with bolts or screws

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H01L23/4006

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4006with bolts or screws

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,923
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 12,347,746
- Issue date Jul 1, 2025
- AURAS TECHNOLOGY CO., LTD.
- Cheng-Ju Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,078
- Issue date Jun 24, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal spreader including ringframe and thermal straps for thermal...
- Patent number 12,322,674
- Issue date Jun 3, 2025
- Raytheon Company
- Keith R. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for processor loading mechanisms
- Patent number 12,315,780
- Issue date May 27, 2025
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Error-unlocking protection structure for heat dissipation base seat
- Patent number 12,300,572
- Issue date May 13, 2025
- Asia Vital Components (China) Co., Ltd.
- Xue-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat dissipation fastener structure
- Patent number 12,272,617
- Issue date Apr 8, 2025
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power transistor conversion device
- Patent number 12,255,541
- Issue date Mar 18, 2025
- ELMATEK INTERNATIONAL CORP.
- Steven Po-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power conversion apparatus
- Patent number 12,199,010
- Issue date Jan 14, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Hayata Onaga
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic apparatus
- Patent number 12,199,009
- Issue date Jan 14, 2025
- Kioxia Corporation
- Kazuyuki Matsuzaki
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND POWER CONVERTER
- Publication number 20250233080
- Publication date Jul 17, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Shibo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION
- Publication number 20250226280
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BASE, SEMICONDUCTOR MODULE, AND ENERGY CONVERSION...
- Publication number 20250226286
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Ryo NOMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20250183131
- Publication date Jun 5, 2025
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC MEMBER AND ELASTIC DEVICE
- Publication number 20250174519
- Publication date May 29, 2025
- Mitsubishi Steel Mfg. Co., Ltd
- Yasuhiro MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...
- Publication number 20250167073
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...
- Publication number 20250157884
- Publication date May 15, 2025
- ZTE Corporation
- Cheng TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20250140610
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
- Publication number 20250112143
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250105092
- Publication date Mar 27, 2025
- Panasonic Automotive Systems Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250105091
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Kazuyuki MATSUZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250014966
- Publication date Jan 9, 2025
- xFusion Digital Technologies Co., Ltd
- Shuimu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20240429113
- Publication date Dec 26, 2024
- MEDIATEK INC.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS

with bolts or screws

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Package and method for manufacturing the same

Semiconductor device

Heat dissipation device

Systems and methods for power module for inverter for electric vehicle

Semiconductor device and manufacturing method thereof

Semiconductor device

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Thermal spreader including ringframe and thermal straps for thermal...

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Vapor chamber heat spreader for bare die processors

Technologies for processor loading mechanisms

Error-unlocking protection structure for heat dissipation base seat

Integrated circuit package and method

Systems and methods for cooling system and power module for inverte...

Semiconductor device

Systems and methods for parameter drift correction for inverter for...

Heat dissipation fastener structure

Systems and methods for cooling system and power module for inverte...

Power transistor conversion device

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

System, device and methods of manufacture

Electronic module comprising a semiconductor package with integrate...

Systems and methods for integrated gate driver for inverter for ele...

Power conversion apparatus

Systems and methods for non-overlap enforcement for inverter for el...

Electronic apparatus

Patents Applicationslast 30 patents

POWER MODULE AND POWER CONVERTER

PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION

HEAT DISSIPATION BASE, SEMICONDUCTOR MODULE, AND ENERGY CONVERSION...

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

ELASTIC MEMBER AND ELASTIC DEVICE

Assemblage module 3D

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...

CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...

System, Device and Methods of Manufacture

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

POWER CONVERSION APPARATUS

ELECTRONIC APPARATUS

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

COOLING SYSTEM BLOCK ASSEMBLY

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

ELECTRONIC DEVICE AND SERVER

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LIDDED SEMICONDUCTOR PACKAGE