ASSEMBLY FOR REPLICATING FLEXIBLE STAMPS FROM A MASTER

Abstract

An assembly includes a master for imprinting of micro-structures and nano-structures. The master has on its upper surface an active area with relief structure for imprinting of the micro-structures and nano-structures, and the master has a thickness dmaster. The assembly includes frame pieces arranged around and flushing along the outer circumference of the master, with the frame pieces having a thickness dframe. The thickness dframe of the frame pieces deviates from the thickness dmaster of the master by at most 250 µm. A a flexible stamp has improved alignment.

Description

Claims

1. An assembly comprising: a master for imprinting of micro-structures and nano-structures, the master being arranged on a substrate carrier and having on an upper surface an active area with relief structure for imprinting of the micro-structures and nano-structures, the master having a thickness dmaster:a set of frame pieces mounted on the substrate carrier and arranged around and flushing along the an outer circumference of the master, the frame pieces having a thickness dframe, wherein the thickness dframe of the frame pieces deviates from the thickness dmaster of the master by at most 250 µm.

2. The assembly according to claim 1, wherein the master is a scaled-up master, the scaled-up master being made-up from a multitude of tiled master units having on upper surfaces active areas with relief structure for imprinting of the micro-structures and nano-structures, the upper surfaces of the tiled master units forming in total the upper surface of the scaled-up master.

3. The assembly according to claim 2, wherein the set of frame pieces further comprises intermediate frame pieces which are mounted on the substrate carrier and are arranged between tiled master units and flush along side edges of the tiled master units adjoining the intermediate frame pieces.

4. The assembly according to claim 1, wherein the thickness dframe of the frame pieces differs from the thickness dmaster of the master.

5. The assembly according to claim 1, wherein the frame pieces have a width of at least 5 mm.

6. The assembly according to claim 1, wherein the frame pieces have an optically detectable relief structure on a surface being directed in the a same direction as the upper surface of the master.

7. The assembly according to claim 1 wherein the frame pieces arranged around the outer circumference of the master are shaped and oriented such that two neighboring edges per frame piece form an extrapolation of two neighboring edges of the master.

8. The assembly according to claim 1 wherein the outer circumference of the master has a non-quadratic and non-rectangular contour and the frame pieces arranged around the outer circumference of the master are shaped and arranged such that edges adjoining the master are adapted in shape and size to follow the contour of the circumference of the master while the frame pieces with the outer edges form a square or rectangle.

9. The assembly according to claim 2, the scaled-up master being made-up from tile-shaped master units, wherein adjoining edges of neighboring master units are parallel with each other and wherein the master units forming the master are arranged such that splice lines between the master units only have junctions between master units where at most three corners of neighboring master units are brought together.

10. A method of using frame pieces in an imprint process for manufacturing of a flexible stamp, comprising replicating the flexible stamp from a master having on an upper surface an active area with relief structure for imprinting of micro-structures and nano-structures, wherein the master has a thickness dmaster, arranging the frame pieces are around and flushing along an outer circumference of the master, wherein the frame pieces have a thickness dframe, wherein the thickness dframe of the frame pieces deviates from the thickness dmaster of the master by at most 250 µm and wherein master and frame pieces are mounted on a substrate carrier and are distinct from the substrate carrier.

11. The method according to claim 10 wherein the master is a scaled-up master comprising a multitude of tiled master units having on an upper surface, active areas with relief structure for imprinting of micro-structures and nano-structures, the upper surfaces of the tiled master units forming in total the upper surface of the scaled-up master and the frame pieces being arranged at least around and flushing along the outer circumference of the scaled-up master.

12. The method according to claim 10 wherein, the thickness dframe of the frame pieces is larger than the thickness dmaster of the master by at most 250 µm.

13. The method according to claim 10, wherein the frame pieces have a relief structure on the upper surface to facilitate control of resin flow during an imprint process.

14. The method according to claim 11, wherein the scaled-up master comprises tile-shaped tiled master units, wherein adjoining edges of neighboring tiled master units are parallel with each other and wherein the tiled master units are arranged in the flexible stamp such that splice lines between the sub-units only have junctions between sub-units wherein at most three corners of neighboring sub-units are brought together.

15. A flexible stamp from a master having on an upper surface an active area with relief structure for imprinting of micro-structures and nano-structures, rendered to the flexible stamp by the assembly according to claim 2 .