Claims
- 1. An apparatus for use with a chamber that includes a heating element and is configured to perform a semiconductor fabrication process, said apparatus comprising:
a temperature control system configured to communicate with the heating element and to cause uneven heat distribution across a surface of a substrate positioned within the chamber during a time coincident with at least a portion of the semiconductor fabrication process.
- 2. The apparatus of claim 1, wherein said temperature control system is configured to cause said uneven heat distribution during a time coincident with substantially an entire time span of said semiconductor fabrication process.
- 3. The apparatus of claim 1, wherein said temperature control system communicates with at least one temperature sensor configured to transmit a temperature signal in response to a sensed temperature, said temperature control system configured to cause said uneven heat distribution based on said temperature signal.
- 4. The apparatus of claim 3, wherein said temperature control system communicates with a plurality of temperature sensors and is configured to cause said uneven heat distribution based on temperature signals from said plurality of temperature sensors.
- 5. The apparatus of claim 3, wherein said temperature control system communicates with said at least one temperature sensor configured to sense a temperature within said chamber.
- 6. The apparatus of claim 3, wherein said temperature control system communicates with said at least one temperature sensor configured to sense a temperature of at least one area of at least one semiconductor substrate within said chamber.
- 7. The apparatus of claim 3, further comprising:
a feedback control system in communication with said at least one temperature sensor and said temperature control system and configured to cause said temperature control system to alter a thermal output of the heating element within the chamber in response to transmission of a signal from said at least one temperature sensor.
- 8. The apparatus of claim 7, wherein said feedback control system is configured to receive said signal and to cause said temperature control system to alter power provided to said heating element in response to said signal.
- 9. An apparatus for use with a chamber that includes a heating element and is configured to perform a semiconductor fabrication process, said apparatus comprising:
a temperature control system configured to communicate with the heating element and to cause uneven heat distribution across a surface of a substrate positioned within the chamber during a time coincident with at least a portion of the semiconductor fabrication process; and a feedback control system in communication with said temperature control system and at least one temperature sensor, said feedback control system configured to cause the heating element of the chamber to alter a thermal output within the chamber in response to transmission of a signal from said at least one temperature sensor.
- 10. The apparatus of claim 9, wherein said temperature control system is configured to cause said uneven heat distribution during a time coincident with substantially an entire time span of said semiconductor fabrication process.
- 11. The apparatus of claim 9, wherein said feedback control system communicates with at least one temperature sensor and is configured to cause said temperature control system to effect said uneven heat distribution based on temperature signals from said at least one temperature sensor.
- 12. The apparatus of claim 9, wherein said feedback control system communicates with said at least one temperature sensor, which is configured to sense a temperature within said chamber.
- 13. The apparatus of claim 9, wherein said feedback control system communicates with said at least one temperature sensor, which is configured to sense a temperature of at least one area of at least one semiconductor substrate within said chamber.
- 14. The apparatus of claim 9, wherein said feedback control system is configured to communicate with a plurality of temperature sensors in the chamber.
- 15. The apparatus of claim 9, wherein said feedback control system is configured to receive said signal and to cause said temperature control system to alter power provided to said heating element in response to said signal.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 10/047,051, filed Jan. 14, 2002, pending, which is a continuation of application Ser. No. 09/506,205, filed Feb. 17, 2000, now U.S. Pat. No. 6,471,780, issued Oct. 29, 2002, which is a continuation of application Ser. No. 09/041,913, filed Mar. 13, 1998, pending.
Divisions (1)
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Number |
Date |
Country |
Parent |
10047051 |
Jan 2002 |
US |
Child |
10435336 |
May 2003 |
US |
Continuations (2)
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Number |
Date |
Country |
Parent |
09506205 |
Feb 2000 |
US |
Child |
10047051 |
Jan 2002 |
US |
Parent |
09041913 |
Mar 1998 |
US |
Child |
09506205 |
Feb 2000 |
US |