Number | Name | Date | Kind |
---|---|---|---|
4322737 | Sliwa, Jr. | Mar 1982 | |
4500945 | Lipschutz | Feb 1985 | |
4654966 | Kohara et al. | Apr 1987 | |
4709301 | Yamaguti | Nov 1987 | |
4724611 | Hagihara | Feb 1988 | |
4987478 | Braun et al. | Jan 1991 | |
5098609 | Iruvanti et al. | Mar 1992 | |
5155661 | Nagesh et al. | Oct 1992 | |
5168344 | Ehlert et al. | Dec 1992 | |
5177667 | Graham et al. | Jan 1993 | |
5239200 | Messina et al. | Aug 1993 | |
5294830 | Young et al. | Mar 1994 | |
5304969 | Jacobowitz et al. | Apr 1994 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, "Semiconductor Encapsulation", Magdo. |
IBM Technical Disclosure Bulletin, vol. 27, No. 4A, Sep. 1984, "Heat Sink For Thermal Conduction Module", Gruber et al. |