D. The process-gas discharge signal contains information identifying one of the process chambers 2A to 2D from which the process gas is discharged.
For example, when the operation controller 15 receives, from the film forming device 1, the process-gas discharge signal indicating that the process gas is discharged from the process chamber 2A, the operation controller 15 operates the first flow-path switching device 8A corresponding to the process chamber 2A to establish the fluid communication. between the corresponding gas introduction line 7A and the first gas delivery line 9A, and cut off the fluid communication between the corresponding gas introduction line 7A and the second gas delivery line 10A. By operating the first flow-path switching device 8A in this way, the process gas discharged from the process chamber 2A flows through the gas introduction line 7A, the first flow-path switching device 8A, and the first gas delivery line 9A to the pre-wet treatment device 5.
The film forming device 1 is configured to generate the cleaning-gas discharge signal and transmit it to the operation controller 15 when the cleaning gas is discharged from any one of the plurality of process chambers 2A to 2D. The cleaning-gas discharge signal contains information identifying one of the process chambers 2A to 2D from which the cleaning gas is discharged.
For example, when the operation controller 15 receives, from the film forming device 1, the cleaning-gas discharge signal indicating that the cleaning gas is discharged from the process chamber 2B, the operation controller 15 operates the first flow-path switching device 8B corresponding to the process chamber 2B to cut off the fluid communication between the corresponding gas introduction line 7B and the first gas delivery line 9B, and establish the fluid communication between the corresponding gas introduction line 7B and the second gas delivery line 10B. By such operation of the first flow-path switching device 8B, the cleaning gas discharged from the process chamber 2B flows through the gas introduction line 7B, the first flow-path switching device 8B, and the second gas delivery line 10B to the combustion treatment device 6.
The abatement apparatus further includes a post-wet treatment device 22 provided downstream of the combustion treatment device 6, and an exhaust line 23 coupled to the post-wet treatment device 22. The post-wet treatment device 22 is coupled to the combustion treatment device 6 by a second coupling line 24. According to the abatement apparatus having such configurations, the process gas is sequentially treated by the pre-wet treatment device 5, the combustion treatment device 6, and the post-wet treatment device 22, and the cleaning gas is sequentially treated by the combustion treatment device 6 and the post-wet treatment device 22.
When the cleaning gas, including fluorine gas (F2), hydrogen fluoride gas (HF), or nitrogen trifluoride gas (NF3), is subjected to the wet treatment, acidic water that is corrosive to metal may be produced. According to the embodiment shown in
In addition, since the cleaning gas bypasses the pre-wet treatment device 5, the cleaning gas is delivered to the combustion treatment device 6 while the cleaning gas is maintained in a dry state, so that a decrease in the temperature of the cleaning gas can be avoided. As a result, the combustion treatment device 6 can burn the cleaning gas with high efficiency. In particular, the combustion treatment apparatus 6 can treat the cleaning gas containing a persistent gas, such as chlorine trifluoride gas (ClF3), with high efficiency.
Mixture of the process gas and the cleaning gas may form a solidified by-product as the temperature of the mixture decreases. Examples of the by-product include ammonium fluoride and ammonium fluorosilicate. The by-product is likely to be formed upstream of the combustion treatment device 6 where the temperature is the lowest. The by-product can clog the gas flow path, and therefore formation of the by-product should be avoided as much as possible. According to the above embodiment, the ammonia (NH3) contained in the process gas is removed by the pre-wet treatment device 5, and the cleaning gas bypasses the pre-wet treatment device 5, so that the above-mentioned by-product is not produced. Furthermore, since ammonia is removed by the pre-wet treatment device 5, generation of NOx in the next combustion treatment device 6 is suppressed.
As shown in
The by-product, which is made of a component of the process gas, may be deposited in the pre-wet treatment device 5. As the deposition of such by-product progresses, an internal flow path of the pre-wet treatment device 5 may be clogged. Therefore, the operation controller 15 is configured to detect clogging of the pre-wet treatment device 5 based on the measured value of the pressure transmitted from the pressure sensor 30. Specifically, when the measured value of the pressure in the gas introduction line 7A is above a threshold value under the condition that the first flow-path switching device 8A establishes the fluid communication between the gas introduction line 7A and the first gas delivery line 9A, and when the measured value of the pressure in the gas introduction line 7A is below the threshold value under the condition that the first flow-path. switching device 8A establishes the fluid communication between the gas introduction line 7A and the second gas delivery line 10A, the operation controller 15 determines that the pre-wet treatment device 5 is clogged.
On the other hand, when the measured value of the pressure in the gas introduction line 7A is below the threshold value under the condition that the first flow-path switching device 8A establishes the fluid communication between the gas introduction line 7A and the first gas delivery line 9A, the operation controller 15 determines that both the pre-wet treatment device 5 and the combustion treatment device 6 are not clogged.
As shown in
The combustion treatment device 6 includes a combustion chamber 50 to which the first coupling line 21 is coupled, a burner 51 for forming a flame in the combustion chamber 50, and the gas-liquid separation tank 48 for separating water and gas from each other. The gas-liquid separation tank 48 is shared with the pre-wet treatment apparatus 5, and the water in the gas-liquid separation tank 48 circulates as indicated by arrows. A narrowed flow path 48a, which is a part of the gas-liquid separation tank 48, is filled with water, so that the narrowed flow path 48a located between the pre-wet treatment device 5 and the combustion treatment device 6 is sealed with water.
The post-wet treatment device 22 includes a water treatment chamber 60 coupled to the second coupling line 24, and water spray nozzles 61 and 62 arranged in the water treatment chamber 60. The second coupling line 24 is coupled to the gas-liquid separation tank 48 of the combustion treatment device 6.
The process gas and the cleaning gas are treated as follows. The process gas is first treated by the pre-wet treatment device 5. The process gas flows into the water storage chamber 41 and then flows downward through the wet-wall portion 44. The water ejector 46 sprays water onto the process gas flowing through a flow path 47, thereby removing water-soluble components contained in the process gas. For example, Si component contained in dichlorosilane (DCS) dissolves in the water and is removed therefrom, so that a treatment load of the subsequent combustion treatment device 6 is reduced. Ammonia (NH3) in the process gas is also removed by the water.
The water sprayed from the water ejector 46 and the process gas are separated in the gas-liquid separation tank 48. The water is stored in the gas-liquid separation tank 48, while the process gas flows through the first coupling line 21 into the combustion chamber 50 of the combustion treatment device 6. The water in the gas-liquid separation tank 48 contains ammonia (NH3) in the process gas and becomes alkaline water. This alkaline water does not corrode the gas-liquid separation tank 48 made of metal, and does not require a coating for preventing the corrosion.
The process gas that has been treated by the pre-wet treatment device 5 is then treated by the combustion treatment device 6. The cleaning gas is not treated by the pre-wet treatment device 5 and is treated by the combustion treatment device 6. The burner 51 forms the flame in the combustion chamber 50, and the process gas (which is a combustible gas) and the cleaning gas (which is a combustion-supporting gas) are combusted by the flame. The wet wall, which is a water film in this embodiment, is formed on the inner surface of the combustion chamber 50 to protect the combustion chamber 50.
The process gas and/or the cleaning gas that have been subjected to the combustion treatment (which will be hereinafter referred to as “treated gas”) flows downward in the combustion chamber 50, passes through the gas-liquid separation tank 48, and passes through the second coupling line 24 into the post-yet treatment device 22. The post-wet treatment device 22 further performs the wet treatment on the treated gas by spraying water onto the treated gas from the water spray nozzles 61 and 62. The treated gas that has been wet-treated by the post-wet treatment device 22 is discharged from the abatement apparatus through the exhaust line 23. In this way, the process gas is treated by the pre-wet treatment device 5, the combustion treatment device 6, and the post-wet treatment device 22, and the cleaning gas is treated by the combustion treatment device 6 and the post-wet treatment device 22.
In the embodiment shown in
On the other hand, the cleaning gas does not flow into the pre-wet treatment device 5. Therefore, short cut of the cleaning gas through the gas-liquid separation tank 48 as described above does not occur in principle. Specifically, the cleaning gas always passes through the combustion treatment device 6 and is treated by the combustion treatment device 6. Further, the cleaning gas is treated by the post-wet treatment device 22.
Next, another embodiment of the abatement apparatus will be described with reference to
As shown in
The second flow-path switching devices 71A to 71D are configured to selectively pass the cleaning gas flowing through the second gas delivery lines 10A to 10D to either the combustion treatment device 6 or the bypass lines 73A to 73D. Specifically, the second flow-path switching devices 71A to 71D are configured to be able to switch between a normal route and an emergency route. The normal route is a route that allows fluid communication between the first flow-path switching devices 8A to 8D and the combustion treatment device 6 and cuts off fluid communication between the second gas delivery lines 10A to 10D and the bypass lines 73A to 73D. The emergency route is a route that allows the fluid communication between the second gas delivery lines 10A to 10D and the bypass lines 73A to 73D and cuts off the fluid communication between the first flow-path switching devices 8A to 8D and the combustion treatment device 6.
In
On the other hand, when a serious failure has occurred and the abatement apparatus should be stopped, as shown in
An example of the serious failure that requires the stoppage of the abatement apparatus includes clogging of the combustion treatment device 6. The operation controller 15 can detect clogging of the combustion treatment device 6 based on the measured value of the pressure in the gas introduction line 7A transmitted from the pressure sensor 30. More specifically, when the measured value of the pressure in the gas introduction line 7A is above the threshold value under the condition that the first flow-path switching device 8A provides the fluid communication between the gas introduction line 7A and the second gas delivery line 10A, the operation controller 15 determines that the combustion treatment device 6 is clogged.
As shown in
By such operations, the process gas and the cleaning gas are not delivered to both the pre-wet treatment device 5 and the combustion treatment device 6 (i.e., the process gas and the cleaning gas bypass both the pre-wet treatment device 5 and the combustion treatment device 6), and are delivered to the exhaust line 23. As a result, damage due to a pressure increase within the abatement apparatus is prevented.
When a flame failure has occurred in the combustion treatment device 6 due to a malfunction of the burner 51 or other element, a combustion failure signal is sent to the operation controller 15 from a combustion detector (not shown). When the operation controller 15 receives the combustion failure signal (i.e., when the flame failure has occurred in the combustion treatment device 6), the operation controller 15 maintains the normal route of the second flow-path switching devices 71A to 71D. The flame failure is classified as a minor failure, and the combustion treatment device 6 with no flame simply functions as a flow passage. Therefore, the process gas that has been treated in the pre-wet treatment device 5 and the cleaning gas that has been transferred through the second gas delivery lines 10A to 10D simply pass through the combustion treatment device 6.
In one embodiment, as shown in
In the embodiments shown in
The previous description of embodiments is provided to enable a person skilled in the art to make and use the present invention. Moreover, various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles and specific examples defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the embodiments described herein but is to be accorded the widest scope as defined by limitation of the claims.
Number | Date | Country | Kind |
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2021-210146 | Dec 2021 | JP | national |