Claims
- 1. A wafer chamfering apparatus for chamfering a periphery of a wafer, comprising:a main grindstone; main grindstone rotating means for rotating the main grindstone; a wafer table for holding the wafer in parallel with the main grindstone; wafer table rotating means for rotating the wafer table; wafer table moving means for moving the wafer table along an axis of the wafer and moving the wafer table along a face of the wafer; a notch machining grindstone for chamfering a notch formed in the wafer, the notch machining grindstone being arranged in proximity to the main grindstone; and notch machining grindstone rotating means for rotating the notch machining grindstone, wherein the wafer is rotated while being moved to the main grindstone being rotated, and the periphery of the wafer is brought into contact with the main grindstone so as to be chamfered.
- 2. The wafer chamfering apparatus as defined in claim 1, wherein the notch machining grindstone is composed of multiple grindstones with different grain sizes, the multiple grindstones being connected coaxially to one another.
Priority Claims (3)
Number |
Date |
Country |
Kind |
10-135257 |
May 1998 |
JP |
|
10-135258 |
May 1998 |
JP |
|
10-307148 |
Oct 1998 |
JP |
|
Parent Case Info
This application is a division of Application No. 09/311,567, filed May 14, 1999, now U.S. Pat. No. 6,267,248.
US Referenced Citations (6)
Foreign Referenced Citations (11)
Number |
Date |
Country |
87 03 250 |
Oct 1987 |
DE |
64-51912 |
Feb 1989 |
JP |
2-24047 |
Jan 1990 |
JP |
2-95554 |
Apr 1990 |
JP |
3-117546 |
May 1991 |
JP |
04-129656 |
Apr 1992 |
JP |
6-315857 |
Nov 1994 |
JP |
7-205001 |
Aug 1995 |
JP |
8-150551 |
Jun 1996 |
JP |
9-131654 |
May 1997 |
JP |
10-71549 |
Mar 1998 |
JP |