The present invention relates to metal oxide semiconductor (MOS) image sensors and, more particularly, to reset circuits for active pixel sensors (APS) in a CMOS array.
Integrated circuit technology has revolutionized various fields including computers, control systems, telecommunications, and imaging. There are a number of types of semiconductor imagers, including charge coupled devices, photodiode arrays, charge injection devices, and hybrid focal plane arrays. Some sensors are referred to as active pixel image sensors (APS). An active pixel image sensor is defined as an image sensor technology that has one or more active transistors within the pixel unit cell. Some types of active pixel sensor technologies include the amplified MOS imager (AMI), charge modulation device (CMD), volt charge modulated device (VCMD), base stored image sensor (BASIS), and the static induction transistor (SIT).
One prior art circuit using a CMOS photodiode-type active pixel sensor is shown in “128×128 CMOS Photodiode-Type Active Pixel Sensor With On-Chip Timing, Control And Signal Chain Electronics,” by R. H. Nixon et al., Proceedings of the SPIE-The International Society for Optical Engineering, Volume 2415, 1995, pages 117-123.
Timing for the readout sequence is as follows. After a row has been selected, the signal that is present on each column pixel in that row is sampled (SHS) onto the holding capacitor CS. Next, each pixel in the row is reset (RESET). This is followed by sampling the reset level (SHR) onto holding capacitor CR. A simplified expression for the output voltage of the reset branch of the column circuit is given by:
Vcol—R≅β{α[Vpdr−Vtpix]−Vtcolr}
where α is the gain of the pixel source-follower, β is the gain of the column source-follower, Vpdr is the voltage on the photodiode after reset, Vtpix is the threshold voltage of the pixel source-follower n-channel transistor, and Vtcolr is the threshold voltage of the column source-follower p-channel transistor. Similarly, the output voltage of the signal branch of the column circuit is given by:
Vcol—S≅β{α[Vpds−Vtpix]−Vtcols}
where Vpds is the voltage on the photodiode with the signal charge present and Vtcols is the threshold voltage of the column source-follower p-channel transistor. Experimentally, the peak to peak variation in Vtcolr−Vtcols is typically 10-20 mV. It is desirable to remove this source of column-to-column fixed pattern noise FPN. JPL has previously developed a double delta sampling (DDS) technique to eliminate the column-to-column FPN. This approach represents an improved version of the DDS circuitry.
Sequential readout of each column is as follows. First a column is selected. After a settling time equivalent to one-half the column selection period, the DDS is performed to remove column fixed pattern noise. In this operation, a DDS switch and two column selection switches on either side are used to short the two sample and hold capacitors CS and CR. Prior to the DDS operation the reset and signal column outputs (Vcol_R and Vcol_S) contain their respective signal values plus a source follower voltage threshold component. The DDS switch is activated immediately after CLAMP is turned off. The result is a difference voltage coupled to the output drivers (VR_OUT and VS_OUT) that is free of the voltage threshold component.
One problem of this circuit is that the implementation of the active pixel cell 25 continues to have the problems related to the design choice between hard reset and soft reset implementations. The choice between these implementations determine how the reset signal RST and the voltage on the drain diffusion 50 (hereafter designated as VRST) will be controlled. In the implementation illustrated in
soft reset: VRST>RST−VT (1)
where the threshold voltage VT is a variable, depending on sensor potential. Also, the theoretical equation for the noise in a soft reset system is:
In contrast, one definition of a hard reset system is where the VRST level is less than the reset signal RST minus the threshold voltage VT. This hard reset definition is illustrated in the equation:
hard reset: VRST<RST−VT (3)
And the theoretical equation for the noise in the hard reset method is:
The hard reset and soft reset equations (1) and (3) illustrate that there is a critical voltage VCR which marks the boundary between a soft reset and a hard reset. This critical voltage is defined by the equation:
critical voltage: VCR=RST−VT (5)
The advantages of the hard reset method is that it is fast and uniform, but in theory it suffers from approximately twice the reset noise problems (kTC noise) of the soft reset method. In contrast, the soft reset method has less reset noise, but causes image lag, because the reset is incomplete due to the reset transistor operating in the subthreshold region.
The present invention is directed to a method and apparatus that overcome the foregoing and other disadvantages. More specifically, the present invention is directed to a method and apparatus for reducing image lag through an improved soft reset circuit for an active pixel sensor (APS).
An improved active pixel sensor soft reset circuit for reducing image lag is provided. The active pixel sensor circuit includes a sensor for outputting a sensor potential, and a reset transistor for resetting the sensor. A buffer transistor buffers the output of the sensor, and a row select transistor is used for the read-out function. The row select transistor is coupled between the buffer transistor and a bit line. The bit line is also coupled to a loading transistor.
In accordance with one aspect of the invention, the sensor potential is pulled down to a sufficiently low level during a pull down function that may be implemented before and/or during the soft reset function. If the sensor potential is pulled down during the soft reset function, the pull down time is made to be less than the soft reset time. The low level is set between 0 and the critical potential at which the reset transistor will be on when the soft reset function starts. The timing of the pull down function should stabilize the sensor at the low potential before the actual soft reset function begins.
In accordance with another aspect of the invention, the sensor potential is pulled down by a pull-down circuit. In one embodiment, the pull-down circuit may consist of an NMOS transistor and PMOS transistor, coupled together as a CMOS inverter.
In accordance with another aspect of the invention, the sensor potential may be pulled down by the bit line. The bit line in turn, may be pulled down in a number of different ways. One way for the bit line to be pulled down is through natural discharge. A way to increase the speed with which the bit line is pulled down is to increase the bias on the loading transistor. One way to increase the bias on the loading transistor is to use a special biasing circuit to increase the bias. Another way to increase the bias on the loading transistor is to use a pull-up transistor, which may be either an NMOS transistor or a PMOS transistor.
It will be appreciated that the disclosed method and apparatus for an improved active pixel sensor soft reset circuit is able to obtain the advantages of a hard reset, while maintaining the low reset (kTC) noise of a soft reset. The image lag problem of other soft reset implementation methods is reduced. Furthermore, the active pixel sensor may be implemented using any suitable technology, such as photodiode, photogate, or pinned diode.
The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same become better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
An active pixel sensor circuit formed according to the present invention is illustrated in
An NMOS buffer transistor M2 also has its drain coupled to the voltage line VRST, while the gate of the buffer transistor M2 is coupled to the sensor potential SP1 of the sensor S1. In other embodiments, the drain of transistor M2 may be coupled to a fixed voltage such as VDD rather than the voltage line VRST. The source of the buffer transistor M2 is coupled to the drain of an NMOS row select transistor M3. The gate of the row select transistor M3 receives a row select control signal RS, while the source of the row select transistor M3 is coupled to the bit line BL1. An NMOS loading transistor M4 is coupled between the bit line BL1 and the ground. The gate of the loading transistor M4 receives a biasing control signal BIAS.
The bit line BL1 is also coupled as an input to a readout circuit 310. Readout circuit 310 receives control signals HDOB and HD1B, and outputs signals OUT1 and OUT2. The readout circuit 310 may operate similarly to the readout circuit 70 of
In a first embodiment of the invention, the voltage on the voltage line VRST is controlled by a pull-down circuit, which includes a CMOS inverter 305. The CMOS inverter circuit 305 is comprised of a PMOS transistor M5 and an NMOS transistor M6. The gates of the PMOS transistor M5 and NMOS transistor M6 are coupled together, and receive a pull-down control signal PLDN. The source of the PMOS transistor M5 is coupled to a fixed voltage level VH. The level of the fixed voltage VH is preferably set according to the following equation:
VH>VDD−VT (6)
The drain of the PMOS transistor M5 and the drain of the NMOS transistor M6 are coupled together and are also coupled to the voltage line VRST. The source of the NMOS transistor M6 is coupled to a fixed voltage level VL. The level of the fixed voltage VL is preferably set according to the following equation:
VL<VDD−VT (7)
The CMOS inverter circuit described above is able to adjust the voltage level on the voltage line VRST, as controlled by the pull-down control signal PLDN. In one embodiment, the set voltage VH may be set at VDD, while the set voltage VL is set at ground. As will be explained in more detail below with reference to the timing diagrams of
In another embodiment of the invention, the set voltage VH can be set at VDD while the set voltage VL is set at a voltage level V1. The voltage level V1 can be selected to be above ground but below the critical voltage VCR. In this embodiment, the voltage line VRST will be switched to the voltage level V1 before the soft reset function is performed, but then back to VDD after the sensor potential SP1 is pulled to is low level (below the critical voltage VCR).
Another embodiment of the invention is illustrated in
In the embodiment of
In one embodiment, the pull-up transistor M7 may be an NMOS transistor, while in another embodiment the pull-up transistor M7 may be a PMOS transistor. When the pull-up transistor M7 is a PMOS transistor, the polarity of the control signal PLDN that is applied to the gate of the transistor should be reversed. In either case, the sensor potential SP1 is pulled to low (below the critical voltage VCR) by the bit line BL1 before the soft reset function is performed. The voltage on the bit line BL1 is pulled down more quickly by the control signal PLDN causing the pull-up transistor M7 to increase the bias signal BIAS on the loading transistor M4.
It is further noted that, as illustrated in
As illustrated in
Beginning at time T7, the cycle again repeats as per the correlated double sampling process described above with reference to
Thus, as illustrated above, the present invention provides an improved method for clearing the charge in the well of the sensor S1 as part of the reset function. By pulling down the sensor potential prior to performing the soft reset function, image lag is reduced. As noted above, in the prior art methods for the soft reset implementation, image lag resulted because the reset was incomplete due to the reset transistor operating in the subthreshold region. The present invention addresses this problem by pulling down the sensor potential before the soft reset, so that a more complete reset can be performed. This method produces lower reset (kTC) noise than is normally associated with a hard reset implementation.
While the preferred embodiment of the invention has been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention. For example, the sensor S1 described above could be implemented as a photodiode, a photogate, or a pinned diode. In addition, while the sensor circuits described above have generally been shown as being constructed in NMOS, the same general principals could be equally applied to PMOS or CMOS circuits. Also, while the low voltage level has generally been illustrated as being placed on the reset voltage line before the reset function, it could also be placed on the reset voltage line during the reset function, although in such cases the pull down time should generally be made to be less than the reset time. As illustrated by these examples, one of ordinary skill in the art after reading the foregoing specification will be able to affect various changes, alterations, and substitutions of equivalents without departing from the broad concepts disclosed. It is therefore intended that the scope of the Letters Patent granted hereon be limited only by the definitions contained in the appended claims and equivalents thereof, and not by limitations of the embodiments described herein.
This application is a divisional of U.S. patent application Ser. No. 09/461,668 filed on Dec. 14, 1999, now U.S. Pat. No. 6,727,946 which is hereby incorporated by reference in its entirety.
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Number | Date | Country | |
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Number | Date | Country | |
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Parent | 09461668 | Dec 1999 | US |
Child | 10691347 | US |