Epoxidised polymerised polyenes

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CPC
C09J163/08

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CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J163/00Adhesives based on epoxy resins Adhesives based on derivatives of epoxy resins

Current Industry

C09J163/08Epoxidised polymerised polyenes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Vegetable oil-derived epoxy compositions having improved performance
- Patent number 11,945,905
- Issue date Apr 2, 2024
- Washington State University
- Jinwen Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for endoscope, cured product, endoscope, and method for pr...
- Patent number 11,932,762
- Issue date Mar 19, 2024
- FUJIFILM Corporation
- Kazushi Furukawa
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Epoxy based composition
- Patent number 11,390,742
- Issue date Jul 19, 2022
- Henkel AG & Co. KGaA
- Chunfu Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method and underfill film
- Patent number 10,280,347
- Issue date May 7, 2019
- Dexerials Corporation
- Kenji Kubota
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, adhesive agent, and sealing agent
- Patent number 10,221,282
- Issue date Mar 5, 2019
- Namics Corporation
- Kazuki Iwaya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminate, inner liner material and pneumatic tire
- Patent number 10,183,530
- Issue date Jan 22, 2019
- The Yokohama Rubber Co., Ltd.
- Hirokazu Shibata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,691,677
- Issue date Jun 27, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet and bonding method using the same
- Patent number 9,512,335
- Issue date Dec 6, 2016
- Dai Nippon Printing Co., Ltd.
- Kentaro Hoshi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, adhesion method using the same, laminate and...
- Patent number 9,029,462
- Issue date May 12, 2015
- Bridgestone Corporation
- Takuya Ogasawara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Adhesive for electronic component
- Patent number 7,838,577
- Issue date Nov 23, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low out-gassing room temperature curable rubbery polymer, preparati...
- Patent number 7,723,441
- Issue date May 25, 2010
- Corning Incorporated
- Paul John Shustack
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for making pressure sensitive adhesive tapes from cationic...
- Patent number 7,700,151
- Issue date Apr 20, 2010
- Henkel AG & Co. KGaA
- Charles W. Paul
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pressure sensitive adhesive tapes from cationic cure adhesives
- Patent number 7,521,116
- Issue date Apr 21, 2009
- Henkel AG & Co. KGaA
- Charles W. Paul
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Non-aqueous solvent-free process for making UV curable adhesive and...
- Patent number 6,903,144
- Issue date Jun 7, 2005
- Kraton Polymers US LLC
- James R. Erickson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Radiation curable adhesive
- Patent number 6,803,081
- Issue date Oct 12, 2004
- National Starch and Chemical Investment Holding Corporation
- Charles W. Paul
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adhesive composition and adhesive sheet for semiconductor devices
- Patent number 6,617,021
- Issue date Sep 9, 2003
- Tomoegawa Paper Co., Inc.
- Masaharu Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Formulation for strippable adhesive and coating films and high perf...
- Patent number 6,541,553
- Issue date Apr 1, 2003
- Kraton Polymers US LLC
- James Robert Erickson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hot-melt adhesive composition excellent in heat resistance and cold...
- Patent number 5,973,056
- Issue date Oct 26, 1999
- Daicel Chemical Industries, Ltd.
- Yoshihiro Ohtsuka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Telechelic polymers and heterotelechelic polydiene block polymers w...
- Patent number 5,948,863
- Issue date Sep 7, 1999
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesives and sealants based on telechelic polymers and heterotelec...
- Patent number 5,910,542
- Issue date Jun 8, 1999
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Telechelic polymers and heterotelechelic polydiene block polymers w...
- Patent number 5,910,541
- Issue date Jun 8, 1999
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Telechelic and heterotelechelic polymers with dual curing agents
- Patent number 5,880,217
- Issue date Mar 9, 1999
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Non-aqueous solvent free process for making UV curable adhesives an...
- Patent number 5,837,749
- Issue date Nov 17, 1998
- Shell Oil Company
- James Robert Erickson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesives and sealants based on telechelic polymers and heterotelec...
- Patent number 5,804,657
- Issue date Sep 8, 1998
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Non-aqueous solvent free process for making UV curable adhesives an...
- Patent number 5,776,998
- Issue date Jul 7, 1998
- Shell Oil Company
- Jeffrey George Southwick
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pressure sensitive structural adhesives and sealants based on telec...
- Patent number 5,721,318
- Issue date Feb 24, 1998
- Shell Oil Company
- David John St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-free laminating adhesive composition
- Patent number 5,641,823
- Issue date Jun 24, 1997
- Shell Oil Company
- Michael Alan Masse
- B32 - LAYERED PRODUCTS
Information Patent Grant
Telechelic polymers and heterotelechelic polydiene block polymers w...
- Patent number 5,576,388
- Issue date Nov 19, 1996
- Shell Oil Company
- David J. St. Clair
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-free laminating adhesive composition
- Patent number 5,516,824
- Issue date May 14, 1996
- Shell Oil Company
- Michael A. Masse
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Adhesives Comprising Cyclic Imide Addition-Fragmentation And Adhesi...
- Publication number 20250011633
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Amanda K. Leone
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VEGETABLE OIL-DERIVED EPOXY COMPOSITIONS HAVING IMPROVED PERFORMANCE
- Publication number 20240327566
- Publication date Oct 3, 2024
- Washington State University
- Jinwen ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...
- Publication number 20240279517
- Publication date Aug 22, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Kenji TOKUHISA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
- Publication number 20240141094
- Publication date May 2, 2024
- ADEKA CORPORATION
- Kohei HIRAYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE
- Publication number 20240141095
- Publication date May 2, 2024
- ADEKA CORPORATION
- Keisuke OTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VEGETABLE OIL-DERIVED EPOXY COMPOSITIONS HAVING IMPROVED PERFORMANCE
- Publication number 20210371579
- Publication date Dec 2, 2021
- Washington State University
- Jinwen ZHANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ENDOSCOPE, CURED PRODUCT, ENDOSCOPE, AND METHOD FOR PR...
- Publication number 20210007579
- Publication date Jan 14, 2021
- FUJIFILM CORPORATION
- Kazushi FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM
- Publication number 20180079939
- Publication date Mar 22, 2018
- DEXERIALS CORPORATION
- Kenji KUBOTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES
- Publication number 20140349109
- Publication date Nov 27, 2014
- State of Oregon acting by and through the State Board of Higher Education of...
- Kaichang Li
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION, ADHESION METHOD USING THE SAME, LAMINATE AND...
- Publication number 20140048194
- Publication date Feb 20, 2014
- BRIDGESTONE CORPORATION
- Takuya Ogasawara
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADHESIVE SHEET AND BONDING METHOD USING THE SAME
- Publication number 20120288659
- Publication date Nov 15, 2012
- Dai Nippon Printing Co., Ltd.
- Kentaro Hoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE MICROELECTRONICS ADHESIVE
- Publication number 20100219526
- Publication date Sep 2, 2010
- RUSSELL STAPLETON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
- Publication number 20100197830
- Publication date Aug 5, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE MICROELECTRONICS ADHESIVE
- Publication number 20080063873
- Publication date Mar 13, 2008
- RUSSELL STAPLETON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low out-gassing room temperature curabble rubbery polymer, preparat...
- Publication number 20070155850
- Publication date Jul 5, 2007
- Paul John. Shustack
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for making pressure sensitive adhesive tapes from cationic...
- Publication number 20060216521
- Publication date Sep 28, 2006
- Charles W. Paul
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for making pressure sensitive adhesive tapes from cationic...
- Publication number 20040202811
- Publication date Oct 14, 2004
- Charles W. Paul
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Non-aqueous solvent-free process for making uv curable adhesive and...
- Publication number 20040024079
- Publication date Feb 5, 2004
- James R. Erickson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Radiation curable adhesive
- Publication number 20030065048
- Publication date Apr 3, 2003
- Charles W. Paul
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive composition and adhesive sheet for semiconductor devices
- Publication number 20020155286
- Publication date Oct 24, 2002
- Masaharu Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Epoxidised polymerised polyenes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vegetable oil-derived epoxy compositions having improved performance

Adhesive for endoscope, cured product, endoscope, and method for pr...

Epoxy based composition

Semiconductor device manufacturing method and underfill film

Resin composition, adhesive agent, and sealing agent

Laminate, inner liner material and pneumatic tire

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Adhesive sheet and bonding method using the same

Adhesive composition, adhesion method using the same, laminate and...

Adhesive for electronic component

Low out-gassing room temperature curable rubbery polymer, preparati...

Process for making pressure sensitive adhesive tapes from cationic...

Pressure sensitive adhesive tapes from cationic cure adhesives

Non-aqueous solvent-free process for making UV curable adhesive and...

Radiation curable adhesive

Adhesive composition and adhesive sheet for semiconductor devices

Formulation for strippable adhesive and coating films and high perf...

Hot-melt adhesive composition excellent in heat resistance and cold...

Telechelic polymers and heterotelechelic polydiene block polymers w...

Adhesives and sealants based on telechelic polymers and heterotelec...

Telechelic polymers and heterotelechelic polydiene block polymers w...

Telechelic and heterotelechelic polymers with dual curing agents

Non-aqueous solvent free process for making UV curable adhesives an...

Adhesives and sealants based on telechelic polymers and heterotelec...

Non-aqueous solvent free process for making UV curable adhesives an...

Pressure sensitive structural adhesives and sealants based on telec...

Solvent-free laminating adhesive composition

Telechelic polymers and heterotelechelic polydiene block polymers w...

Solvent-free laminating adhesive composition

Patents Applicationslast 30 patents

Adhesives Comprising Cyclic Imide Addition-Fragmentation And Adhesi...

VEGETABLE OIL-DERIVED EPOXY COMPOSITIONS HAVING IMPROVED PERFORMANCE

ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...

CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE

CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE

VEGETABLE OIL-DERIVED EPOXY COMPOSITIONS HAVING IMPROVED PERFORMANCE

ADHESIVE FOR ENDOSCOPE, CURED PRODUCT, ENDOSCOPE, AND METHOD FOR PR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM

PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES

ADHESIVE COMPOSITION, ADHESION METHOD USING THE SAME, LAMINATE AND...

ADHESIVE SHEET AND BONDING METHOD USING THE SAME

FLEXIBLE MICROELECTRONICS ADHESIVE

ADHESIVE FOR ELECTRONIC COMPONENT

FLEXIBLE MICROELECTRONICS ADHESIVE

Low out-gassing room temperature curabble rubbery polymer, preparat...

Process for making pressure sensitive adhesive tapes from cationic...

Process for making pressure sensitive adhesive tapes from cationic...

Non-aqueous solvent-free process for making uv curable adhesive and...

Radiation curable adhesive

Adhesive composition and adhesive sheet for semiconductor devices