Claims
- 1. Pressure sensitive structural adhesive and sealant compositions comprising:
- (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polydiene block polymer wherein at least one of the functionalities on the heterotelechelic polydiene block polymer is the same as the functionality on the telechelic polymer, and
- (b) a dual curing system wherein one element of the curing system cures the telechelic polymer at ambient conditions such that a pressure sensitive adhesive or sealant is formed and the other element cures the heterotelechelic polydiene block polymer upon free radical cure to form a structural adhesive or sealant composition.
- 2. The compositions of claim 1 wherein the polymer system comprises a telechelic polymer containing hydroxyl functionality and a heterotelechelic polydiene block polymer containing hydroxyl functionality and another functionality which is acrylic unsaturation.
- 3. The compositions of claim 1 wherein the dual curing system is comprised of an polyisocyanate having a equivalent weight between 50 and 500 which is the curing agent for the telechelic polymer and free radical cure via peroxide or radiation which is the curing system for the heterotelechelic polydiene block polymer.
Parent Case Info
This is a division of application Ser. No. 08/654,462 filed Aug. 16, 1996, now U.S. Pat. No. 5,804,657, which is a divisional of Ser. No. 08/519,885 filed Aug. 28, 1995, now U.S. Pat. No. 5,576,388, which is a continuation-in-part of Ser. No. 08/320,808, filed Oct. 11, 1994, now abandoned, the entire disclosures of which are hereby incorporated by reference.
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Divisions (2)
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Number |
Date |
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Parent |
654462 |
Aug 1996 |
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Parent |
519885 |
Aug 1995 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
320808 |
Oct 1994 |
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