Claims
- 1. A composition comprising,
- (a) an epoxy resin containing on average more than one epoxy group in the molecule or a still fusible and/or soluble curable precondensate of said epoxy resin, and
- (b) at least one compound of formula I or II ##STR5## wherein R.sup.1 and R.sup.2 are each independently of the other hydrogen, C.sub.1 -C.sub.18 alkyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--CO--R.sup.4 radical, R.sup.3 is hydrogen or methyl, R.sup.4 is C.sub.1 -C.sub.18 -alkyl, cyclohexyl, phenyl, benzyl or tolyl, X is --CR.sup.5 R.sup.6 --, --S--, --SO--, --SO.sub.2 --or --(CH.sub.3)C[--(CH.sub.2).sub.m --COOR.sup.7 ]--, in which R.sup.5 and R.sup.6 are each independently of the other hydrogen or C.sub.1 -C.sub.6 alkyl, R.sup.7 is C.sub.1 -C.sub.18 alkyl, m is 1 or 2 and n is an integer from 1 to 10.
- 2. Method of using a composition comprising
- (a) an epoxy resin containing on average more than one epoxy group in the molecule and
- (b) at least one compound of formula I and/or II according to claim 1,
- as single component adhesive formulation.
- 3. A cured product obtainable by heating a composition as claimed in claim 1.
Priority Claims (1)
Number |
Date |
Country |
Kind |
452/85 |
Feb 1985 |
CHX |
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Parent Case Info
This is a divisional of application Ser. No. 823,230, filed on Jan. 28, 1986, now U.S. Pat. No. 4,694,096, issued Sept. 15, 1987.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
823230 |
Jan 1986 |
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