The invention relates generally to coating apparatus and methods. More particularly, the present invention relates to coating apparatus and methods adapted for use when the capillary number characteristic of the process is low.
Coating a fluid onto a web of material is well known. Such coating can often be conveniently done using a coating die having a cavity communicating with an applicator slot. Liquid under pressure is introduced into the cavity, and is then extruded out of the applicator slot onto a desired substrate.
Depending on the exact result desired, variations on this theme are numerous, with various coating aids being known. In particular, it is known that under certain conditions, particularly when the speed of the web past the coating die is very rapid, the material dispensed from the applicator slot may neck inwards erratically. One parameter that may be predictive of whether this necking will occur is the so-called “capillary number” characteristic of the coating process.
The capillary number is a dimensionless parameter defined as:
where Ca is the capillary number, μ is the viscosity of the material dispensed or coated at the characteristic shear rate of the coating process, V is the speed of the moving web or other substrate, and μ is the surface tension of the material. At higher capillary numbers, the necking inwards of the edges of the dispensed material is more likely to be a problem.
Various expedients are known by those skilled in the art for controlling this tendency of the dispensed material to pull inwards. The art is replete with mechanical aids to draw the dispensed material back to a predictable width. These are often called “edge guides” in the literature. They are particularly to be seen in descriptions of slide and curtain coating.
However, literature is silent about what might be considered the opposite problem. Recently, attempts to coat high value materials (substrates) in very thin dry layers at very low speeds have resulted in coating of erratic width as capillary forces draw the dispensed material laterally along the gap between the die surface and the substrate at the ends of the applicator slot. This is because the thin dry layers coated onto the high value materials are diluted in a solvent for delivery to the substrate, which reduces viscosity and increases the coating thickness of the coating and solvent mixture delivered to the substrate.
Improvements are desired.
One aspect of the present disclosure is directed to a method of applying a material to a moving substrate, including providing a die comprising a die body having a cavity therein, wherein the cavity is in fluid communication with an applicator slot. This die is then oriented such that the applicator slot is positioned so as to dispense the material onto the substrate. The material is introduced into the die cavity such that the material is dispensed onto the substrate through the applicator slot. A means is disposed for preventing the widening of the dispensed material laterally of the applicator slot at least one end of the applicator slot.
Another aspect of the present disclosure is directed to a coating die for dispensing material onto a moving substrate. The coating die includes a die body having a cavity therein, wherein the cavity is in fluid communication with an applicator slot. The coating die also includes means for preventing outward lateral movement of the dispensed material at least one end of the applicator slot.
In the several figures of the attached drawing, like parts bear like reference numerals, and:
In pre-metered coating, such as die coating, it is important for the width of the coated layer to be known to a high degree of accuracy. For the coated layer to be uniform, its width has to be equal to the width of the feed slot. It is, however, common to have some widening of the coating bead past the width of the feed slot, especially at low capillary number flow, such as slow coating speeds and low liquid viscosity. The bead widening causes non-uniformity of coating edges and, sometimes, an instability. These phenomena occur at low capillary number flow, which are typically less than about 0.5, and more typically less than 0.1, and can be less than 0.005, and even 0.001.
The coating bead changes its width when pressure that is generated by capillary forces at the edges of the bead do not match pressure generated in the coating bead. If pressure in the coating bead is larger than a maximum capillary pressure the edge meniscus can sustain, the bead widens; if it is lower than a minimum pressure, the bead narrows. The minimum and maximum capillary pressures depend, among other things, on conditions at the static contact line on the coating die and contact angle between liquid and substrate. The pressures also depend on the flow rate of the dispensed material.
An apparatus and method for controlling the static contact line on the die is disclosed herein. The static contact line can be either pinned or it could move to keep the static contact angle between the liquid and the die constant. When the static contact line is pinned, the range of admissible capillary pressures is the greatest.
Generally, the present disclosure is directed to a coating die having a slot and a pinning location at one or both ends of the slot. The coating die also includes a cavity in fluid communication with the slot. Coating material within the cavity is forced through the slot and then coated onto a substrate. As the coating material exits the slot to form a coating bead, each pinning location holds the coating bead at the pinning location. By pinning the coating bead at each end, control of the coating bead is improved.
Referring to
The illustrated embodiment of the die 12 includes a first portion 26, a second portion 28, and a shim 30. However, this construction is merely convenient; for example, the shim 30 and its function are optional, and die 12 could be constructed as a single element. Also, one of ordinary skill in art will appreciate that the die could also include a replaceable and interchangeable lip portion including the applicator slot. Such a replaceable and interchangeable lip portion would allow the same main die body, including the cavity, to be used with various sized applicator slots. An example of such a replaceable and interchangeable lip portion is described in U.S. Pat. No. 5,067,432, to Lippert, which is incorporated by reference herein.
Referring now to
As previously discussed, the present disclosure is directed to preventing widening of the coating bead by providing a pinning location for the edge of the coating bead. In some embodiments, the pinning location can be structural, such as a geometrical step with minimal radius of curvature at the apparent corner. Alternatively, physical properties of materials, such as a rapid or step-change in wetting properties of the die materials of construction, can be used to create a pinning location to prevent lateral widening of the coating bead. Also, the pinning location should span the entire length L of the wetted part of the die in the down web direction (as illustrated in
Referring to
The die of the present disclosure can also be used with a vacuum assisted coating. Referring to
Referring to
Alternatively, the die body can be coated with a preferentially wetting material in the wetted region, such as gold plating. The preferentially wetted material keeps the coating bead from migrating or moving laterally out of the pinning location. In another example embodiment, hydrophobic tape can be applied along the edges of the wetted area of the die when using water-based coating materials or solutions.
For each of the example embodiments described, it is preferred that the pinning location spans the entire length L of the slot 924 in the machine direction (as illustrated in
Various modifications and alterations of the present invention will be apparent to those skilled in the art without departing from the scope and spirit of this invention, and it should be understood that this invention is not limited to the illustrative embodiments set forth herein.
This application is a continuation of U.S. application Ser. No. 10/760,794, filed Jan. 20, 2004, now U.S. Pat. No. 7,291,362 now allowed, the disclosure of which is incorporated by reference in their entirety herein.
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Number | Date | Country |
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61-257263 | Nov 1986 | JP |
61-257268 | Nov 1986 | JP |
Number | Date | Country | |
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20080022930 A1 | Jan 2008 | US |
Number | Date | Country | |
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Parent | 10760794 | Jan 2004 | US |
Child | 11865349 | US |