Advanced ceramic heater for substrate processing

Abstract

Susceptors are provided that employ layers of CTE-matching materials to reduce the stresses that otherwise lead to cracking and failure. Exemplary CTE-matching materials include metal alloys of aluminum and silicon that can be tailored to specific CTE values by adjusting the ratio of the elements. An exemplary susceptor comprises a CTE-matching material that accommodates the differences in the CTEs of a ceramic material and a thermal barrier layer disposed on opposite sides of the CTE-matching material. Methods are also provided for forming susceptors. These methods comprise assembling the components and bonding the assembly together, such as by diffusion bonding, to produce a susceptor that is a monolithic body.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-section of a susceptor according to an exemplary embodiment of the invention.

FIG. 2 illustrates a cross-section of a susceptor according to another exemplary embodiment of the invention.

FIG. 3 illustrates an exploded a cross-section of the embodiment of FIG. 2 to illustrate a method of forming a susceptor according to an exemplary embodiment of the invention.

FIG. 4 illustrates a cross-section of an electrostatic chuck according to an exemplary embodiment of the invention.

Claims

1. A susceptor comprising: a substrate support member including a ceramic material having a first coefficient of thermal expansion;a shaft including a chamber mount and a thermal barrier layer having a second coefficient of thermal expansion; anda CTE-matching layer disposed between the ceramic material and the chamber mount, bonded to the ceramic material, and having a third coefficient of thermal expansion between the first and second coefficients of thermal expansion, the thermal barrier layer being disposed between the chamber mount and the CTE-matching layer.

2. The susceptor of claim 1 wherein the thermal barrier layer is bonded to the CTE-matching layer.

3. The susceptor of claim 1 wherein the thermal barrier layer comprises aluminum oxide.

4. The susceptor of claim 1 wherein the ceramic material of the substrate support member comprises aluminum nitride.

5. The susceptor of claim 1 wherein the ceramic material of the substrate support member is selected from the group consisting of boron nitride, magnesium oxide, and quartz.

6. The susceptor of claim 1 wherein the chamber mount comprises aluminum.

7. The susceptor of claim 1 wherein the CTE-matching layer comprises an aluminum-silicon alloy.

8. The susceptor of claim 1 wherein the CTE-matching layer comprises a metal alloy.

9. The susceptor of claim 8 wherein the metal alloy is selected from the group consisting of copper-tungsten alloys and copper-molybdenum alloys.

10. The susceptor of claim 1 wherein the CTE-matching layer comprises a metal matrix composite.

11. The susceptor of claim 10 wherein the metal matrix composite comprises aluminum-silicon carbide.

12. The susceptor of claim 10 wherein the metal matrix composite is selected from the group consisting of aluminum-graphite, magnesium-graphite, or copper-graphite.

13. The susceptor of claim 1 wherein the CTE-matching layer is composed of a first sublayer having a first sublayer coefficient of thermal expansion and a second sublayer having a second sublayer coefficient of thermal expansion and wherein the first sublayer coefficient of thermal expansion is between the first coefficient of thermal expansion of the substrate support member and the second sublayer coefficient of thermal expansion, andthe second sublayer coefficient of thermal expansion is between the second coefficient of thermal expansion of the shaft and the first sublayer coefficient of thermal expansion.

14. The susceptor of claim 1 wherein the ceramic material comprises a surface layer of the substrate support, and CTE-matching material comprises a body of the substrate support.

15. The susceptor of claim 1 wherein the CTE-matching material comprises a portion of the shaft.

16. The susceptor of claim 1 wherein the substrate support member further includes a dielectric plate comprising the ceramic material and having an electrode disposed therein, andthe CTE-matching layer.

17-28. (canceled)