Patent Application
20080002384
The present invention relates, in general, to a electronic circuits, and more particularly, to providing radio frequency shielding and heat dissipation for electronic components mounted on printed circuit boards.
Printed circuit boards (PCBs) are widely used in the electronics and telecommunications industry for connecting various components to a system. PCBs are generally made of an insulating substrate, e.g., plastic, on which an electrical circuit is formed by depositing a predetermined and well defined pattern of a conducting metal, e.g., copper.
The conducting metal connects various electronic components, e.g., filters, semiconductors, which are mounted on the PCB. Many of these electrical circuits, mounted on the PCBs, include electronic components that operate at high radio frequencies. The radio frequency (RF) emissions from these components can interfere with the proper operation of the other components or circuits on the PCB or in the vicinity of the PCB, e.g., on other PCBs. Therefore, it is important to block or shield these RF emissions in order to prevent RF interference. To counter this problem, an RF shield is typically used to enclose the components on the PCBs and block the RF emissions. However, in conjunction with shielding the components, heat radiated from, for example high power devices, may not be dissipated properly. This heat reduces the efficiency of the circuit, changes the characteristics of electronic components and can even damage the electronic components.
In light of the foregoing discussion, it would be highly desirable to have an improved RF shielding apparatus that can enhance the cooling of electronic components in conjunction with blocking RF emissions.
The accompanying figures, where like reference numerals refer to identical or functionally similar elements throughout the separate views, and which, together with the detailed description below, are incorporated in and form part of the specification, serve to further illustrate various embodiments and to explain various principles and advantages, all in accordance with the present invention.
The present invention is illustrated by way of example, and not limitation, in the accompanying figures, in which like references indicate similar elements, and in which:
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help in improving an understanding of embodiments of the present invention.
Before describing in detail the particular apparatus and method for providing radio frequency shielding to electronic components, in accordance with various embodiments of the present invention, it should be observed that the present invention resides primarily in combinations of the apparatuses and components for providing radio frequency shielding. Accordingly, the apparatuses and components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent for understanding the present invention, so as not to obscure the disclosure with details that will be readily apparent to those with ordinary skill in the art, having the benefit of the description herein.
In this document, relational terms such as first and second, and the like, may be used solely to distinguish one entity or action, from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such a process, method, article, or apparatus. An element proceeded by “comprises . . . a” does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
The term “another,” as used in this document, is defined as at least a second or more. The term “includes” as used herein, is defined as comprising.
In an embodiment, an apparatus for providing RF shielding to various electronic components mounted on a PCB is provided. The apparatus includes an adhesive pad which is thermally conductive and is in physical contact with various electronic components mounted on the PCB. The apparatus also includes an RF shield, which encloses the various electronic components and is capable of bending on application of force. The RF shield has an outside surface and an inside surface. When a force is applied on the outside surface of the RF shield, the shield bends and the inside surface makes physical contact with the adhesive pad.
In another embodiment, an apparatus for providing RF shielding to various electronic components in an electronic circuit is provided. The apparatus includes a base board on which various electronic components are mounted. The apparatus also includes an adhesive pad which is thermally conductive and is in physical contact with various electronic components mounted on the base board. Further, the apparatus includes an RF shield, which encloses the various electronic components and is capable of bending on application of force. The RF shield has a first surface and a second surface. When force is applied on the first surface of the RF shield, it bends and the second surface makes physical contact with the adhesive pad.
In yet another embodiment, a method for providing RF shielding to various electronic components mounted on a PCB is elaborated. The method includes placing an adhesive pad on the various electronic components. The adhesive pad is in physical contact with various electronic components. The method also includes forming an RF shield with a compressible top surface. Further, the method includes compressing the RF shield by application of force. In response to the applied force, the RF shield makes physical contact with the adhesive pad.
For another embodiment of the present invention, the plurality of electronic components 104, 106 and 108 are mounted on a base board. The base board may be a PCB and can be made from an insulating material. The RF shield 202, which encloses the plurality of electronic components 104, 106 and 108, has a first surface and a second surface. The force 302 is applied on the first surface of the RF shield 202. On application of force 302, the RF shield 202 is compressed and the second surface of the RF shield comes into physical contact with the adhesive pad 204.
For an embodiment of the present invention, along with RF energy, heat is radiated from the plurality of electronic components 104, 106 and 108. The radiated heat is absorbed by the adhesive pad 204 and transferred to the inside surface of the RF shield 202. The transferred heat is dissipated by the outside surface of the RF shield 202.
The RF shield described above enhances cooling of the electronic components. The RF shield on application of force comes in contact with the adhesive pad which is in physical contact with the plurality of electronic components. This configuration allows the adhesive pad to absorb heat from the plurality of electronic components and transmit the heat to the RF shield, thereby providing an efficient method for cooling the electronic components in conjunction with shielding.
In the foregoing specification, the invention and its benefits and advantages have been described with reference to specific embodiments of an assembly providing both heat dissipation and shielding of electronic components. However, one of ordinary skill in the art would appreciate that various modifications and changes can be made without departing from the scope of the present invention, as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present invention. The benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage or solution to occur or become more pronounced are not to be construed as critical, required or essential features or elements of any or all the claims. The invention is defined solely by the appended claims, including any amendments made during the pendency of this application, and all equivalents of those claims, as issued.
