Backlight unit equipped with light emitting diodes

Abstract

Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic diagram showing a backlight unit equipped with LEDs according to a preferred embodiment of the present invention;

FIG. 2 is an enlarged partial plan view showing the principal parts of the backlight unit of FIG. 1;

FIG. 3 is a schematic partial sectional view taken along line A-A of FIG. 2; and

FIG. 4 is a schematic partial sectional view showing a conventional backlight unit equipped with LEDs.

Claims

1. A backlight unit equipped with Light-Emitting Diodes (LEDs), comprising: an insulating substrate provided with predetermined circuit patterns on one surface thereof;a plurality of LED packages mounted above the insulating substrate and electrically connected to the circuit patterns;an upper heat dissipation plate formed on the insulating substrate, and configured to come into contact with the circuit patterns and to dissipate heat generated in the LED packages; anda lower heat dissipation plate formed on a remaining surface of the insulating substrate, and configured to transmit heat transmitted through the upper heat dissipation plate;wherein the upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole that passes through the insulating substrate and is plated with plating material on an inner wall thereof, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

2. The backlight unit as set forth in claim 1, wherein the upper heat dissipation plate and the lower heat dissipation plate are made of copper and each have a thickness of about 0.35 μm.

3. The backlight unit as set forth in claim 1, wherein the area ratio of the through hole and the upper heat dissipation plate ranges from 1:10 to 1:300.

4. The backlight unit as set forth in claim 1, wherein the insulating substrate is provided with an insulating film, and the insulating film is configured to cover the lower heat dissipation plate and is applied through sputtering or spraying.

5. The backlight unit as set forth in claim 4, wherein the insulating film has a thickness of about 0.35 μm.