Apparatus and foam electroplating process

Abstract
An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency. Further increases in plating efficiency are provided by shifting current density from higher plating zones to lower plating zones.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a schematic depiction of a continuous vertical foam plater apparatus in accordance with the prior art.



FIG. 2 is a schematic depiction of the flow of electrolyte in and around a vertically oriented foam strip in accordance with the prior art. A mass transfer graph indicates relative flow velocity and nickel concentration inside and outside of the foam.



FIG. 3 is a schematic depiction of the flow of electrolyte in and around an inclined foam strip. A mass transfer graph indicates relative flow velocity and nickel concentration inside and outside of the foam.



FIG. 4 is a schematic depiction of a continuous vertical foam plater apparatus incorporating a vertically oriented anode, an inclined foam cathode strip portion and an inclined anode.



FIG. 5 is a schematic depiction of a continuous vertical foam plater apparatus incorporating a vertically oriented anode, an inclined foam cathode strip portion, and a tapered anode having a triangular longitudinal cross-section.



FIG. 6 is a schematic depiction of a continuous vertical foam plater apparatus incorporating an inclined foam cathode strip portion interposed between two vertically oriented anodes, and further interposed between two current reducing masks.





DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Optimization of natural convection through the interstices of a foam matrix results in a more efficient electroplating process and a metal foam having more uniform deposition of metal throughout its structure. Accordingly, the techniques disclosed herein advantageously allow increased strength of the finished material, as well as more uniform surface and interior structure, increased tensile strength, dimensional stability, wear resistance, and corrosion resistance.


Natural convection of electrolyte solution through the interstices of a foam matrix is optimized during electroplating by inclining or tilting the foam cathode in a plater. FIG. 3 schematically illustrates laminar flow of electrolyte through an inclined foam cathode F′. Electrolyte motion and currents are depicted as arrows E′. As electrolyte solution contacts the cathode F′, as can be seen from the mass transfer graph, electrolyte is depleted in the area closest to the foam F′, leading to a zone of lower density. The depleted, lower density electrolyte establishes a diagonal flow up across the foam F′ and then upwards along the upper foam surface, while new, concentrated electrolyte is introduced from beneath the foam. In contrast to vertically oriented foam F where depleted electrolyte remains inside the foam and has a slow, laminar flow upwards inside the foam strip (see, e.g., FIG. 2), the depleted electrolyte has a lower dwell time in the foam F′ since it more readily exits the opposing side of the foam, thus establishing a laminar flow zone of depleted electrolyte DE above the upper surface of the foam F′. In this manner, the electrolyte is replenished within the foam more efficiently. Moreover, rapid transport of the electrolyte through the foam F′ minimizes the diffusion layer thickness. Accordingly, the techniques disclosed herein provide improved plating conditions inside the foam F′, improved product quality and faster plating. Since there is no mechanical agitation needed to achieve these effects, a more uniform deposition rate is provided.


The angle required for inducing net flow across the thickness of the foam may range from about 1 to about 45 degrees, e.g., from about 2 to about 30 degrees and preferably ranges between about 10 to about 20 degrees. The angle is advantageously closer to vertical since the depleted, lower density electrolyte solution forms a more laminar flow upwards, creating a better pressure differential and flow rate across the foam than a more horizontal angle, which leads to a more turbulent flow of the depleted electrolyte. Turbulent flow results in more rapid mixing and dissipation of the low-density electrolyte emerging from a more horizontally positioned foam (e.g., greater than about 45 degrees) and actually results in diminished driving force for the flow across the foam compared to an electrode positioned closer to vertical. Other advantages of the present invention are that the simplicity and serviceability of a vertical plater are retained compared to a horizontal plater and productivity per unit of plant area is better than either a vertical or a horizontal plating apparatus.


In another aspect, an inclined foam plating system optionally incorporates techniques for redistributing current density from the top of the plating zone to areas below. In this manner, local excess current densities are avoided and a more uniform product is obtained. Foams plated at high current densities tend to have a non-uniform thickness profile, e.g., a high DTR. In a typical vertical foam plater, e.g., see FIG. 1, the energy to the deeper parts of the foam is supplied through the partially plated foam, whose density and conductivity decreases from top to bottom. Thus, energy supply to the deepest zones of the plater is restricted by the poor conductivity of the foam. Accordingly, the deep zones operate at low current densities and contribute little to the overall production rate. The top-plating zone(s) actually receives the highest current density and plates at the highest rate. The overall current density is therefore limited by the fact that the top zone(s) reaches a maximum safe plating rate before the lower zones, thus restricting further productivity increases even though the lower zones are capable of handling higher current densities.


In one embodiment, the electrolyte gap is increased at the top of the plater relative to the bottom. This produces a higher electrolyte voltage (IR) drop in the upper zone to reduce current density there while increasing current density in the lower zone with a narrower electrolyte gap and a smaller IR drop. The electrolyte gap is increased by increasing the distance between the cathode and the anode near and at the top of the plater relative to the bottom. The tapered electrolyte gap can be obtained by supporting one or more anodes in an inclined position relative to the cathode or by making one or more anodes wider at one end than at the other. FIG. 4 provides a schematic example of a continuing plater apparatus 10 for plating a continuous foam strip 12 incorporating an inclined foam cathode portion 14, a vertically oriented anode 16 and a further inclined anode 18. The inclined anode is supported by a support member 19. Anode 16 is held in place by another support member (not shown). The inclined foam cathode portion 14 is inclined at an intermediate angle, dividing the gap between the vertical anode 16 and the inclined anode 18. Those skilled in the art can determine optimum angles of incline which may be dependent, e.g., upon energy cost since the redistribution of current density involves an increase in voltage. Significant current redistribution can be achieved by an anode-to-anode gap varying from, e.g., about 5 cm at the bottom of the plating zone to between about 8-10 cm at the top. This results in a foam angle of between about 1-2 degrees when the vertical anode 16 is in fact vertical. Greater or lesser comparative angles of the foam relative to the anode(s) may be obtained by orienting the vertical anode 16 in a non-vertical configuration. Although a variable gap can be utilized to result in advantageous redistribution of current, it is also contemplated that, in certain embodiments, the anode(s) is oriented substantially parallel to the foam to create a uniform gap between the anode(s) and the foam. Indeed, anodes disposed on either side of the foam can be substantially parallel to each other and the foam, thus creating a uniform gap between the anodes and the foam. As used herein, “substantially” is intended to mean both “precisely” and “nearly.” In another embodiment, depicted schematically in FIG. 5, a continuing plater apparatus 100 for plating a continuous foam strip 102 incorporating an inclined foam cathode portion 104, a vertically oriented anode 106 and a tapered anode 108. The orientation of the tapered anode 108 creates an increased gap at the top of the plating zone. Alternatively, both anodes can be tapered.


In another embodiment for increasing electrolyte resistance at the top of the plater where current is supplied, a current reducing mask is positioned between a foam cathode and the anode(s) in the top plating zone of a plater. The mask is preferably a non-conductive porous sheet which permits electrolyte to pass through, but slows the rate of plating. FIG. 6 schematically illustrates an example of a continuing plater apparatus 200 for plating a continuous foam strip 202 incorporating an inclined foam cathode portion 204, a first vertically oriented anode 206, a second vertically oriented anode 208, a first current reducing mask 210, and optionally, a second current reducing mask 212. The current reducing mask may be made of any suitable material, e.g., a natural material such as cellulosic fiber or asbestos fiber, or a polymeric synthetic material such as a polyolefin, polyester, polytetrafluoroethylene, polystyrene, polyvinylchloride, polyamide and the like. The mask may be in the form of a mesh, perforated sheet, woven fabric or nonwoven fabric. Techniques for fashioning such natural materials and synthetic polymers into mesh or fibers for woven and non-woven fabrics are well known. The electrical current forced through the restricted cross-section of the mask will produce higher IR drop in the upper zone(s) and force more current to the lower zone(s). In a preferred embodiment, the current reducing mask spans less than about 75% of the length of the anode.


Suitable open cell foams for use herein are well known. Those which may be employed include any natural or synthetic polymeric foams such as cellulose, hydroxypropyl cellulose, polyurethanes, including a polyether-polyurethane foam or a polyester polyurethane foam; polyesters, olefin polymers, such as a polypropylene or polyethlyene; vinyl and styrene polymers, polyphenol, polyvinyl chloride and polyamides. These foam substrates may have an average number of pores per inch within a wide range, typically within a range of about 5 to about 100 pores per inch (ppi.). In preferred embodiments the natural or synthetic foam is capable of being vaporized after deposition of the desired metal so that only metal is left at the end of production. In order to electroplate the foam, it must be made at least partially electrically conductive. The foam can be made conductive by any technique known to those skilled in the art, e.g., coating with a latex graphite; electroless plating with a metal such as copper or nickel; coating with an electrically conductive paint or ink containing carbon powder, or a metal powder such as silver powder or copper powder; and vacuum deposition of a metal. It will be understood that non-foam materials may also be employed as substrate materials. Filaments, including fibers or threads, may also serve as a substrate for the deposition of an electroconductive metal. The foam starting material can, however, also be formed from organic materials having electrical conductivity or consist of metal fibers. In the last-mentioned cases the application of an electrically conducting surface layer is not necessary and can be dispensed with. For convenience, all the above materials described in this paragraph will be referred to herein as “foam”.


In general, and by way of example, a plating apparatus for use in accordance with the present disclosure may include a plating tank provided with a means of supply and removal of electrolyte bath; guides to guide pre-plated continuous foam down into the tank and then upward between anodes, e.g., baskets, towards the electrical contacts; a device for transporting foam located above the bath; a device(s) for supplying electrical current to the anode(s) and foam contacts; wherein the foam moving past the anode (or between 2 or more anodes) is inclined from vertical to allow depleted, lower density electrolyte inside the foam to rise and establish a natural convection driven diagonal flow of electrolyte through the foam. In a preferred embodiment, the anodes are positioned around the foam strip to substantially equalize current density distribution as described above, e.g., the electrolyte (foam to anode) gap increases from bottom zone to the top zone or through utilization of a current density reducing mask. In another preferred embodiment, the anodes are positioned such that the gap between the anode facing the upper face of the foam is smaller than the gap relative to the anode facing the lower side of the foam. This increases current density at the upper face of the foam where the electrolyte is more depleted and current efficiency is reduced.


Referring to the example shown in FIG. 4, the strip of conductive foam 12 is fed around a feed roll 20 into an electroplating tank 22. The tank 22 is maintained to a level 24 with a standard electroplating bath 26. The electroplating bath 26 can be any of a number of conventional electroplating baths capable of electroplating a variety of metals. Such metals include, by way of example, nickel, chromium, zinc, copper, tin, lead, iron, gold, silver, platinum, palladium, rhodium, aluminum, cadmium, cobalt, indium, mercury, vanadium, thalium, and gallium. Alloys can be plated in accordance with the present invention, such as brass, bronze, cobalt-nickel alloys, copper-zinc alloys and others. Some metals are not susceptible to electrodeposition from an aqueous medium and require special plating baths. For example, aluminum and germanium are most commonly electrodeposited from an organic bath or a medium of fused salt. All such known electroplating baths are conventional in the art and can be used herein.


The strip of conductive foam 12 is directed into the bath 26 downwardly and makes a turn around a lower immersed idler roll 28. The idler roll 28 may be made of any material inert to the electroplate bath, e.g., plastic. Suitable plastic materials include nylon, polyvinyl chloride, polyethylene and polypropylene. The strip 12 then travels upward from the idler roll 28 to a metal cathode pinch-roller assembly 30, electrically connected to a power source, e.g., by means of a conventional slip ring (not shown). The anodes 16, 18 can be consumable or non-consumable. The cathode foam portion 14 of the strip 12 is passed between the anodes at an angle described above to provide diagonal convection through the cathode foam portion 14. Thus, the cathode foam portion 14 of the strip 12 is plated on both sides and exits the container 22 as plated foam 15. It should be understood that in alternative embodiments, only one anode may be present which would tend to limit plating to one side of the strip 12. In other alternative embodiments, the anodes are maintained at uneven distances from the anode, e.g., closer to one side of the foam than the other, to cause a thicker plated coat on the side of the foam closest to the anode. In this manner, foam strips can be produced that are made to easily coil in the direction of the more lightly plated side.


Referring to the example shown in FIG. 5, the strip of conductive foam 102 is fed around a feed roll 110 into an electroplating tank 112. The tank 112 is maintained to a level 114 with a standard electroplating bath 116. The vertical anode 106 is an essentially rectangular member which can be a basket made of titanium or other valve metal so that it is resistant to corrosion in the electroplating bath. Examples of other valve metals are tantalum, zirconium, niobium, tungsten, and alloys thereof wherein the alloy consists predominantly of at least one of the valve metals. The size of the basket of anode 106 is optimized for a given application. The width of the basket portion facing the inclined cathode foam portion 104 is preferably about the same as the width of the strip 102 of foam being plated. The depth of the basket can be made relational to the current density desired. The tapered anode 108 has a triangular longitudinal cross-section and may also be a basket which is resistant to corrosion. The gap between the cathode foam portion 104 and each of the anode baskets 106 and 108 increases toward the top of the plater.


The strip 102 of conductive foam is directed into the bath 116 downwardly and makes a turn around a lower immersed idler roll 111. The foam cathode portion of the strip 104 then travels upward from the idler roll 111 to a metal cathode pinch-roller assembly 118, electrically connected to a power source, e.g., by means of a conventional slip ring (not shown). As above, the anodes 106 and 108 can be consumable or non-consumable. The cathode foam portion 104 of the strip 102 is passed between the anodes at an angle described above to provide diagonal convection through the portion 104.


Referring to the example shown in FIG. 6, the strip 202 of conductive foam is fed around a feed roll 214 into an electroplating tank 216. The tank 216 is maintained to a level 218 with a standard electroplating bath 220. As above, the electroplating bath 220 can be any of a number of conventional electroplating baths capable of electroplating a variety of metals. The current reducing masks 210 and 212 are shown interposed, respectively between anodes 208 and 206. The strip 202 of conductive foam is directed into the bath 220 downward and makes a turn around a lower immersed idler roll 222. The foam cathode portion of the strip 204 then travels upward from the idler roll 222 to a metal cathode pinch-roller assembly 224, electrically connected to a power source, e.g., by means of a conventional slip ring (not shown). As above, the anodes 206 and 208 can be consumable or non-consumable. The cathode foam portion 204 of the strip is passed between the anodes at an angle described above to provide diagonal convection through the cathode foam portion 204.


Where a preferred porous metal article is made and electroplating of an open-cell foam is involved, the plating is often nickel plating and the resulting porous nickel sheet may generally have a weight within the range, e.g., of from about 300 grams per square meter, up to about 5,000 grams per square meter, of a major face of the article. More typically, this will be a sheet weight within the range of from about 400 to about 2,000 grams per square meter. For very openly porous material, the nickel plating weight will generally be, e.g., between about 1,000 and about 2,000 grams per square meter of the article. In certain embodiments, the anode baskets, for use with the above-described bath, may be filled with consumable nickel chips (not shown).


If desired, the method can also be supplemented by a heat treatment step, following metal deposition, the purpose of which is to remove the polymeric foam substrate material internally present, for example by means of pyrolysis. For example, after the completion of the plating, the resulting metallized article can be washed, dried, and may be thermally treated, e.g., to decompose a polymer core substance. In some instances, the article may be annealed, such as in a reducing or inert atmosphere. Such treatments are well-known in the art. See, e.g., U.S. Pat. No. 4,978,431 the entire contents of which are hereby incorporated by reference. When metal is plated, thermal decomposition may be conducted at a temperature ranging, e.g., from about 500° C. to about 800° C. for up to about 3 hours depending on the plastic foam (polymer) used. Annealing can be carried out by any known methods. For example, in the case of nickel, it may be carried out, e.g., in a hydrogen atmosphere at a temperature ranging from about 800° C. to about 1200° C. for up to about 30 minutes. The heat treatment conditions can also be chosen such that sintering of the deposited metal takes place, so that the structure is even more mechanically strengthened.


In accordance with the provisions of the statute, there is illustrated and described herein specific embodiments of the invention. Various modifications may be made to the examples and embodiments set forth herein without departing from the scope and spirit of the invention which is defined by the appended claims. For example, numerous plating zones can be incorporated by adding additional anodes which are passed by an inclined foam cathode strip. Those skilled in the art will understand that changes may be made in the form of the invention covered by the claims and that certain features of the invention may sometimes be used to advantage without a corresponding use of the other features.

Claims
  • 1. An apparatus for electroplating foam comprising a container, an anode and a cathode, wherein the anode and the cathode are located within the container, the anode including at least one metal for plating the cathode, the cathode including a polymeric foam including an electrically conductive material, wherein the cathode is oriented at an angle of about 1 degree to about 45 degrees relative to vertical.
  • 2. An apparatus for electroplating foam according to claim 1, wherein the cathode is a continuous foam strip which is fed into the container, routed past the anode and out of the container by one or more guides.
  • 3. An apparatus for electroplating foam according to claim 1, further comprising a second anode wherein the foam is positioned between the first and second anodes.
  • 4. An apparatus for electroplating foam according to claim 1, wherein the anode and cathode are substantially parallel.
  • 5. An apparatus for electroplating foam according to claim 1, wherein the anode is oriented substantially vertically within the container.
  • 6. An apparatus for electroplating foam according to claim 1, wherein the anode and cathode have respective ends where electrical current is applied, and the distance between the cathode and the anode is greater at the ends where electrical current is applied than at opposite ends where current is not applied.
  • 7. An apparatus for electroplating foam according to claim 3, wherein the anodes and cathode have respective ends where electrical current is applied, and the distance between the cathode and at least one of the anodes is greater at the ends where electrical current is applied than at opposite ends where current is not applied.
  • 8. An apparatus for electroplating foam according to claim 1, further comprising an electrolyte solution.
  • 9. An apparatus for electroplating foam according to claim 8, wherein the electrolyte solution contains nickel.
  • 10. An apparatus for electroplating foam according to claim 1, wherein the anode is a basket containing nickel.
  • 11. An apparatus for electroplating foam according to claim 6, wherein the anode has a triangular profile.
  • 12. An apparatus for electroplating foam according to claim 7, wherein the second anode is canted to create the greater distance.
  • 13. An apparatus for electroplating foam according to claim 3, wherein the first anode is placed at a closer distance to the cathode than the second anode to increase current density at an upper face of the foam relative to a lower face of the foam.
  • 14. An apparatus for electroplating foam according to claim 3, wherein the second anode is placed at a closer distance to the cathode than the first anode to increase current density at a lower face of the foam relative to an upper face of the foam.
  • 15. An apparatus for electroplating foam according to claim 1, wherein the anode and cathode have respective ends where electrical current is applied, and a porous non-conducting barrier is positioned between the anode and the cathode for reducing current density between the anode and the cathode.
  • 16. An apparatus for electroplating foam according to claim 15, wherein the barrier spans less than about 75% of the length of the anode.
  • 17. A method of electroplating foam comprising providing a container, an anode, a polymeric foam cathode which includes an electrically conductive material, and a solution containing an electrolyte wherein the cathode is located within the container such that upon application of electrical current to the anode and the cathode, the orientation of the cathode causes a diagonal convection route of the electrolyte through the foam; and applying electrical current to the anode and the cathode to electroplate the foam.
  • 18. A method of electroplating foam according to claim 17, wherein the anode is oriented substantially vertically and the cathode is oriented at an angle of about 1 degree to about 45 degrees relative to vertical.
  • 19. A method of electroplating foam according to claim 17, wherein the anode and cathode are substantially parallel.
  • 20. A method of electroplating foam according to claim 17, wherein the cathode is a continuous foam strip which is fed into the container, routed past the anode and out of the container by one or more guides.
  • 21. A method of electroplating foam according to claim 17, further comprising a second anode wherein the foam is positioned between the first and second anodes.
  • 22. A method of electroplating foam according to claim 17, wherein the anode and cathode have respective ends where electrical current is applied, and the distance between the cathode and the anode is greater at the ends where electrical current is applied than at opposite ends where current is not applied.
  • 23. A method of electroplating foam according to claim 21, wherein the anodes and cathode have respective ends where electrical current is applied, and the distance between the cathode and at least one of the anodes is greater at the ends where electrical current is applied than at opposite ends where current is not applied.
  • 24. A method of electroplating foam according to claim 17, wherein the electrolyte solution contains nickel.
  • 25. A method of electroplating foam according to claim 17, wherein the anode is a basket containing nickel.
  • 26. A method of electroplating foam according to claim 17, wherein the anode has a triangular profile.
  • 27. A method of electroplating foam according to claim 23, wherein the second anode is canted to create the greater distance.
  • 28. A method of electroplating foam according to claim 21, wherein the first anode is placed at a closer distance to the cathode than the second anode to increase current density at an upper face of the foam relative to a lower face of the foam.
  • 29. A method of electroplating foam according to claim 28, wherein increased current density at the upper face of the foam causes an increased amount of metal deposition in the vicinity of the upper face compared to the lower face.
  • 30. A method of electroplating foam according to claim 21, wherein the second anode is placed at a closer distance to the cathode than the first anode to increase current density at a lower face of the foam relative to an upper face of the foam.
  • 31. A method of electroplating foam according to claim 30, wherein increased current density at the lower face of the foam causes an increased amount of metal deposition in the vicinity of the lower face compared to the upper face.
  • 32. A method of electroplating foam according to claim 17, wherein the anode and cathode have respective ends where electrical current is applied, and a porous non-conducting barrier is positioned between the anode and the cathode for reducing current density between the anode and the cathode.
  • 33. A method of electroplating foam according to claim 32, wherein the barrier spans less than about 75% of the length of the anode.