Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a differential scanning calorimetry chart of an adhesive composition of an example 1.
Claims
1. An adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s, wherein T represents a curing start temperature for said composition.
2. The adhesive composition according to claim 1, wherein said composition comprises
(A) at least one resin selected from the group consisting of polyamic acid resins having a diorganopolysiloxane chain and phenolic hydroxyl groups within a polymer backbone, and polyimide resins that are ring-closing derivatives of said polyamic acid resins,(B) an epoxy resin,(C) an epoxy resin curing catalyst, and(D) an inorganic filler.
3. The adhesive composition according to claim 2, wherein said polyimide resin of said component (A) comprises a polyimide resin obtained by reacting a tetracarboxylic dianhydride with a diamine compound that comprises a diamine represented by a formula (1) shown below:
4. The adhesive composition according to claim 2, wherein said polyimide resin of said component (A) comprises a polymer backbone obtained by reacting a tetracarboxylic dianhydride with a diamine represented by a formula shown below:
5. The adhesive composition according to claim 4, wherein said diamine is a diamine represented by a formula (2) shown below:
6. A laminate comprising a substrate, and an adhesive film that comprises the adhesive composition defined in claim 1 provided on top of said substrate.
7. A method of producing a semiconductor device using an adhesive film comprising an adhesive composition defined in claim 1, comprising the steps of:
thermocompression bonding a semiconductor wafer to an substrate through said adhesive film at a temperature of 40 to 80° C., andconducting wire bonding at a temperature within a range from 80° C. to (T+50)° C. over a period of 1 minute to 2 hours, wherein T is as defined in claim 1.
Patent Application
20070191552
