The present invention relates to audio solder alloy that is applicable to joining solder for connecting electronics parts on a printed circuit board which is used for an audio system or the like.
In order to improve sound quality in sound-reproducing system (audio products) as audio system, it is not only required to select electronics parts to be used in the sound-reproducing system but also to collectively study circuit design in the printed circuit board used for an amplifier constituting this sound-reproducing system, an arrangement of parts in the printed circuit board, quality of connecting wire to be used for the connecting wire (oxygen free copper etc.) between a final (output) amplifier and a speaker and the like.
Among them, the selection of electronics parts and the circuit design when using the printed circuit board have been already executed as an improvement for sound quality but in order to further improve sound quality and to provide a sound-reproducing system with high auditory sensation assessment, solder for joining the electronics parts has been noticed.
As the solder for joining the electronics parts, the (Patent Document 1) through (Patent Document 3) and the like have been known.
The Patent Document 1 relates to quaternary solder alloy in which Ni is added to (Sn.Ag.Cu), which improves any resistance to thermal shock. The Patent Document 2 relates to solder alloy to pursuit joining reliability and the like and the Patent Document 3 is an invention relating to solder alloy to improve joining reliability.
However, the above-mentioned Patent Documents 1 through 3 do not disclose that a composition of solder alloy for joining electronics parts and contained amounts thereof exert an influence on sound quality, auditory sensation assessment and the like.
Applicants of this application confirmed on the basis of various kinds of examinations that, by changing the metal composition of solder alloy and/or the contained amounts thereof, sound quality and/or auditory sensation were changed. In other words, it was understood that combination of the composition of solder alloy for joining electronics parts and contained amounts thereof were an important primary factor to improve sound quality and to acquire high auditory sensation assessment.
Accordingly, the present invention solves such a conventional problem and its object is to provide audio solder alloy that is applicable to audio system or the like which allows sound quality to be improved and allows high audio sensation assessment to be acquired.
In order to solve the problem, audio solder alloy according to the invention contains Ag of 0.8 through 1.20% by mass, Cu of 0.65 through 0.75% by mass, In of 0.002 through 0.004% by mass, Ni of 0.01 through 0.02% by mass, Pb of 0.005% or less by mass and the remainder of Sn. Selecting such composition elements and their contained amounts enables to be acquired audio solder alloy with high sound quality and high auditory assessment value.
According to the invention, senary solder alloy is configured in which (tin, Sn, argent, Ag and copper, Cu) are principle ingredients and indium, In, nickel, Ni and lead, Pb, in minuscule quantities, are added thereto, and their contained amounts are set to their appropriate values so that it is possible to accomplish audio solder alloy with high sound quality and high auditory assessment.
Next, a case where an example of audio solder alloy according to the invention is applied to joining solder for jointing electronics parts which are used for a circuit system constituting the above-mentioned audio system will be described more in detail referring to drawings and the like.
As the joining solder which could exert any influence on any sound quality and/or auditory assessment, pieces of audio solder alloy which were presented to the auditory assessment were prepared.
(1) Auditory Audio Solder Alloys:
As the joining solder for joining the electronics parts, ternary flux cored solder alloy (solder alloy made of tin, Sn, argent, Ag and copper, Cu), which is the most widely used as the joining solder for joining the electronics parts, is basically used.
It was confirmed by auditory tests that some metals, in minuscule quantities, were added to this ternary solder alloy to change auditory assessment so that species of the following metal were selected as trace metals based on various kinds of repeated auditory tests.
[Indium, In; Nickel, Ni; antimony, Sb; Bismuth, Bi; Iron, Fe; Arsenic, As; and Lead, Pb]
Since lead, Pb is a trace element contained in tin, Sn constituting the ternary solder alloy, the auditory assessment was actually carried out on the senary solder alloy in which the above-mentioned trace metals were added to the quaternary solder alloy of (tin, Sn, argent, Ag and copper, Cu) and lead, Pb.
(2) Numbers of Prepared Joining Audio Solder Alloys:
As the metals, to be added, two species of metals were selected other than lead, Pb, and their amounts of addition and the amounts of addition of other quaternary metal were regulated so that the audio solder alloys were made. Nine species of audio solder alloys which had the same metal composition as each other and contained different amounts of addition thereof were actually prepared for auditory.
(3) Auditory Equipment (Auditory Assessment Device)
Since any stereophonic recording is generally performed on sound source, reproducing equipment is constituted of a pair of right and left speakers, which will be described by using only a single side one.
Further, if CD (compact disk) is sound source, any sound source reproducing apparatus such as CD player having a rotation system reproduces the sound source to listen to it when reproducing the sound source. However, any uneven rotation, eccentricity or the like may generate in the rotation when reproducing the CD sound source so that there is possibility such that any influence thereof is exerted over different portions every auditory tests, which impedes any appropriate auditory assessment. Thus, in this moment, when reproducing the sound source for the auditory tests, any sound source reproducing apparatus such as CD player having a rotation system was not directly used. In the other words, when CD was sound source, the CD player reproduced CD and any semiconductor memory such as USB memory temporarily stored it to be used as sound source so that the sound source could be reproduced under the same condition.
An audio signal from the sound source 20 is supplied to a filter circuit NW through an output amplifier 30 and is divided into two ways, middle/low range and high range, in this example. Accordingly, this filter circuit NW (NW0) is constituted of a low pass filter (LPF) 40 and a high pass filter (HPF) 50, both circuits of which are constituted using printed circuit boards (circuit boards).
An output signal from the low pass filter 40 is supplied to a speaker for middle/low range (woofer) WF through connection lines La, Lb. Similarly, an output signal from the high pass filter 50 is supplied to a speaker for high range (tweeter) TW through connection lines Lc, Ld.
This low pass filter 40 actually utilizes a printed circuit board 46, as shown in
As a result thereof, the output amplifier 30 is not soldered to the low pass filter 40 but is screwed thereon (or inserted thereto). The low pass filter 40 is also not soldered to the connection lines La, Lb which connect the speaker WF but is mechanically screwed thereon.
As a result thereof, the low pass filter 40 shown in
The reason why the screw (insert) terminals 47, 48 are used as the terminals is because plural filter circuits NW, which will be described later, are easily exchanged to listen to and compare them.
Terminals 52A and the speaker for high range reproduction TW are respectively connected by the connection lines Lc, Ld. A pair of attenuation resistances 56, 58 are connected in series between a side of the terminal 52A and a terminal 56a and a terminal 56b is led from a middle connection point thereof. The terminals 56a, 56b are used for attenuation of the output signal depending on the situation.
This high pass filter 50 also actually utilizes a printed circuit board 66, as shown in
As a result thereof, the high pass filter 50 shown in
The reason why the screw (insert) terminals 67, 68 are used as the terminals is because plural filter circuits NW, which will be described later, are easily exchanged to listen to and compare them.
(4) Specification of Audio Solder Alloys to be used as Auditory Test
The audio solder alloy to be now used for auditory assessment contains metal (of Sn.Ag.Cu) (metal elements) as the base thereof and a trace of Pb, as described above, in addition to two optional species of elements among In, Ni, Sb, Bi, Fe and As as a trance of added metal.
In order to enhance auditory assessment accuracy and find out better audio solder alloy, in the following examples, four species of metal elements (of Sn.Ag.Cu.Pb) are selected as the base among the above-mentioned 10 species of metal (of Sn.Ag.Cu.Pb.In.Ni.Sb.Bi.Fe.As) and two species of metal are optionally extracted from the remaining (six species) of metal so that the audio solder alloy (senary solder alloy) is made of a set of six species of metals.
Further, even when they have the same composition metals, by changing their contained amounts (amounts of addition), a set of nine species of the audio solder alloys is prepared in this embodiment so that they are used as the joining solder for auditory assessment.
Further, a total of 15 species of the audio solder alloys in which a combination of the extracted composition metals were changed was prepared and the auditory assessment was carried out using filter circuits NW in which these audio solder alloys were used as the joining solder.
Therefore, as shown in
Metal elements (of Sri.Ag.Cu.Pb) to be commonly used in the audio solder alloy are shown out of the table.
(5) Optimal Audio Solder Alloys
As a result of the auditory assessment, senary solder alloy (of Sn.Ag.Cu.In.Ni.Pb) in which and a trace of lead, Pb, a trace of indium, In and a trace of nickel, Ni were added to (tin, Sn.argent, Ag.copper, Cu) and amounts of addition thereof were appropriately selected, had the highest auditory assessment value (the maximum value thereof is 5.0).
Specific examples thereof will be described later but it is necessary to verify whether or not the highest auditory assessment by listeners is the appropriate auditory assessment.
Higher auditory sensation assessment satisfied by improving sound quality is only assessments by the listeners so that even if assessing persons are audio specialists, variation in their assessment (auditory assessment values) arises. As one means (quantitative means) to verify whether or not the variation in their assessment was small, general sound sources, which were often used for auditory assessment, were first sampled. Items of auditory assessment were then set. Next, the auditory assessment was analyzed using multiple correlation model which utilized correlations between the auditory assessment value and the predictive (estimation or theoretical) value.
(6) Samples of Sound Sources and Items of Auditory Assessment
As the general sound sources, which were often used for auditory assessment, the following three pieces of music (on popular music, classic music and vocal) were referred. The sound source 20 in which CD had been reproduced and had been once stored was used.
(i) Vincent
(ii) Carmen ballet
(iii) Somewhere somebody
One example of items of the auditory assessment is shown in (Table 2). In this example, a total of 10 items of the auditory assessment from low range property to instrument property were performed on the basis of 5 points and their mean values were estimated as the auditory assessment values.
(7) Analysis of Auditory Assessment
The analysis of auditory assessment is performed so that, as described above, the multiple correlation analysis is respectively performed on a set of audio solder alloy constituted of extracted senary composition alloy, each of which contains 9 species of audio solder alloy having different amounts of addition, and the same is also performed on 15 kinds of audio solder alloy constituted of different composition metals. The most multiple correlation of this multiple correlation analysis was estimated as the audio solder alloy of the highest auditory assessment (in this invention).
In the following examples, the multiple correlation analysis provided with Excel (registered trade mark) was used as an analysis tool. In this example, a main component made of (Sn.Ag.Cu) and plural species (therefore, three species) of metal elements to be added were respectively set as explanatory variables (independent variables) and it was verified with the explanatory variable being changed how much a multiple correlation equation (multiple correlation model) derived from the multiple correlation analysis reflected the auditory assessment values (measured values, namely, dependent variables (objective variables), maximum value of which is 5.0).
(8) Grouping of Audio Solder Alloys and Relation to Corresponding Tables of Multiple Correlation Analysis
When performing the multiple correlation analysis, the audio solder alloys are grouped into the ones shown in the (Table 1).
(A) Audio Solder Alloys of Group 1
The composition of the audio solder alloys of this group is [Audio solder alloys of group 1: (Sr.Ag.Cu.In.Ni.Pb)].
The corresponding tables indicating results of the multiple correlation analysis when using the audio solder alloys are shown as (Tables 3 through 5) and (Tables 6 through 8) among the combination examples of (Table 1). The (Tables 3 through 5) indicate results of the multiple correlation analysis of the audio solder alloys according to this invention.
It is to be noted that solder alloy shown in data 7 is a solder alloy which is a typical solder alloy as lead-free solder composed of almost (Sn.3AG.0.5Cu) so that the assessment has been performed on the basis of this solder alloy.
In the (Table 3), (this example 1) and (this example 2) indicate composition elements of the audio solder alloys according to this invention and their contained amounts (% by mass (Wt %). The auditory assessment values are dependent variables, namely, measured values and the explanatory variables are the contained amounts of Ag, Cu, In, Ni and Pb (amounts of their additions). (Table 4) and (Table 5) indicate results of the multiple correlation analysis of the audio solder alloys containing their contained amounts.
Based on (Table 3) and (Table 5), the multiple correlation equation in this case is as follows. A predictive value is estimated as y.
y=0.1104879Ag+0.072135Cu+376.93035In+4.651292Ni−45.72814Pb+3.6386376 (1)
Here, since the multiple correlation coefficient of Pb indicates minus, it is said that an amount of addition of Pb is preferably as small as possible. Pb is contained in high-purity Sn so that a trace of In and/or Ni is added to order to prevent Pb from having impact thereon as much as possible.
As shown in (Table 4), since a multiple correlation coefficient R between the predictive value y by the multiple correlation equation and actual auditory assessment value Y is [0.9814333], this is closely near (1.0) so that it is understood that they have very strong correlation.
Since the multiple determination R2 (coefficient of determination: R square) is [0.9632113] and the correction R2 (adjusted R square of coefficient of determination R2) is [0.9018968], it is understood that fitting ratio (fitting accuracy) of this multiple correlation equation y is very good.
Further, since, in the table of analysis of variance shown in (Table 5), the significant F is [0.023169979], the correlation occurs with a probability of 97.7% (=100%-2.3%) so that it is said that reliability of the multiple correlation equation y, which is calculated from the multiple correlation coefficients shown in (Table 3) and (Table 5), is considerably high.
Therefore, it is said that the auditory assessment value Y, [5.0], which is maximum assessment value, of each of the audio solder alloys of the (this example 1) and (this example 2) shown in (Table 3) is very reliable assessment value. Thus, it is understood that combination of composition elements of the audio solder alloys shown in (this example 1) and (this example 2) and their contained amounts (amounts of addition) are suitable for the joining solder which allows high sound quality and high auditory assessment value to be obtained.
In (Table 3), as preferable examples of the suitable audio solder alloys, the audio solder alloys shown within a range of (this example 1) and (this example 2) have been illustrated.
The contained amounts in this audio solder alloys are (Sn.Ag (of 1.0 through 1.01% by mass).Cu (of 0.71 through 0.72% by mass).In (of 0.003 through 0.0037% by mass).Ni (of 0.016 through 0.017% by mass).Pb (of 0.0025 through 0.0035% by mass)
The contained amounts in the audio solder alloys according to this invention are not limited thereto: They can be extended to the following region.
(Region of Contained Amounts in Audio Solder Alloys According to This Invention)
(Sn (remainder).Ag (of 0.8 through 1.20).Cu (of 0.65 through 0.75).In (of 0.002 through 0.004).Ni (of 0.01 through 0.02).Pb (=<0.005)).
On the other hand, (Table 3) indicates the auditory assessment values of items of the data 1 through the data 7 indicated as the comparison examples. Similarly, (Table 4) and (Table 5) indicate the results of the multiple correlation analysis on the auditory time when the contained amounts are changed in each of the same composition elements.
In (Table 3), when their contained amounts are set like those of the data 1 through the data 7, the auditory assessment values indicate their highest value of only (4.35) even if the audio solder alloy uses the same composition metals and it is understood that they are inferior to (this example 1) and (this example 2) as the audio solder alloy.
(Table 6) through (Table 8) classified to Group 1 will indicate the cases in which the audio solder alloys have the same composition elements but their contained amounts are changed.
The data 1 through the data 6 of (Table 6) are quite identical to the data 1 through the data 6 of the above-mentioned (Table 3) and the data 8 through the data 10 of (Table 6) are newly added thereto. Since the data 7 of (Table 3) is the referenced solder as described above, it is omitted from the assessment of (Table 6).
(Table 6) indicates the auditory assessment values Y (dependent variables as the measured values) and the explanatory variables of the data 1 through the data 6 and the data 8 through the data 10. (Table 7) and (Table 8) indicate results of the multiple correlation analysis.
It is understood from the results of the multiple correlation analysis that the results have been considerably different to each other if the same composition elements are contained but their contained amounts are changed, a detailed explanation of which will be omitted.
By the way, values the multiple correlation R thereof and the coefficient of determination R2 thereof are good but values of the adjusted R square of coefficient of determination R2 (correction R2) thereof and the significant F thereof are no good so that the predictive value y and the auditory assessment value Y are not sufficiently correlated and the auditory assessment value Y has its maximum value of only (4.33). Therefore, it is not said that they are the optimal audio solder alloy.
It is to be noted that the audio solder alloys having the same composition elements are used as the joining solder for 12 filter circuits NW (NW01 through NW012) so that the audio solder alloy having the contained amounts shown in (this example 1) is used for the filter circuit NW01 and the audio solder alloy having the contained amounts shown in (this example 2) is used for the filter circuit NW02. Similarly, in the filter circuits NW03 through NW012, the audio solder alloys shown in the data 1 through the data 10 are used and the sound quality thereof and the auditory thereof are assessed.
(9) Auditory Assessments of Other Grouped Audio Solder Alloys
The following audio solder alloys of groups 2 through 5 will indicate items of the data, all of which indicate that the auditory assessments like (this example 1) and (this example 2) cannot be acquired.
The following will show the result thereof.
(B) Audio Solder Alloys of Group 2
Composition of the audio solder alloys of this group is the one in which Pb and Sb are common added metals and, as shown in (Table 1), “Audio solder alloy of group 2: Any one of (Bi, Fe, As, In and Ni) is added into (Sn.Ag.Cu.Sb.Pb)”. Therefore, there are 5 species of audio solder alloys.
The corresponding tables indicating the results of the multiple correlation analysis when using these audio solder alloys are (Table 9 through Table 23).
(1) (Table 9 through Table 11): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Bi.Pb);
(2) (Table 12 through Table 14): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Fe.Pb);
(3) (Table 15 through Table 17): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.As.Pb);
(4) (Table 18 through Table 20): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.In.Pb); and
(5) (Table 21 through Table 23): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Ni.Pb).
(a) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Bi.Pb): (Table 9 through Table 11).
As being made clear from (Table 9) through (Table 11), it is difficult to say that they are the optimal audio solder alloys.
(b) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Fe.Pb): (Table 12 through Table 14).
As being made clear from (Table 12) through (Table 14), it is difficult to say that they are the optimal audio solder alloys.
(c) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.As.Pb): (Table 15 through Table 17).
As being made clear from (Table 15) through (Table 17), it is difficult to say that they are the optimal audio solder alloys.
(d) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.In.Pb): (Table 18 through Table 20).
As being made clear from (Table 18) through (Table 20), it is difficult to say that they are the optimal audio solder alloys.
(e) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Sb.Ni.Pb): (Table 21 through Table 23).
As being made clear from (Table 21) through (Table 23), it is difficult to say that they are the optimal audio solder alloys.
(C) Auditory Assessments of Audio Solder Alloys of Group 3
Composition of the audio solder alloys of this group is the one in which Pb and Bi are common added metals to ((Sn.Ag.Cu) and “Audio solder alloy of group 3: Any one of (Fe, As, In and Ni) is added into (Sn.Ag.Cu.Bi.Pb)”. Therefore, there are 4 species of audio solder alloys.
The corresponding tables indicating the results of the multiple correlation analysis when using these audio solder alloys are (Table 24 through Table 35).
(1) (Table 24 through Table 26): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.Fe.Pb);
(2) (Table 27 through Table 29): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.As.Pb);
(3) (Table 30 through Table 32): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.In.Pb); and
(4) (Table 33 through Table 35): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.Ni.Pb).
(a) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.Fe.Pb): (Table 24 through Table 26).
As being made clear from (Table 24) through (Table 26), it is difficult to say that they are the optimal audio solder alloys.
(b) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.As.Pb): (Table 27 through Table 29).
As being made clear from (Table 27) through (Table 29), it is difficult to say that they are the optimal audio solder alloys.
(c) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.In.Pb): (Table 30 through Table 32).
As being made clear from (Table 30) through (Table 32), it is difficult to say that they are the optimal audio solder alloys.
(d) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Bi.Ni.Pb): (Table 33 through Table 35).
As being made clear from (Table 33) through (Table 35), it is difficult to say that they are the optimal audio solder alloys.
(D) Auditory Assessments of Audio Solder Alloys of Group 4
Composition of the audio solder alloys of this group is the one in which Pb and Fe are common added metals to (Sn.Ag.Cu) and “Audio solder alloy of group 4: Any one of (As, In and Ni) is added into (Sn.Ag.Cu.Fe.Pb)”. Therefore, there are 3 species of audio solder alloys.
The corresponding tables indicating the results of multiple correlation analysis when using these audio solder alloys are (Table 36 through Table 44).
(1) (Table 36 through Table 38): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.As.Pb);
(2) (Table 39 through Table 41): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.In.Pb); and
(3) (Table 42 through Table 44): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.Ni.Pb).
(a) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.As.Pb): (Table 36 through Table 38).
As being made clear from (Table 36) through (Table 38), it is difficult to say that they are the optimal audio solder alloys.
(b) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.In.Pb): (Table 39 through Table 41).
As being made clear from (Table 39) through (Table 41), it is difficult to say that they are the optimal audio solder alloys.
(c) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.Fe.Ni.Pb): (Table 42 through Table 44).
As being made clear from (Table 42) through (Table 44), it is difficult to say that they are the optimal audio solder alloys.
(E) Audio Solder Alloy of Group 5
Composition of the audio solder alloys of this group is the one in which Pb and As are common added metals to (Sn.Ag.Cu) and “Audio solder alloy of group 5: Any one of (In and Ni) is added into (Sn.Ag.Cu.As.Pb). Therefore, there are 2 species of audio solder alloys.
The corresponding tables indicating the results of multiple correlation analysis when using these audio solder alloys are (Table 45 through Table 50).
(1) (Table 45 through Table 47): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.As.In.Pb); and
(2) (Table 48 through Table 50): The results of analysis of the audio solder alloy made of (Sn.Ag.Cu.As.Ni.Pb).
(a) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.As.In.Pb): (Table 45 through Table 47).
As being made clear from (Table 45) through (Table 47), it is difficult to say that they are the optimal audio solder alloys.
(b) The following will indicate the results of analysis of the audio solder alloy made of (Sn.Ag.Cu.As.Ni.Pb): (Table 48 through Table 50).
As being made clear from (Table 48) through (Table 50), it is difficult to say that they are the optimal audio solder alloys.
The above-mentioned groups 2 through 5 relate to sound quality and auditory assessments of the audio solder alloys which are obtained by adding any optional 2 species of metals among (Bi, Fe, As, In and Ni) excluding a pair of (In, Ni) into (Sn.Ag.Cu.Sb.Pb) and the senary audio solder alloys made of these combinations cannot obtain any excellent sound quality and high auditory assessment values as indicated in (Table 9) through (Table 50).
As described above, according to this invention, as the joining solder used for the filter circuit or the like, an electronic circuit of which is configured by soldering discrete parts on the printed circuit board (circuit board), the audio solder alloys which contain the senary solder alloy, (Sn.Ag.Cu.Sb.In.Ni.Pb), as shown in group 1 and have their appropriate contained amounts have been developed to acquire excellent sound quality and high auditory assessment.
The auditory assessment device 10 shown in
Although the flux cored solder has been used as the audio solder alloy, this invention is not limited thereto: Solder ball, solder paste or the like may be used. Configuration and shape thereof are not limited. Further, in the soldering method, any methods using a reflow furnace, a jet solder bath or the like may be used. Further, although the description has been performed using the discrete parts as electronics parts, chip typed electronics parts may be used.
Additionally, in the above-mentioned examples, as the solder for joining the electronics parts, it has been applied to the filter circuit, but the audio solder alloy according to the invention are applicable as the solder for connecting the electronics parts constituting whole of audio system, If so, further improved sound quality may be expected.
The audio solder alloy according to the invention is applicable for the joining solder which is used for soldering various kinds of electronics parts used for audio system on the printed circuit board (circuit board).
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2012/062009 | 5/10/2012 | WO | 00 | 6/20/2013 |