by printed thermal vias

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H05K1/0206

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0206by printed thermal vias

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Patents Grantslast 30 patents

Information Patent Grant
Data throughput using a fin stack
- Patent number 12,363,820
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 12,313,886
- Issue date May 27, 2025
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting module with compact converter circuit
- Patent number 12,313,249
- Issue date May 27, 2025
- Valeo Vision
- Alexandre Val
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and electronic-component mount multilayer...
- Patent number 12,274,002
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming engineered thermal paths of printed circuit boa...
- Patent number 12,262,464
- Issue date Mar 25, 2025
- Matthew D. Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
- Patent number 12,225,662
- Issue date Feb 11, 2025
- Valeo Vision
- Alexandre Val
- F21 - LIGHTING
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensor package and camera device including same
- Patent number 12,160,946
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Seong Su Eom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Formed waveguide antennas of a radar assembly
- Patent number 12,058,804
- Issue date Aug 6, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked image sensor
- Patent number 12,035,060
- Issue date Jul 9, 2024
- OmniVision Technologies, Inc.
- Zhiyong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic switch module with oppositely-arranged power switches an...
- Patent number 12,010,799
- Issue date Jun 11, 2024
- BLACK & DECKER INC.
- Joshua M. Lewis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printed circuit board
- Patent number 12,004,287
- Issue date Jun 4, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High intensity narrow spectrum and far UVC protection device
- Patent number 11,991,817
- Issue date May 21, 2024
- LUX LIGHTING SYSTEMS LLC
- Jonathan Eric Fay
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20250214324
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi KISHIMOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20250194009
- Publication date Jun 12, 2025
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE HAVING SAME
- Publication number 20250185152
- Publication date Jun 5, 2025
- K-TRONICS (SUZHOU) TECHNOLOGY CO., LTD.
- Honglei XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...
- Publication number 20250164568
- Publication date May 22, 2025
- Garrett Transportation I Inc.
- Jaroslav Pekar
- B60 - VEHICLES IN GENERAL
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND AN INDUCTION COOKTOP INCLUDING THE PRINTE...
- Publication number 20250119988
- Publication date Apr 10, 2025
- Whirlpool Corporation
- Andrea Gallivanoni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
- Publication number 20250106979
- Publication date Mar 27, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20250081328
- Publication date Mar 6, 2025
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
- Publication number 20250048533
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW SWITCHING LOSS INVERTER CIRCUIT BOARD
- Publication number 20250048537
- Publication date Feb 6, 2025
- Garrett Transportation I Inc.
- Ludek Zavodny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250044733
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- JUNYA HONDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250048552
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
- Publication number 20250016908
- Publication date Jan 9, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20240418943
- Publication date Dec 19, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363479
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240324689
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
- Publication number 20240314919
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Paul Theodore ARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY
- Publication number 20240306287
- Publication date Sep 12, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Tahir Cader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
- Publication number 20240292576
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by printed thermal vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Data throughput using a fin stack

Circuit board assembly and manufacturing method thereof

Data processing systems including optical communication modules

Light-emitting module with compact converter circuit

Power electronics assemblies having power electronics devices embed...

Multilayer circuit board and electronic-component mount multilayer...

Methods for forming engineered thermal paths of printed circuit boa...

Printed circuit board and electronic device including same

Circuit board and method for manufacturing the same

Electronic control device

Motor vehicle lighting module comprising a ceramic substrate

Embeddable electrically insulating thermal connector and circuit bo...

Substrate for mounting electronic element, electronic device, and e...

Power semiconductor component and method for producing a power semi...

Heat removal architecture for stack-type component carrier with emb...

Image sensor package and camera device including same

Package carrier with improved heat dissipation efficiency and manuf...

Method and procedure for miniaturing a multi-layer PCB

Printed circuit board and camera device comprising same

Circuit board and method for producing circuit board

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board comprising via

System and method for creating orthogonal solder interconnects

Compact memory device having a backup power source

Formed waveguide antennas of a radar assembly

Circuit board with heat dissipation function

Stacked image sensor

Electronic switch module with oppositely-arranged power switches an...

Printed circuit board

High intensity narrow spectrum and far UVC protection device

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

Thermal Management in Circuit Board Assemblies

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

CIRCUIT BOARD AND DISPLAY DEVICE HAVING SAME

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...

Component Carrier With Embedded Electronic Switch Components and a...

PRINTED CIRCUIT BOARD AND AN INDUCTION COOKTOP INCLUDING THE PRINTE...

Embeddable Electrically Insulating Thermal Connector and Circuit Bo...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE

LOW SWITCHING LOSS INVERTER CIRCUIT BOARD

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

MANUFACTURING METHOD OF PACKAGE CARRIER

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY

Cooling Methodology for Package-on-Package Structures

Method of Producing a PCB, as well as a PCB, and a Circuit Board

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

PRINTED CIRCUIT BOARD

INKJET PRINTING DEDICATED TEST PINS

CERAMIC METAL COMPOSITE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

ELECTRONIC CIGARETTE

ELECTRONIC SYSTEM

ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT

EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...