The present invention relates generally to automated material placement machines and their use. More particularly, but not exclusively, the present invention relates to systems and methods for inspecting material laid by an automated material placement machine.
Automated material placement is widely used in aerospace and other industries in the fabrication of large composite structures. A variety of placement processes and machines are used for rapid placement of composite material. It is desirable for such machines to have in-process inspection capabilities to assure consistent quality without impacting machine operation. As new and/or improved inspection capabilities are added to material placement machines, it is desirable to minimize the number of new components to be added to implement new or improved features. Accordingly, it can be desirable to use existing machine components when incorporating new or improved features in a machine.
The present invention, in one aspect, is directed to a method of providing input to an inspection system for inspecting material laid by a material placement machine on a substrate to form a composite structure. A placement machine component that drives a first encoder output is used to drive a second encoder output. The second encoder output is used to trigger image acquisition by the inspection system.
In another aspect, the invention is directed to an inspection system for inspecting material laid by a material placement machine on a substrate to form a composite structure. The inspection system includes a placement machine component that drives first and second encoder outputs. An encoder is coupled to the placement machine component. The encoder provides at least the first encoder output. The second encoder output is used to trigger image acquisition by the inspection system.
In yet another aspect, the invention is directed to an inspection system for inspecting material laid by a material placement machine on a substrate to form a composite structure. The inspection system includes one or more cameras configured to acquire images of the laid material. The inspection system includes an encoder that provides at least a first encoder output to track a length of material feed during movement of the machine. A roller drives the encoder and drives a second encoder output. The second encoder output is used for triggering image acquisition by the one or more cameras.
Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating various preferred embodiments of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
The present invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
The following description of various embodiments is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. Although various implementations of the invention are discussed with reference to an add roller of a fiber placement (FP) machine, the invention is not so limited. Implementations also are contemplated for use in connection with various types of material placement machines, including but not limited to contour tape lamination (CTL) machines and multi-head tape lamination machines (MHTLM). Additionally, material placement machine components other than or in addition to add rollers could be used to provide encoder output(s) in various embodiments.
A simplified block diagram of an exemplary material placement system is indicated generally in
When the machine 24 is in operation, the processor 40 may actuate one or more cameras (not shown) of the vision system 68 to obtain images at appropriate times based on movement of the machine 24. The camera(s) obtain images of material newly placed on the substrate 32. The processor 40 receives each image and assigns unique numbers to frames of the image data. The processor 40 stores image frames in the memory 44 and uses them to track a linear position of the machine 24 as material is placed on the substrate 32. The processor 40 processes the image data in a frame to detect defects in the imaged section of material 28. The processor 40 also analyzes and displays selected defects on the user interface 50.
In various types of material placement machines, an encoder (not shown in
A frame width 116 equals the width of a material course 104 being laid, whether fiber tows or tape. Frame height 120 is a fixed value and can be used as a means to determine linear distance traveled, and of locating flaws or areas of interest on the laminate ply 112. The completion of a linear distance equal to frame height 120 may be communicated to an inspection system through signal pulses from the encoder. An entire laminate may be effectively subdivided into frames 102, each of which is assigned a discrete number. Frame size and frame number can be used to locate flaws and defective regions on the laminate.
When a defect is detected, a signal can be produced that not only may indicate defect detection but also may trigger measurement and marking of the defect. Exemplary systems and methods capable of detecting defects in a composite structure are described in U.S. patent application Ser. No. 09/819,922, filed Mar. 28, 2001, entitled “System and Method for Identifying Defects in a Composite Structure”; U.S. Pat. No. 6,871,684 issued Mar. 29, 2005, entitled “System for Identifying Defects in a Composite Structure”; and U.S. patent application Ser. No. 10/628,691, filed Jul. 28, 2003, entitled “Systems and Methods for Identifying Foreign Objects and Debris (FOD) and Defects During Fabrication of a Composite Structure.” The entire disclosures of U.S. patent application Ser. Nos. 09/819,922, 10/217,805, and 10/628,691 are each incorporated herein by reference as if fully set forth herein.
The present invention, in some aspects, is directed to providing information to a placement machine inspection system via an encoder. In various implementations, a placement machine component that drives encoder output for other purpose(s) is used to drive an encoder output for use in an inspection system.
In some implementations, the invention is directed to a method of providing input to an inspection system for inspecting material laid by a material placement machine. A placement machine component that drives a first encoder output is used to drive a second encoder output. The second encoder output is used to trigger image acquisition, e.g., by a camera of the inspection system. In some implementations, an in-process inspection system may utilize output of an existing material placement machine encoder. In other implementations, a second encoder may be mounted on or otherwise coupled to a placement machine component that drives a first encoder.
A material placement machine configured in accordance with one aspect of the invention is partially shown and indicated generally in
A rotary encoder mounted on or otherwise coupled to the add roller 210 is used to track length of material feed during movement of the placement machine 200. One such encoder is indicated in
The encoder 230 generates pulses at a higher rate than needed for activating image acquisition by a placement machine inspection system. Additionally, the encoder 230 operates at a single TTL (transistor-transistor logic) load. More specifically and in some embodiments, a pair of transistors (not shown) of the encoder circuitry operate as an on-off switch to generate pulses indicating placement machine travel. The TTL load is the maximum current that can be driven through the switch that still allows the switch to reach operating voltage. Thus the encoder 230 provides only a single output for use in the placement machine 200.
Accordingly, to provide more than one encoder output, the encoder 230 may be included in an exemplary configuration indicated generally in
Where it is desired to use a different pulse rate from one generated by an encoder, a divider circuit may be used. For example, a divider circuit 324 receives the amplified encoder signal 316 and divides it by an integer, preferably sixteen, which lowers a pulse rate from the encoder 230 to about 4851 pulses per second with a linear accuracy of about 0.004 inch per pulse. The amplifier circuit 308 is, e.g., an IBV606 amplifier box from Heidenhain Corporation. The first encoder output 312 provided by the configuration 300 to the placement machine 200 for tracking material feed length is essentially the same as the single TTL output provided by the encoder 230 in the absence of the amplifier and divider circuits 308 and 324.
Depending on a type and make of placement machine, configuring an encoder as shown in
Another exemplary configuration of the placement machine 200 is indicated generally in
A configuration including a second encoder is indicated generally in
The foregoing methods and apparatus make use of existing placement machine features and components to provide encoding capability for a placement machine inspection system. Thus the number, complexity and weight of hardware components associated with the inspection systems that must be added to the overall system can be reduced or eliminated. Because encoder output signals for the placement process and for material inspection are driven by the same component, material placement locations can be determined more precisely compared with other methods currently in use. The foregoing methods and apparatus can be applied to a broad range of placement machines and head configurations.
While various preferred embodiments have been described, those skilled in the art will recognize modifications or variations which might be made without departing from the inventive concept. The examples illustrate the invention and are not intended to limit it. Therefore, the description and claims should be interpreted liberally with only such limitation as is necessary in view of the pertinent prior art.
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