Patent Application
20140182392
Glass surfaces have become increasingly popular for use in consumer electronic products, such as handheld electronic devices. Such devices often use glass surfaces, which can be used as protective outer surfaces for such devices. Although plastic may be used instead of glass, glass tends to provide a better protective barrier given its strength and scratch resistance. However, since glass is rather brittle, efforts (such as chemical strengthening) are often taken to improve strength of the glass. For quality control purposes, outer glass surfaces can be tested for breakage. Conventional tests, such as multi-point testing or ring-on-ring testing, can be used. Unfortunately, however, with smaller scale glass articles, these conventional tests are not able to provide adequate testing. Thus, there is a continuing need for improved approaches for testing glass articles, particularly smaller scale glass articles.
The invention relates generally to testing brittle articles, such as glass or ceramic articles. The testing is provided by a test apparatus that imposes a bending test to a brittle article. The testing is also well suited for testing small scale brittle articles which are too small to utilize conventional multi-point testing or ring-on-ring testing. In addition, the testing is also well suited for testing brittle articles that have one or more apertures (or holes) therein which can impact their ability to resist breakage. For example, the quality of one or more apertures provided in brittle articles can affect breakage levels and thus can be monitored and/or adjusted through testing.
The invention can be implemented in numerous ways, including as a method, system, device, or apparatus. Several embodiments of the invention are discussed below.
As a system for testing a glass article having at least one aperture against breakage criteria, one embodiment can, for example, include at least a retainer apparatus and a loading apparatus. The retainer apparatus can be configured to releasably retain the glass article to be tested. The retainer apparatus can secure a portion of the glass article between first and second plates, with the portion of the glass article being retained not including the at least one aperture, and a remaining portion of the glass article can having the at least one aperture remains outside of the retainer apparatus. The loading apparatus can be configured to apply a test load at a first predetermined location on the remaining portion of the glass article.
As an apparatus for destructive testing of a first aperture extending through a substantially brittle item, the first aperture having a first aperture wall, one embodiment can, for example, include at least (i) a retainer assembly configured to releasably retain a first extremity of the substantially brittle item, while an opposing extremity of the substantially brittle item, including the first aperture, remains unretained by the retainer assembly; and (ii) a load assembly configured to apply a breaking load and/or a breaking load displacement at a predetermined location of the opposing extremity of the substantially brittle item, so as to originate fracture of the substantially brittle item at the first aperture wall of the first aperture.
As a system for processing substantially brittle cover items for consumer electronic products, wherein each of the substantially brittle cover items has a respective first aperture wall of a respective first aperture extending therethrough, one embodiment can, for example, include at least a cover item polishing assembly configured to polish the respective first aperture wall of the respective first aperture of each of the substantially brittle cover items; and an aperture wall quality monitor configured to monitor quality of one or more of the substantially brittle cover items for consumer electronic products.
As a consumer electronic product, one embodiment can, for example, include at least a housing having a surface, electrical components provided at least partially internal to the housing, the electrical components including at least an illuminator, a camera, a processor and a memory, the illuminator being provided at or adjacent the surface of the housing, and a cover item having a first aperture wall of a first aperture extending therethrough provided at or over the surface of the housing such that it is provided over the camera, the first aperture wall being polished using a monitored aperture wall polishing assembly.
As a method for producing substantially brittle cover item for consumer electronic products, one embodiment can, for example, include at least: obtaining a substantially brittle cover item for consumer electronic products, the substantially brittle cover item having a first aperture wall of a first aperture extending therethrough; polishing the first aperture wall of the first aperture of each of the substantially brittle cover items; and monitoring the polishing of the first aperture wall of the first aperture of the substantially brittle cover item.
Other aspects and advantages of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.
The invention will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals may designate like structural elements, and in which:
The invention relates generally to testing brittle articles, such as glass or ceramic articles. The testing is provided by a test apparatus that imposes a bending test to a brittle article. The testing is also well suited for testing small scale brittle articles which are too small to utilize conventional multi-point testing or ring-on-ring testing. In addition, the testing is also well suited for testing brittle articles that have one or more apertures (or holes) therein which can impact their ability to resist breakage. For example, the quality of one or more apertures provided in brittle articles can affect breakage levels and thus can be monitored and/or adjusted through testing.
Embodiments of the invention can relate to apparatus, systems and methods for testing, processing and monitoring cover items for electronic devices. In one embodiment, the cover items can pertain to housing surfaces of the electronic devices. Typically, the cover items are formed of glass or ceramic, or other substantially brittle material.
Embodiments of the invention are discussed below with reference to
In
Once polishing is complete, cover items can be removed from cover item polishing assembly 1004. At this point, the cover item has been polished. Cover items that have been polished can be chemically strengthened at chemical strengthening assembly 1006.
In
In
In particular, the aperture wall quality monitor 1120 may be configured to monitor polishing of a first aperture wall 1101A of a first aperture of at least one of the cover items 1010, which may be substantially brittle. The aperture wall quality monitor 1120 may include a test fixture arrangement 1100 for destructive testing of at least the first aperture wall 1101A of the first aperture of at least one of the cover items 1010.
As will be discussed in greater detail subsequently herein, test fixture arrangement 1100 may comprise a retainer assembly 1104, which may be configured to releasably retain a first extremity of the cover item 1010 adjacent to the first aperture wall 1101A of the first aperture, while an opposing extremity of the cover item 1010 remains unretained by the retainer assembly. A load assembly 1106 may be configured to apply a breaking load and/or a breaking load displacement and/or a breaking stress at a predetermined location of the opposing extremity 1010B of the cover item 1010, so as to originate fracture from the first aperture wall 1101A of the first aperture.
The breaking load and/or breaking load displacement and/or breaking stress may be applied at a predetermined location of the opposing extremity between the first aperture and the second aperture of the cover item 1010. Further, the breaking load and/or breaking load displacement and/or breaking stress may be applied at the predetermined location between the first aperture and the third aperture of the cover item. Instrumentation available from Instron (Instron, Norwood, Mass. USA) may, for example, be integrated into various components of system 1000.
The aperture wall quality monitor 1120 may comprise a breaking load monitor 1121, which may be configured to monitor a breaking load of the first aperture wall 1101A of the first aperture of at least one of the cover items 1010. Further, the aperture wall quality monitor 1120 may comprise a breaking load displacement monitor 1122, which may be configured to monitor a breaking load displacement of the first aperture wall 1101A of the first aperture of at least one of the cover items 1010. Additionally, the aperture wall quality monitor 1120 may comprise a breaking stress monitor 1124, which may be configured to monitor a breaking stress of the first aperture wall 1101A of the first aperture of at least one of the cover items 1010. Breaking stress may be calculated and may be based at least in part on the breaking load and the breaking load displacement.
Accordingly, it should be understood that aperture wall quality monitor may monitor the chemical strengthening and/or polishing of the cover items by monitoring a breaking load and/or breaking load displacement and/or breaking stress, such as at the first aperture wall 1101A of the first aperture of at least one of the cover items 1010. Monitoring the chemical strengthening and/or polishing may comprise applying the breaking load and/or breaking load displacement and/or breaking stress at the predetermined location.
System 1000 may further comprise a controller 1112. Controller 1112 may comprise a communication interface, processing system, storage system, and user interface. The processing system of controller 1112 may be operatively coupled to a storage system. Storage system of controller 1112 may store software and data.
Controller 1112 may be coupled with the polishing controls 1116 and/or the cover item polishing assembly 1004 for controlling at least one processing parameter of the cover item polishing assembly. Controller 1112 may be coupled with the aperture wall quality monitor 1120 for receiving a monitor signal that is substantially related to polishing quality of the respective first aperture wall of the respective first aperture of each of the cover items. Controller 1112 may be coupled with the aperture wall quality monitor 1120 for receiving a monitor signal that is substantially related to polishing quality of the cover items. The controller 1112 may be configured to generate an indicator signal when the polishing quality of the cover items provided by the cover item polishing assembly 1004 should be adjusted, based at least in part on the monitor signal.
Aperture wall quality monitor 1120 may be configured to monitor strength of the first aperture wall 1101A of the first aperture 1101 of at least one of the cover items 1010. Controller 1112 may be coupled with the chemical strengthening assembly 1006 for controlling at least one processing parameter of the chemical strengthening assembly 1006. Controller 1112 may be coupled with the aperture wall quality monitor 1120 for receiving a monitor signal that is substantially related to strength of the first aperture wall 1101A of the first aperture of at least one of the cover items 1010.
Controller 1112 may be coupled with the aperture wall quality monitor 1120 for receiving a monitor signal that is substantially related to strength of the first aperture wall of the first aperture of at least one of the cover items. Controller 1112 may be configured to generate an indicator signal when strength of the cover items should be adjusted, based at least in part on the monitor signal.
Accordingly, it should be understood that controller 1112 may control one or more processing parameters based upon the monitoring of one or more apertures. Controller 1112 may control processing based at least in part upon the monitoring of one or more apertures. Controller 1112 may control one or more processing parameters of the chemical strengthening assembly 1006 based upon the monitoring of one or more apertures. Similarly, controller 1112 may control one or more processing parameters of the cover item polishing assembly based upon the monitoring of one or more apertures.
With respect to the controller 1112 controlling one or more processing parameters, it should be understood that at least one processing parameter of the chemical strengthening and/or polishing may be adjusted in response to the monitoring. The monitoring may comprise generating a signal value that is substantially related to chemical strengthening quality and/or polishing quality of the cover items. A comparator and threshold control 1126 may compare a predetermined threshold value to the signal value that is substantially related to the chemical strengthening quality and/or polishing quality of the cover items.
Based at least in part on the monitoring of the chemical strengthening and/or polishing, the controller 1112 may determine that there is to be an adjustment to the quality of the polishing. There may be adjustment of quality of the chemical strengthening and/or quality of the polishing, based at least in part on the monitoring of the chemical strengthening and/or polishing.
For example, as mentioned previously herein, the controller 1112 may extend (and/or change and/or control and/or adjust) polishing time, and/or may refresh the polishing compound, and/or may change and/or control and/or adjust polishing speed, based at least in part on the monitoring of the polishing. The foregoing may increase effectiveness of polishing out defects from the aperture wall, which in turn may help to limit fracture occurrence as breaking load and/or breaking load displacement and/or breaking stress are increased.
Similarly, as mentioned previously herein, the controller 1112 may extend (and/or change and/or control and/or adjust) chemical strengthening time, and/or may refresh the chemical strengthening liquid, and/or may change and/or control and/or adjust chemical strengthening bath temperature, based at least in part on the monitoring of the chemical strengthening. The foregoing may increase effectiveness of chemical strengthening of the aperture wall, which in turn may help to limit fracture occurrence as breaking load and/or breaking load displacement and/or breaking stress are increased.
The cover items 1010 being processed by system 1000 are able to be tested with respect to quality criteria. The quality criteria can be a strength requirement for the cover items 1010. When the cover items 1010 include one or more apertures, system can also test the quality (e.g., strength) of the cover items 1010 at the vicinity of the one or more apertures, since apertures can be weak points in the cover items 1010. The testing can be destructive, in which case the cover item(s) are broken by a imposed breaking load, displacement or stress, or the testing can be non-destructive, in which case the cover items(s) that meet the quality criteria do not break. The testing can be of a random sampling of cover items 1010 be produced, or can be near-real time testing in-line with the other processing operations on the cover items 1010.
As already mentioned previously herein,
Although the cover item 2010 shown in
The breaking load may be applied by a tip portion 3106A of load assembly at a predetermined location 3400 of the opposing extremity so that fracture originates from the first aperture wall 3101A of the first aperture 3101. As a result, the breaking load at the first aperture 3101 can be evaluated or quantified.
The breaking load and/or breaking load displacement and/or breaking stress may be applied at the predetermined location 3400 between the first aperture 3101 and the second aperture 3102. The breaking load and/or breaking load displacement and/or breaking stress may be applied at the predetermined location between the first aperture 3101 and the third aperture 3103.
Breaking load displacement of the aperture wall 4101A of cover item 4010 may be small, and may be on the order of one or two millimeters, just as fracture is about to occur and occurs. Accordingly, it should be understood that in
Additionally, it should be understood that to test quality (i.e., strength or breakage load) of other portions of cover item 4010, the tip portion 4106A would be repositioned. For example, to test the quality of cover item 4010 at another aperture, the tip portion 4106A would be repositioned to concentrate the load over the another aperture. The placement of cover item 4010 in the retainer assembly 4104 might also be adjusted.
Electrical components 5301, 5302, 5303, 5401, 5402 may be provided at least partially internal to the housing. These electrical components can, for example, correspond to an illuminator 5301, a camera 5302, a microphone 5303, a processor 5401, and a memory 5402. The illuminator 5301 and/or the camera 5302 and/or a third electrical component may be provided adjacent the surface 502 of the housing 501.
Cover item 5010 is typically made of a material that is substantially brittle. In one embodiment, cover item 5010 may formed of glass, and in particular may comprise chemically strengthened glass. In other embodiments, cover item 5010 may be formed of ceramic or another material.
As shown in the figures, cover item 5010 may have a first aperture wall 5101A of a first aperture 5101 extending therethrough. This may be provided at or over the surface 502 of the housing 501, such that it is provided over the illuminator 5301. The first aperture wall 5101A may be monitored, and may be polished using a monitored aperture wall polishing assembly, as discussed previously herein. The first aperture wall 5101A may be monitored, and may be chemically strengthened using a monitored chemical strengthening assembly, as discussed previously herein.
As shown in the figures, cover item 5010 may have a second aperture wall 5102A of a second aperture 5102 extending therethrough. This may be provided at or over the surface 502 of the housing 501, such that it is provided over the camera 5302. The second aperture wall 5102A may be monitored, and may be polished using the monitored aperture wall polishing assembly, as discussed previously herein. The second aperture wall 5102A may be monitored, and may be chemically strengthened using the monitored chemical strengthening assembly, as discussed previously herein.
As shown in the figures, cover item 5010 may have a third aperture wall 5103A of a third aperture 5103 extending therethrough. This may be provided at or over the surface 502 of the housing 501, such that it is provided over the third electrical component 5303. The third aperture wall 5103A may be monitored, and may be polished using the monitored aperture wall polishing assembly, as discussed previously herein. The third aperture wall 5103A may be monitored, and may be chemically strengthened using the monitored chemical strengthening assembly, as discussed previously herein.
The process can continue with defining 604 one or more respective apertures extending into each of the cover items. A drilling or machining process may be used to form the one or more respective apertures. A respective first aperture wall of a respective first aperture may extend into each of the cover items. In some embodiments, one or more additional apertures may be defined in each of the cover items. A respective second aperture wall of a respective second aperture may extend into each of the cover items. A respective third aperture wall of a respective third aperture may extend into each of the cover items.
The process 600 can continue with processing 606 the apertures. For example, the processing 606 may comprise chemically strengthening 606 and/or polishing 606 the apertures. The respective first aperture wall of the respective first aperture of each of the cover items may be chemically strengthened and/or polished (e.g., chemically strengthening and/or polishing). In some embodiments, one or more additional apertures may be processed in each of the cover items. A respective second aperture wall of a respective second aperture of each of the cover items may be chemically strengthened and/or polished. A respective third aperture wall of a respective third aperture of each of the cover items may be chemically strengthened and/or polished.
The process 600 can continue with monitoring 608 the apertures. For example, the monitoring 608 may comprise monitoring the chemically strengthening and/or polishing of the apertures. The chemically strengthening and/or polishing of respective first aperture wall of the respective first aperture of each of the cover items may be monitored (e.g., monitor chemically strengthening and/or monitor polishing).
In some embodiments, one or more additional apertures may be monitored for each of the cover items. Chemical strengthening and/or polishing of a respective second aperture wall of a respective second aperture of each of the cover items may be monitored. Chemical strengthening and/or polishing of a respective third aperture wall of a respective third aperture of each of the cover items may be monitored.
Monitoring 608 the chemical strengthening and/or polishing may comprise destructive testing of one or more apertures of at least one of the cover items. For example, monitoring 608 the chemical strengthening and/or polishing may comprise destructive testing of the first aperture wall of the first aperture of at least one of the cover items. In particular, monitoring the chemical strengthening and/or polishing may comprise originating fracture from the first aperture wall of the first aperture of at least one of the cover items. Similarly, monitoring the chemical strengthening and/or polishing may comprise originating fracture from the second aperture wall of the second aperture of at least one of the cover items. Furthermore, monitoring the chemical strengthening and/or polishing may comprise originating fracture from the third aperture wall of the third aperture of at least one of the cover items.
Monitoring 608 the chemical strengthening and/or polishing may comprise monitoring a breaking load and/or breaking load displacement and/or breaking stress of the first aperture wall of the first aperture of at least one of the cover items. Monitoring 608 the chemical strengthening and/or polishing may comprise applying the breaking load and/or breaking load displacement and/or breaking stress at a predetermined location between the first aperture and the second aperture. Further, monitoring 608 the chemical strengthening and/or polishing may comprise applying the breaking load and/or breaking load displacement and/or breaking stress at the predetermined location between the first aperture and the third aperture.
Further, monitoring the chemical strengthening and/or polishing may comprise monitoring a breaking load and/or breaking load displacement and/or breaking stress of the second aperture wall of the second aperture of at least one of the cover items. Monitoring the chemical strengthening and/or polishing may comprise monitoring a breaking load and/or breaking load displacement and/or breaking stress of the third aperture wall of the third aperture of at least one of the cover items.
The process 600 can continue with controlling 610 one or more processing parameters based upon the monitoring of one or more apertures. The processing may be controlled, for example by the controller as discussed previously herein with reference to
With respect to the controlling 610 of one or more processing parameters in the process 600, it should be understood that at least one processing parameter of the chemical strengthening and/or polishing may be adjusted in response to the monitoring. The monitoring may comprise generating a signal value that is substantially related to chemical strengthening quality and/or polishing quality of the cover items. A predetermined threshold value may be compared to the signal value that is substantially related to the chemical strengthening quality and/or polishing quality of the cover items.
Based at least in part on the monitoring of the chemical strengthening and/or polishing, there may be a determining that there is to be adjustment of quality of the polishing. There may be adjusting of quality of the chemical strengthening and/or quality of the polishing, based at least in part on the monitoring of the chemical strengthening and/or polishing.
For example, polishing time may be extended (and/or changed and/or controlled and/or adjusted), and/or polishing compound may be refreshed, and/or polishing speed may be changed and/or controlled and/or adjusted, based at least in part on the monitoring of the polishing. The foregoing may increase effectiveness of polishing out defects from the aperture wall, which in turn may help to limit fracture occurrence as breaking load and/or breaking load displacement and/or breaking stress are increased.
Similarly, chemical strengthening time may be extended (or changed and/or controlled and/or adjusted), and/or chemical strengthening liquid may be refreshed, and/or chemical strengthening bath temperature may be changed and/or controlled and/or adjusted, based at least in part on the monitoring of the chemical strengthening. The foregoing may increase effectiveness of chemical strengthening of the aperture wall, which in turn may help to limit fracture occurrence as breaking load and/or breaking load displacement and/or breaking stress are increased.
The apparatus and processes described herein may be applied to cover items, for example glass cover items, which may be used by any of a variety of electronic devices including but not limited handheld electronic devices, portable electronic devices and substantially stationary electronic devices. By way of example, and not by way of limitation, the electronic device may correspond to media players, mobile phones (e.g., cellular phones), PDAs, remote controls, notebooks, tablet PCs, monitors, all in one computers and the like.
Some embodiments may be implemented by software, but can also be implemented in hardware or a combination of hardware and software. Some implementations may be embodied as computer readable code on a tangible computer readable medium. The tangible computer readable medium is any data storage device that can store data, which can thereafter be read by a computer system. Examples of tangible computer readable medium include read-only memory, random-access memory, CD-ROMs, DVDs, magnetic tape, and optical data storage devices.
The various aspects, features, embodiments or implementations of the invention described above can be used alone or in various combinations.
Different aspects, embodiments or implementations may, but need not, yield one or more of the following advantages. One advantage of certain embodiments is that small scale brittle materials can undergo breakage testing. Another advantage of certain embodiment is that breakage testing can be performed to evaluate breakage conditions associate with apertures of a glass article (such as a cover glass for a consumer electronic device). Still another advantage of certain embodiments is that automated control and/or monitoring of cover items with apertures can be performed with greater accuracy, efficiency and/or consistency.
Although only a few embodiments of the invention have been described, it should be understood that the invention may be embodied in many other specific forms without departing from the spirit or scope of the present invention. By way of example, the steps associated with the methods of the invention may vary widely. Steps may be added, removed, altered, combined, and reordered without departing from the spirit or scope of the invention. Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results.
While this specification contains many specifics, these should not be construed as limitations on the scope of the disclosure or of what may be claimed, but rather as descriptions of features specific to particular embodiment of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.
While this invention has been described in terms of several embodiments, there are alterations, permutations, and equivalents, which fall within the scope of this invention. It should also be noted that there are many alternative ways of implementing the methods and apparatuses of the present invention. It is therefore intended that the following appended claims be interpreted as including all such alterations, permutations, and equivalents as fall within the true spirit and scope of the present invention.
