The present disclosure relates to an apparatus and a method for attaching chips, and more particularly to an apparatus and a method for attaching LED chips.
With the development of modem electronic components toward miniaturization, integration and high reliability, especially facing increasingly fierce market competition, apparatuses for producing and manufacturing electronic products need to be developed to have higher speed, higher precision, more intelligence, multifunction and automation. In recent years, an LED industry faces new challenges in connection with an overall performance of LED attaching devices. The conventional LED attaching devices need to be manually assisted to realize processes of attaching LED chips, resulting in a low working efficiency. As a result, an effect of producing light strings in mass production cannot be achieved.
SUMMARY OF THE DISCLOSURE
In response to the above-referenced technical inadequacies, the present disclosure provides an apparatus for attaching LED chips, which includes a worktable, a plurality of holders, a plurality of wires, an image capturing device, a plurality of LED chips, an electronic device and an attaching device. The holders are mounted on the worktable. The wires include a plurality of first wires and a plurality of second wires. The plurality of first wire segments of each of the first wires wind around each of the holders at a predetermined interval along a longitudinal direction of each of the holders. The plurality of second wire segments of each of the second wires wind around each of the holders at the predetermined interval along the longitudinal direction of each of the holders. The image capturing device is disposed above the worktable and configured to capture an image of the worktable. The LED chips are attached across the first wire and the second wire on the corresponding holder. A predetermined distance between the first wire and the second wire depends on sizes of the LED chips. The electronic device is connected to the image capturing device. The electronic device is configured to provide for inputting the number of the LED chips to be attached across the first wire and the second wire on each of the holders. The electronic device is configured to display the image. The electronic device is configured to analyze, store and display coordinate positions of the two first wire segments of the first wire that are closest to either side of each of the holders, respectively, and the two second wire segments of the second wire that are closest to either side of the holder, respectively, according to a position of capturing the image by the image capturing device, the electronic device is configured to analyze coordinate positions of the LED chips to be attached according to the coordinate positions, the predetermined interval, the predetermined distance and the number of the LED chips. The attaching device is connected to the electronic device and configured to attach the LED chips across the first wire and the second wire according to the coordinate positions.
In addition, the present disclosure provides a method for attaching LED chips, including the following steps: winding first wire segments of a first wire around each of the holders at a predetermined interval along a longitudinal direction of each of the holders, and second wire segments of a second wire around each of the holders at the predetermined interval along the longitudinal direction of each of the holders, wherein a predetermined distance between each of the first wire segments and each of the adjacent second wire segments depends on a size of each of LED chips; mounting the holders on a worktable; using an image capturing device to capture an image of the worktable; storing and displaying the image of the holders, coordinate positions of the two first wire segments that are closest to either side of each of the holders, respectively, and coordinate positions of the two second wire segments that are closest to the either sides of each of the holders, respectively, by using an electronic device; inputting the number of the LED chips to be attached above a surface of each of the holders that faces an attaching device to the electronic device; using the electronic device to analyze coordinate positions of the LED chips to be attached across the first wire and the second wire on the holder, according to the coordinate positions of the two first wire segments and the two second wire segments that are closest to the either sides of the holder, the predetermined interval, the predetermined distance and the number of the LED chips; and using the attaching device to attach the LED chips across the first wire and the second wire according to the coordinate positions of the LED chips.
As described above, the present disclosure provides the apparatus and the method for attaching the LED chips, which apply the attaching device for automatically instead of manually performing the attaching operations of the LED chips. Therefore, the present disclosure can effectively improve position accuracy and production efficiency of the attached LED chips, thereby reducing processing times of the LED chips, so as to achieve an effect of producing high-quality light strings in mass production. These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
The present disclosure will become more fully understood from the following detailed description and accompanying drawings.
The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a”, “an”, and “the” includes plural reference, and the meaning of “in” includes “in” and “on”. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.
The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first”, “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
Reference are made to
As shown in
As shown in
As shown in
The attaching device 70 may include a plurality of feeding guns 71, an actuator 72 and a plurality of chip transporting devices 52. The chip transporting devices 52 may be disposed under the feeding guns 71. The chip transporting devices 52 may transport strips 50 each having the LED chips 51 toward the feeding guns 71 of the attaching device 70 respectively. The actuator 72 may actuate the feeding guns 71 toward the LED chips 51. In the embodiment, the attaching device 70 has the six feeding guns 71, and the six chip transporting devices 52 and the six strips 50 each having the LED chips 51 are disposed correspondingly, but the numbers of the foregoing components are not limited by the present disclosure. After taking one of the LED chips 51 on one section of the strip 50 by the feeding gun 71, the chip transporting device 52 may rewind the one section of the strip 50 and transport other section of the strip 50 having other LED chip 51 toward the feeding gun 71.
The arrangement directions of the LED chips 51 on each of the strip 50 will be exemplified as follows. Reference is made to
Further, the arrangement directions of the positive electrodes and the negative electrodes of the LED chips 51 on the other one or more strips 50 may be the same as that described above, or the arrangement directions may be reversed. In addition or alternatively, reference is
The directions toward which the positive pin and the negative pin of each of the LED chips 51 on each of the strips 50 are disposed depend on (i.e., are the same as) the directions in which the positive pin and the negative pin of each of the LED chips 51 are to be attached across the first wire 31 and the second wire 32. In this way, it is not necessary to rotate the feeding guns 71 by the actuator 72, or flip the holder 10 by the worktable transporting device 12 or an additional actuator before attaching LED chips, thereby saving a time required for attaching the LED chips so as to improve an efficiency of attaching the LED chips.
As shown in
After dispensing the adhesives, the actuator 72 may actuate the feeding guns 71 to move away from the first wire 31 and the second wire 32. For example, the actuator 72 may actuate the feeding guns 71 to move to positions above the strips 50 each having the LED chips 51. Each of the feeding guns 71 may take one of the LED chips 51 from the corresponding chip transporting device 52. For example, a suction nozzle may be disposed at a front end of the muzzle of the feeding gun 71 of the attaching device 70 and connected to a suction device. In practice, each of the feeding guns 71 may obtain the LED chip 51 at a position spaced apart from the LED chip 51, and remain adhered the LED chip 51 at the muzzle of the feeding gun 71 before the LED chip 51 is attached to the first wire 31 and the second wire 32.
The actuator 72 may then actuate the feeding guns 71 of the attaching device 70 to move back to positions above the first wire 31 and the second wire 32. The actuator 72 actuates the feeding guns 71 to move to align the muzzles of the feeding guns 71 to which the LED chips 51 are adhered with the first wire segments of the first wire 31 and the second wire segments of the second wire 32 across which the LED chips 51 are to be attached respectively. The feeding guns 71 may then place positive pins of the LED chips 51 on the conductive adhesives of the first wire 31, and place the negative pins of the LED chips 51 on the conductive adhesives of the second wire 32 respectively, and vice versa. The LED chips 51 may be adhered onto the first wire 31 and the second wire 32 through the conductive adhesives such that the LED chips 51 are securely attached across the first wire segments of the first wire 31 and the second wire segments of the second wire 32 respectively. In the process of attaching the LED chips 51, in addition to moving the feeding guns 71 by the actuator 72, the worktable transporting device 12 may also move the worktable 10 to change relative positions of the feeding guns 71 obtaining the LED chips 51 and the worktable 10 on which the holders 20 each having the first wire 31 and the second wire 32 are carried, thereby improving an efficiency of attaching the LED chips 51.
Further, in order to make a result of attaching the LED chip 51 more suitable for actual requirements, the electronic device such as the computer may be used to control the operation of the attaching device 70 according to the images captured by the image capture device 40. More specifically, the image capturing device 40 may be an image capturing component such as a camera and may be disposed above the worktable 10 for capturing the images of the worktable 10, including the images of the holders 20, and the images of the fire wire 31 and the second wire 32 on each of the holders 20. The processor in the host 63 of the electronic device may analyze the image 41 captured by the image capturing device 40, and the display screen 62 of the electronic device may display the images and an analyzed result, as described in detail below.
Reference is further made to
For example, the image 41 or buttons displayed on the graphical user interface 621 may be clicked to open a window W1. The window W1 has up, down, left, and right arrow graphic buttons. A range in which the image capturing device 40 captures the image 41 may be adjusted by clicking these buttons. A moving speed of the image capturing device 40 may be adjusted through a slider in the window W1 before or during the process of moving the image capturing device 40.
In the process of moving the image capturing device 40, the positioning portions 21 on one side of the holder 20 may be found with reference to the image 41 displayed on the graphical user interface 621. Then, a cross point of a cross line in the image region on the graphical user interface 621 is aligned with a position near a center of the image 41 of the positioning portion 21 by using the inputting element 61 of the electronic device. Then, the button having an “Obtaining coordinate” label in the window W1 is clicked to obtain the coordinate position of the positioning portion 21 of the holder 20. The positioning portion 22 on other side of the holder 20 may also be positioned in the same manner as that of the positioning portion 21 of the holder 20.
The processor in the host 63 of the electronic device such as the computer may store the coordinate positions of the holder 20. The two first wire segments of the second wires 31 respectively closest to the two positioning portions 21 and 22 of the holder 20 and the two second wire segments of the second wires 32 are respectively closest to the two positioning portions 21 and 22 of the holder 20 may be quickly found with reference to the coordinate positions of the positioning portions 21 and 22 on the either sides of the holder 20 during the attaching process. However, it should be understood that the positioning steps of the positioning portions 21 and 22 of the holder 20 may be omitted in practice.
Reference is further made to
In addition, the inputting member 61 of the electronic device may be controlled manually to select or the processor of the host 63 of the electronic device may automatically select specifications of the used feeding guns 71 that match the wire segments respectively from a menu having specification options of the feeding guns 71, according to the positions of the wire segments with respect to the feeding guns 71 of the attaching device 70 and specifications of the LED chips 51 to be attached.
Finally, the buttons in the window are clicked to obtain the coordinate positions of the wire segments respectively. Subsequently, the display screen 62 of the electronic device displays XY coordinate positions of a first mark and a second mark on the graphical user interface 621. The XY coordinate position of the first mark represents the coordinate position of the LED chip 51 to be attached across one of the first wire segments of the first wire 31 that is closest to the positioning portion 21 of the holder 20 and one of the second wire segments of the second wire 32 that is closest to the positioning portion 21 of the holder 20. The XY coordinate position of the second mark represents the coordinate position of the LED chip 51 to be attached across one of the first wire segments of the first wire 31 that is closest to the positioning portion 22 of the holder 20 and one of the second wire segments of the second wire 32 that is closest to the positioning portion 22 of the holder 20.
Optionally, an identifying first mark button or an identifying second mark button may be clicked manually to trigger the processor in the host 63 of the electronic device to compare the positioned image with a stored reference photo of the first wire segment of the first wire 31 and the second wire segment of the second wire 32 to determine whether the positioned image is correct according to a matching ratio. In practice, the above operation may be performed automatically by the processor in the host 63 of the electronic device. For example, if the matching rate is too low, objects in the positioned image may not be the first wire 31 and the second wire 32. Therefore, the first wire 31 and the second wire 32 may be repositioned in the above manner.
After positioning, the processor in the host 63 of the electronic device may control the display screen 62 to display two color blocks 6211 each having a first color on a color block region on the graphical user interface 621. The rightmost block 6211 represents the LED chip 51 to be attached across one of the first wire segments of the first wire 31 that is closest to the positioning portion 21 of the holder 20 and one of the second wire segments of the second wire 32 that is closest to the positioning portion 21 of the holder 20. The leftmost block 6211 represents the other LED chip 51 to be attached across one of the first wire segments of the first wire 31 that is closest to the positioning portion 22 of the holder 20 and one of the second wire segments of the second wire 32 that is closest to the positioning portion 22 of the holder 20.
After positioning the first wire segments of the first wire 31 and the second wire segments of the second wire 32 on either sides of the holder 20, the number of the coordinates of the LED chips 51 that is the number of the LED chips 51 to be attached above the holder 20 is inputted in a window W2 of the graphical user interface 621 by using the inputting element 61 of the electronic device. The number of the LED chips 51 includes or does not include the number of the positioned LED chips 51 in practice.
The processor in the host 63 of the electronic device may analyze the coordinate positions of the other LED chips 51 to be attached across the first wire segments of the first wire 31 and the second wire segments of the second wire 32 that are to be positioned on the holder 20, according to the coordinate positions of the positioned first wire segments of the first wire 31 and the positioned second wire segments of the second wire 32, the predetermined interval between the wire segments of the first wire 31 or the second wire 32, the predetermined distance between the first wire 31 and second wire 32, and the number of the LED chips.
When an offset correction button on the graphical user interface 621 is triggered, the processor in the host 63 of the electronic device may correct errors in the coordinate positions. In addition, chip codes representing the LED chips 51 to be attached may be selected by using the inputting element 61 of the electronic device. The used feeding guns 71 and the specifications of the used feeding guns may be selected according to the number of the LED chips 51 to be attached each time by using the inputting element 61 of the electronic device. For example, one of the six feeding guns 71 is selected as an initial feeding gun for attaching the LED chip 51 represented by the leftmost color block 6211. Then, a manner and an order of attaching the LED chips 51 may be selected by using the inputting element 61 of the electronic device.
Reference is further made to
After the number of the LED chips 51 to be attached is inputted through the inputting element 61 of the electronic device, the processor in the host 63 of the electronic device may accordingly control the display screen 62 to display the color blocks each having the first color in a first color region A1 on the graphical user interface 621. The color block having the first color represents the LED chip 51 to be attached across the first wire 31 and the second wire 32.
The LED chips 51 may be attached across all of the first wire segments of the first wire 31 and all of the adjacent second wire segments of the second wire 32 respectively. Alternatively, the LED chips 51 may be attached across most of the first wire segments of the first wire 31 and most of the adjacent second wire segments of the second wire 32 respectively, but not across the rest of the first wire segments and the rest of the second wire segments.
For example, four rows of the color blocks in the first block region A1 or a second region A2 on the graphical user interface 621 as shown in
After the first attaching process of the LED chips 51 represented by the color blocks 6211 in the first color block region A1 is completed, the worktable transporting device 12 of the worktable 10 may transport the worktable 10 on which the holders 20 are mounted to an outside of the attaching device 70 from a position under the feeding guns 71 of the attaching device 70. The holders 20 may then be removed from the worktable 10, and then the light strings each including the first wire 31, the second wire 32 and the LED chips 51 may be removed from the holders 20.
Each of the LED lamps has the single LED chip in the light strip by performing the above operations. If some or all of the LED lamps require double chips, an actuator of the worktable 10 rotates the worktable 10 and the attaching device 70 attaches the above attaching operation again to attach other LED chips to the LED lamps of the light strip before removing the light strip from the holder 20. The double LED chips 51 of each of the LED lamps may be attached to each other in a back to back manner.
The attached states of the LED chips 51 in a second attaching process are displayed in the second color block region A2 on the graphical user interface 621. When all of the color blocks 6222 in the second color block region A2 also have the second color, two hundred and eighty-eight LED chips 51 are attached. It should be understood that the number of the attached LED chips 51 and the corresponding attaching operations may be adjusted according to actual requirements, but the invention is not limited thereto.
Reference is made to
In step S701, the first wire segments of each of the first wires wind around each of the holders at the predetermined interval along the longitudinal direction of each of the holders. In addition, the second wire segments of each of the second wires wind around each of the holders at the predetermined interval along the longitudinal direction of each of the holders. The predetermined distance between the first wire and the second wire depends on the sizes of the LED chips.
In step 703, the holders are mounted on the worktable.
In step 705, the image capturing device captures the image of the worktable, including the images of the holders, the first wires and the second wires.
In step 707, the electronic device stores and displays the image of the either sides of the holder, the coordinate positions of the two first wire segments of the first wire that are closest to the either sides of the holder respectively, and the coordinate positions of the two second wire segments of the second wire that are closest to the either sides of the holder respectively.
In step 709, the number of the LED chips to be attached above each of the holders is inputted to the electronic device.
In step 711, the electronic device analyzes the coordinate/attaching positions of the LED chips to be attached across the first wire and the second wire on the holder according to the coordinate positions of the positioned first segments of the first wire and the positioned second wire segments of the second wire, the predetermined interval between the wire segments of the first wire or the second wire, the predetermined distance between the first wire and the second wire, and the number of the LED chips.
In step 713, the attaching device attaches each of the LED chips across one of the first segments of the first wire and one of the adjacent second wire segments of the second wire according to the coordinate position of each of the LED chips.
A single LED chip is disposed inside each of the LED lamps of the light strip in steps S701-S713. If some or all of the LED lamps of the light strip are intended to have double chips, the method for attaching LED chips may include the following steps: rotating the worktable by the actuator of the worktable, or removing the first wire and the second wire from the holder, then tuning the first wire and the second wire, and then winding the first wire and the second wire back around to the holder; using the attaching device to perform the above steps S705-S713 again to attach another LED chip to each of the LED lamps. The two LED chips may be attached back to back to each other or adjacent to each other.
Reference is made to
In step 801, the image capturing device captures the images of the holders, the first wires and the second wires on the worktable.
In step 803, the electronic device displays the graphical user interface, and the image captured by the image capturing device in the image region on the graphical user interface.
In step 805, the electronic device displays the color blocks each having the first color in the color block region on the graphical user interface, where the color blocks having the first color represent the LED chips to be attached across the first wire and the second wire on the surface of each of the holders respectively.
In step 807, the attaching device attaches the LED chips across the first wire segments of the first wire and the adjacent second wire segments of the second wire respectively according to the coordinate positions of the LED chips.
In step 809, the electronic device displays the color block having the second color representing the attached LED chip for replacing the first color representing the LED chip to be attached until all of the color blocks have the second color.
Reference is made to
In step 901, the actuator of the attaching device actuates the feeding guns to move horizontally above each of the holders on the worktable to align the muzzles of the feeding guns with the first wire segments and the second wire segments respectively.
In step 903, the actuator actuates the feeding guns to move to positions close to the first wire and the second wire. The actuator then actuates the feeding guns to dispense the adhesives on the first wire segments and the second segments across which the LED chips are attached. After dispensing the adhesives, the actuator actuates the feeding guns to move away from the first wire and the second wire.
In step 905, the chip transporting devices transport strips each having the LED chips toward the feeding guns of the attaching device respectively.
In step 907, the actuator actuates the feeding guns to move to the positions above the strips each having the LED chips respectively, and actuates the feeding guns to take the LED chips respectively. In step 909, the actuator actuates the feeding guns to move back to positions above the first wire and the second wire. The actuator then actuates the feeding guns to move to align the muzzles of the feeding guns with the first wire segments of the first wire and the second wire segments of the second wire across which the LED chips are to be attached.
In step 911, the feeding guns attach the LED chips across the first wire segments of the first wire and the second wire segments of the second wire on each of the holders respectively.
In summary, the present disclosure provides the apparatus and the method for attaching the LED chips, which apply the attaching device for automatically instead of manually performing the attaching operations of the LED chips. Therefore, the present disclosure can effectively improve position accuracy and production efficiency of the attached LED chips, thereby reducing processing times of the LED chips, so as to achieve an effect of producing high-quality light strings in mass production.
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
This application claims priority from the U.S. Provisional Patent Application Ser. No. 62/565327 filed Sep. 29, 2017 and the U.S. Provisional Patent Application Ser. No. 62/584619 filed Nov. 10, 2017, which applications are incorporated herein by reference in its entirety. Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.
Number | Date | Country | |
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62565327 | Sep 2017 | US | |
62584619 | Nov 2017 | US |