Patent Application
20240167125
The present invention relates to an alloy material for probe pins (hereinafter referred to as “probe material”) for inspecting the electrical characteristics of an integrated circuit on a semiconductor wafer, a liquid crystal display device, or the like.
For inspection of the electrical characteristics of an integrated circuit formed on a semiconductor wafer, a liquid crystal display device, or the like, a socket or a probe card in which a plurality of probes are incorporated has been used. This inspection is performed by bringing probe pins incorporated in the socket or the probe card into contact with an electrode, a terminal, or a conductive portion of the integrated circuit, the liquid crystal display device, or the like.
Such probe pins are required to have low contact resistance and hardness enough to withstand repeated contact. For example, a beryllium-copper alloy, tungsten, a tungsten alloy, a platinum alloy, or a palladium alloy is used as a probe material.
In U.S. Pat. No. 1,935,897 A, there is a disclosure of a palladium alloy (hereinafter referred to as “AgPdCu alloy”) composed of not less than 16% and not more than 50% copper, palladium ranging from about 35% to about 59%, and silver to the extent of not less than 4%.
[PTL 1] U.S. Pat. No. 1,935,897 A
The AgPdCu alloy, which has excellent plastic workability and is precipitation-hardened, has been used as the probe material because of its shape stability resulting from its hardness and low specific resistance characteristics. However, the following problem has been found when such probe material is used on a circuit connecting portion where solder (e.g., Sn—Bi-based solder) is used. During inspection, a probe pin and the solder are repeatedly brought into contact with each other, and an electrical current flows therebetween. As a result, a solder component such as Sn and a component of the probe material interdiffuse due to the resulting Joule heat or the like, and a tip end of the probe pin tends to be rapidly consumed. In such case, contact resistance varies suddenly or over time, resulting in the occurrence of an inspection defect. Accordingly, cleaning or exchange of a tip end portion of the probe pin to be brought into contact is required, and there has been a problem in that the operating rate of an inspection step is reduced.
In view of the foregoing, there is a strong demand for development of a probe material having solder resistance sufficient to suppress the diffusion of the solder component.
An object of the present invention is to provide a probe material that can suppress the diffusion of components between solder in a circuit connecting portion of an inspection target and the probe material during probe inspection.
The inventors of the present invention have discovered a probe material consisting of 15 mass % to 60 mass % of Pd, 3 mass % to 79.9 mass % of Cu, and 0.1 mass % to 75 mass % of Ni and/or Pt, and thus completed the present invention.
According to the present invention, a probe material can be provided that suppresses diffusion of components between solder in a circuit connecting portion of an inspection target and the probe material itself during inspection.
The present invention is directed to a probe material consisting of 15 mass % to 60 mass % of Pd, 3 mass % to 79.9 mass % of Cu, and 0.1 mass % to 75 mass % of Ni and/or Pt. When both Ni and Pt are included, the total content thereof is from 0.1 mass % to 75 mass %.
Pd has excellent corrosion resistance. However, when the content of Pd is less than 15 mass %, its corrosion resistance becomes insufficient. Meanwhile, when the content of Pd is more than 60 mass %, it is not suitable because diffusion of components between solder and the probe material cannot be sufficiently suppressed.
As another aspect, the content of Pd may be from 17 mass % to 55 mass %. In addition, in another aspect, the content of Pd may be from 20 mass % to 50 mass %.
Cu has low specific resistance, and in addition, when alloyed with Pd, it has the effect of enhancing hardness. Meanwhile, when Cu is added in a large amount, the corrosion resistance is reduced. Accordingly, when the content of Cu is less than 3 mass %, sufficient hardness is not obtained, and when the content of Cu is more than 79.9 mass %, the corrosion resistance is reduced.
As another aspect, the content of Cu may be from 5 mass % to 74 mass %.
When alloyed with Ni and/or Pt, the alloy exhibits improved solder resistance. According to experiments, when the content of Ni and/or Pt is less than 0.1 mass %, it is not suitable because diffusion of components between the solder and the probe material cannot be sufficiently suppressed. Furthermore, when the content of Ni and/or Pt is more than 75 mass %, it is not suitable because the specific resistance is increased.
As another aspect, the content of Ni and/or Pt may be from 0.3 mass % to 70 mass %. When both Ni and Pt are included, the total content thereof may be from 0.3 mass % to 70 mass %. In addition, as another aspect, the content of Ni and/or Pt may be from 0.5 mass % to 65 mass %. When both Ni and Pt are included, the total content thereof may be from 0.5 mass % to 65 mass %.
For the alloy of the present invention, it is critical to suppress a phenomenon in which a tip end of a probe pin is consumed due to diffusion of components between the solder and the probe material. The alloy of the present invention is not required to have hardness as high as that of the conventional AgPdCu alloy. The solder (e.g., Sn—Bi-based solder) with which the probe pin is brought into contact has relatively low hardness. Therefore, a hardness of 200 HV or more is sufficient for the probe material.
In the alloy of the present invention, it is presumed that diffusion of components between the solder and the probe material is suppressed for the following reason. Specifically, Ni and/or Pt added to the probe material forms a thin and dense intermetallic compound layer of, for example, Sn—Ni and/or Sn—Pt at an interface where the solder and the probe pin are brought into contact with each other. This intermetallic compound layer exhibits a preventing effect on the diffusion of components between the solder and the probe material, and thus suppresses easy consumption of the tip end of the probe pin.
Examples of the present invention are described. The compositions and respective characteristics of alloys of Examples and Comparative Examples are shown in Table 1.
First, elements Pd, Cu, Ni, and Pt were mixed so as to achieve the compositions shown in Table 1. The mixture was then melted in an argon atmosphere by an arc melting method to produce alloy ingots.
The alloy ingots were each repeatedly subjected to rolling and heat treatment to produce sheet materials having a target reduction ratio of 75%. The reduction ratio of the sheet materials was calculated using the formula: [(Initial Thickness before Rolling and Heat Treatment−Final Thickness after Rolling and Heat Treatment)/Initial Thickness before Rolling and Heat Treatment]×100. Each of the resulting sheet materials was then used as a test piece for evaluation of hardness and solder resistance. In addition, other sheet materials were produced so as to have a reduction ratio of 90%. The reduction ratio of the additional sheet materials was calculated using the same formula. Each of the additional sheet materials was then used as a test piece for evaluation of specific resistance.
The test pieces of the alloys having been produced were each subjected to the following evaluations. The evaluation results are shown in Table 2.
The hardness at the center of each test piece's cross section was measured using a micro Vickers hardness tester under the conditions of a load of 200 gf and a holding time of 10 seconds.
The solder resistance was evaluated as described below. Sn—Bi-based solder was placed on each test piece of the alloy having been produced, and the solder was melted onto the test piece through heat treatment in a N2 atmosphere under the conditions of 250° C. and 1 hour. After the heat treatment, the test piece was embedded in a resin and a cross section thereof was exposed. At the interface between the solder and the test piece, Sn from the solder and Pd from the alloy interdiffused to form a layer where both Sn and Pd coexist. This layer was regarded as a diffusion layer. The interface between the solder and the test piece was then subjected to line analysis in a vertical direction using an EPMA, and the thickness of the diffusion layer was measured.
It was judged that, as the thickness of the diffusion layer having been measured was smaller, the solder resistance was higher. The evaluation was performed as follows: an alloy forming a diffusion layer having a thickness of less than 100 μm was indicated by Symbol “∘∘”; an alloy forming a diffusion layer having a thickness of from 100 μm to 200 μm was indicated by Symbol “∘”; an alloy forming a diffusion layer having a thickness of from 200 μm to 500 μm was indicated by Symbol “Δ”; and an alloy forming a diffusion layer having a thickness of more than 500 μm was indicated by Symbol “x”. The evaluation results are shown in Table 2. The case in which the thickness of the diffusion layer was 800 μm or more was unambiguously described as “800 μm” because the diffusion layer was formed in almost the entirety of the solder having been tested.
The electrical resistance of each test piece was measured at room temperature, and the specific resistance (electric resistivity) thereof was calculated according to Equation 1.
Specific Resistance=(Electrical Resistance×Cross-Sectional Area)/Measurement Length Equation 1:
It is found from the above-mentioned results that the alloys produced according to the present invention each have high solder resistance, and also have hardness and specific resistance required for a probe material. Consequently, according to the present invention, the material suitable as a probe material having solder resistance can be provided.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-053271 | Mar 2021 | JP | national |
| 2022-019210 | Feb 2022 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/012690 | 3/18/2022 | WO |
