Claims
- 1. A substrate processing system comprising:
- a) a processing chamber for processing a substrate inserted therein upon a blade horizontally movable into a processing area of said chamber;
- b) a vertically movable centering support;
- c) a plurality of centering members attached to said support and extending vertically therefrom, each said centering member having
- i) an inner vertically extending side, and
- ii) a centering feature disposed on a top of said centering member and having an inner inclined surface extending inwardly and downwardly to said vertically extending side; and
- d) a substrate support vertically movable with respect to said centering support for supporting said substrate centered by said centering features.
- 2. A substrate processing system according to claim 1 wherein each said centering feature further comprises an outer inclined surface extending downward and outwardly from said inner inclined surface; and
- wherein said system further comprises a frame having an inwardly extending lip engageable with a periphery of said substrate and having at least one inclined surface extending downwardly and outwardly from said lip, and slidingly engaging said outer inclined surface of said centering feature.
- 3. A substrate processing system according to claim 1 further comprising a plurality of support members vertically slidable in said substrate support, having lower ends engageable with said centering support, and having a length such that, when their lower ends engage said centering support, upper support surfaces thereof receive and support said substrate centered by said centering features.
- 4. A substrate process system according to claim 3 wherein said support members have heads wherein said upper support surfaces are larger than the diameter of the lower ends thereof and wherein said substrate support member has recesses to receive said heads without protruding therefrom.
Parent Case Info
This is a continuation of U.S. application Ser. No. 08/462,442, filed Jun. 5, 1995, now abandoned, which is a continuation of U.S. application Ser. No. 08/313,501 filed Sep. 26, 1994, now abandoned, which is a continuation of U.S. application Ser. No. 08/010,890 filed Jan. 28, 1993, now U.S. Pat. No. 5,352,294.
US Referenced Citations (4)
Foreign Referenced Citations (1)
Number |
Date |
Country |
425779 |
Sep 1991 |
EPX |
Non-Patent Literature Citations (1)
Entry |
Joint Development Agreement Between Applied Materials, Inc. (Applicant's Assignee) and two unrelated companies (Companies A & B), dated May 29, 1991 (Exhibit A hereto). |
Continuations (3)
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Number |
Date |
Country |
Parent |
462442 |
Jun 1995 |
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Parent |
313501 |
Sep 1994 |
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Parent |
10892 |
Jan 1993 |
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