Current insulating devices

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CPC
C25D17/008

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/008Current insulating devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low angle membrane frame for an electroplating cell
- Patent number 12,281,402
- Issue date Apr 22, 2025
- Lam Research Corporation
- Frederick Dean Wilmot
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 12,270,120
- Issue date Apr 8, 2025
- Ebara Corporation
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating process method
- Patent number 12,247,311
- Issue date Mar 11, 2025
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 12,227,865
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating shield device and methods of fabricating the same
- Patent number 12,209,323
- Issue date Jan 28, 2025
- Honeywell International Inc.
- James Piascik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for plating and method of plating
- Patent number 12,054,841
- Issue date Aug 6, 2024
- Ebara Corporation
- Kazuma Ideguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 12,024,785
- Issue date Jul 2, 2024
- Maxeon Solar Pte. Ltd.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods for wear-resistant coatings
- Patent number 11,834,752
- Issue date Dec 5, 2023
- Honeywell International Inc.
- Glenn Sklar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plate, plating apparatus, and method of manufacturing plate
- Patent number 11,725,296
- Issue date Aug 15, 2023
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,686,009
- Issue date Jun 27, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board production method and printed wiring board pro...
- Patent number 11,672,082
- Issue date Jun 6, 2023
- Sumitomo Electric Industries, Ltd.
- Junichi Motomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation device and film formation method for metallic coating
- Patent number 11,643,745
- Issue date May 9, 2023
- Toyota Jidosha Kabushiki Kaisha
- Akira Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems
- Patent number 11,608,563
- Issue date Mar 21, 2023
- ASMPT NEXX, INC.
- Arthur Keigler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High resistance virtual anode for electroplating cell
- Patent number 11,608,566
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Wei Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 11,598,018
- Issue date Mar 7, 2023
- SunPower Corporation
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 11,585,007
- Issue date Feb 21, 2023
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of preparing articles by electrodeposition and additive man...
- Patent number 11,560,629
- Issue date Jan 24, 2023
- Modumetal, Inc.
- John D. Whitaker
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,542,624
- Issue date Jan 3, 2023
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for enclosed electroplating chambers
- Patent number 11,542,626
- Issue date Jan 3, 2023
- Honeywell International Inc.
- James Piascik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Masking and sealing system for multi-step surface treatment
- Patent number 11,453,954
- Issue date Sep 27, 2022
- Honeywell International Inc.
- Joseph William Mintzer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,332,838
- Issue date May 17, 2022
- Ebara Corporation
- Gaku Yamasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board production method and printed wiring board pro...
- Patent number 11,330,718
- Issue date May 10, 2022
- Sumitomo Electric Industries, Ltd.
- Junichi Motomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for determining location of power feeding point in electropl...
- Patent number 11,319,642
- Issue date May 3, 2022
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating device
- Patent number 11,280,020
- Issue date Mar 22, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING...
- Publication number 20250188640
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR SETTING FORWARD/BACKWARD MOVEMENT RECIPE FOR SHIELDING B...
- Publication number 20250163601
- Publication date May 22, 2025
- EBARA CORPORATION
- Masayuki FUJIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF PLATING
- Publication number 20250075362
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Naoto TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE FOR GRIPPING A WORKPIECE, METHOD OF MANUFACTURING THE DEVICE...
- Publication number 20250066946
- Publication date Feb 27, 2025
- Atotech Deutschland GmbH & Co. KG
- Ferdinand WIENER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20250051955
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE AND METHOD FOR ELECTROLYTIC TREATMENT OF SUBSTRATES
- Publication number 20240417880
- Publication date Dec 19, 2024
- MECO EQUIPMENT ENGINEERS B.V.
- Augustinus Cornelis Maria VAN DE VEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240301582
- Publication date Sep 12, 2024
- EBARA CORPORATION
- Yohei WAKUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240247394
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240218553
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20240183059
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
- Publication number 20240141541
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230366120
- Publication date Nov 16, 2023
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...
- Publication number 20230313407
- Publication date Oct 5, 2023
- Semsysco GmbH
- Herbert ÖTZLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Distribution System for a Process Fluid for a Chemical and/or Elect...
- Publication number 20230250547
- Publication date Aug 10, 2023
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
- Publication number 20230193502
- Publication date Jun 22, 2023
- Maxeon Solar Pte. Ltd
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20230175162
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230167574
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND ELECTRIC CURRENT FOR CH...
- Publication number 20230075605
- Publication date Mar 9, 2023
- Semsysco GmbH
- Herbert ÖTZLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODE AND APPARATUS FOR ELECTROLYTICALLY TREATING A WORKPIECE,...
- Publication number 20230062477
- Publication date Mar 2, 2023
- Atotech Deutschland GmbH & Co. KG
- Henry KUNZE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...
- Publication number 20230056444
- Publication date Feb 23, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT
- Publication number 20220396894
- Publication date Dec 15, 2022
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS FOR WEAR-RESISTANT COATINGS
- Publication number 20220349083
- Publication date Nov 3, 2022
- Honeywell International Inc.
- Glenn Sklar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW ANGLE MEMBRANE FRAME FOR AN ELECTROPLATING CELL
- Publication number 20220298667
- Publication date Sep 22, 2022
- LAM RESEARCH CORPORATION
- Frederick Dean WILMOT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD PRODUCTION METHOD AND PRINTED WIRING BOARD PRO...
- Publication number 20220240388
- Publication date Jul 28, 2022
- Sumitomo Electric Industries, Ltd.
- Junichi MOTOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220178046
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SHIELD DEVICE AND METHODS OF FABRICATING THE SAME
- Publication number 20220178045
- Publication date Jun 9, 2022
- Honeywell International Inc.
- James PIASCIK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
- Publication number 20220154363
- Publication date May 19, 2022
- EBARA CORPORATION
- Naoki SHIMOMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20220106700
- Publication date Apr 7, 2022
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASKING AND SEALING SYSTEM FOR MULTI-STEP SURFACE TREATMENT
- Publication number 20220106699
- Publication date Apr 7, 2022
- Honeywell International Inc.
- Joseph William Mintzer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Current insulating devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low angle membrane frame for an electroplating cell

Plating apparatus and plating method

Plating apparatus and plating process method

Wafer shielding for prevention of lipseal plate-out

Plating apparatus and method for electroplating wafer

Electroplating shield device and methods of fabricating the same

Method of adjusting plating module

Cross flow conduit for foaming prevention in high convection platin...

Apparatus for plating and method of plating

Dual wafer plating fixture for a continuous plating line

Systems and methods for shielding features of a workpiece during el...

Electroplating systems and methods for wear-resistant coatings

Plate, plating apparatus, and method of manufacturing plate

Regulation plate, anode holder, and substrate holder

Printed wiring board production method and printed wiring board pro...

Film formation device and film formation method for metallic coating

Electrochemical deposition systems

High resistance virtual anode for electroplating cell

Dual wafer plating fixture for a continuous plating line

Cross flow conduit for foaming prevention in high convection platin...

Methods of preparing articles by electrodeposition and additive man...

Electroplating apparatus for tailored uniformity profile

Plating apparatus

Systems and methods for enclosed electroplating chambers

Conductive external connector structure and method of forming

Masking and sealing system for multi-step surface treatment

Plating apparatus

Printed wiring board production method and printed wiring board pro...

Method for determining location of power feeding point in electropl...

Substrate holder and plating device

Patents Applicationslast 30 patents

FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING...

METHOD FOR SETTING FORWARD/BACKWARD MOVEMENT RECIPE FOR SHIELDING B...

APPARATUS FOR PLATING AND METHOD OF PLATING

DEVICE FOR GRIPPING A WORKPIECE, METHOD OF MANUFACTURING THE DEVICE...

METHOD OF ADJUSTING PLATING MODULE

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

DEVICE AND METHOD FOR ELECTROLYTIC TREATMENT OF SUBSTRATES

PLATING APPARATUS

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS

METHOD OF ADJUSTING PLATING MODULE

ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...

PLATING APPARATUS

SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...

Distribution System for a Process Fluid for a Chemical and/or Elect...

DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

PLATING APPARATUS

DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND ELECTRIC CURRENT FOR CH...

ELECTRODE AND APPARATUS FOR ELECTROLYTICALLY TREATING A WORKPIECE,...

ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...

WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT

ELECTROPLATING SYSTEMS AND METHODS FOR WEAR-RESISTANT COATINGS

LOW ANGLE MEMBRANE FRAME FOR AN ELECTROPLATING CELL

PRINTED WIRING BOARD PRODUCTION METHOD AND PRINTED WIRING BOARD PRO...

PLATING APPARATUS AND PLATING METHOD

ELECTROPLATING SHIELD DEVICE AND METHODS OF FABRICATING THE SAME

REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER

PLATING APPARATUS

MASKING AND SEALING SYSTEM FOR MULTI-STEP SURFACE TREATMENT