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ELECTRICITY
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Electric techniques
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Printed circuits
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H05K1/0206
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic control device
Patent number
12,225,659
Issue date
Feb 11, 2025
Hitachi Astemo, Ltd.
Miki Hiraoka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
Patent number
12,225,662
Issue date
Feb 11, 2025
Valeo Vision
Alexandre Val
F21 - LIGHTING
Information
Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
Patent number
12,200,853
Issue date
Jan 14, 2025
KYOCERA AVX Components Corporation
Cory Nelson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate for mounting electronic element, electronic device, and e...
Patent number
12,193,145
Issue date
Jan 7, 2025
Kyocera Corporation
Yukio Morita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power semiconductor component and method for producing a power semi...
Patent number
12,165,950
Issue date
Dec 10, 2024
Vitesco Technologies GmbH
Christina Quest-Matt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat removal architecture for stack-type component carrier with emb...
Patent number
12,167,529
Issue date
Dec 10, 2024
AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
Abderrazzaq Ifis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Image sensor package and camera device including same
Patent number
12,160,946
Issue date
Dec 3, 2024
LG Innotek Co., Ltd
Seong Su Eom
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
Patent number
12,156,325
Issue date
Nov 26, 2024
Unimicron Technology Corp.
Ming-Hao Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and procedure for miniaturing a multi-layer PCB
Patent number
12,150,237
Issue date
Nov 19, 2024
VEEA INC.
Robert Migliorino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and camera device comprising same
Patent number
12,144,103
Issue date
Nov 12, 2024
LG Innotek Co., Ltd
Do Hyuk Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and method for producing circuit board
Patent number
12,133,328
Issue date
Oct 29, 2024
Murata Manufacturing Co., Ltd.
Tomoki Kato
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
Patent number
12,114,416
Issue date
Oct 8, 2024
Mellanox Technologies, Ltd.
Elad Mentovich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board comprising via
Patent number
12,108,531
Issue date
Oct 1, 2024
LG Innotek Co., Ltd
Kyo Hun Koo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System and method for creating orthogonal solder interconnects
Patent number
12,108,542
Issue date
Oct 1, 2024
Raytheon Company
Justin A. Kasemodel
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compact memory device having a backup power source
Patent number
12,062,409
Issue date
Aug 13, 2024
Pliops Ltd
Naseem Jamal
G11 - INFORMATION STORAGE
Information
Patent Grant
Formed waveguide antennas of a radar assembly
Patent number
12,058,804
Issue date
Aug 6, 2024
Aptiv Technologies AG
Scott D. Brandenburg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with heat dissipation function
Patent number
12,052,827
Issue date
Jul 30, 2024
Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
Pan Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked image sensor
Patent number
12,035,060
Issue date
Jul 9, 2024
OmniVision Technologies, Inc.
Zhiyong Zhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic switch module with oppositely-arranged power switches an...
Patent number
12,010,799
Issue date
Jun 11, 2024
BLACK & DECKER INC.
Joshua M. Lewis
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Printed circuit board
Patent number
12,004,287
Issue date
Jun 4, 2024
Telefonaktiebolaget LM Ericsson (publ)
Pinghua Duan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High intensity narrow spectrum and far UVC protection device
Patent number
11,991,817
Issue date
May 21, 2024
LUX LIGHTING SYSTEMS LLC
Jonathan Eric Fay
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Data processing systems including optical communication modules
Patent number
11,988,874
Issue date
May 21, 2024
Nubis Communications, Inc.
Peter Johannes Winzer
G02 - OPTICS
Information
Patent Grant
Circuit board with heat dissipation structure and method for manufa...
Patent number
11,979,977
Issue date
May 7, 2024
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Hsiao-Ting Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High-power die heat sink
Patent number
11,948,853
Issue date
Apr 2, 2024
QUALCOMM Technologies Incorporated
Jose Moreira
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-power die heat sink with vertical heat path
Patent number
11,929,299
Issue date
Mar 12, 2024
QUALCOMM Incorporated
Jose Moreira
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board (PCB) including heatsinks
Patent number
11,924,962
Issue date
Mar 5, 2024
Dell Products L.P.
Umesh Chandra
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed-circuit isolation barrier for co-site interference mitigation
Patent number
11,924,963
Issue date
Mar 5, 2024
Raytheon Company
David D. Crouch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in circuit board assemblies
Patent number
11,910,520
Issue date
Feb 20, 2024
Kuprion Inc.
Alfred A. Zinn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible circuit board and chip package having a chip mounting region
Patent number
11,903,119
Issue date
Feb 13, 2024
LG Innotek Co., Ltd
Chae Won Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric machine
Patent number
11,894,732
Issue date
Feb 6, 2024
SPAL Automotive S.R.L.
Pietro De Filippis
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
Publication number
20250048533
Publication date
Feb 6, 2025
Murata Manufacturing Co., Ltd.
Nobuo IKEMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LOW SWITCHING LOSS INVERTER CIRCUIT BOARD
Publication number
20250048537
Publication date
Feb 6, 2025
Garrett Transportation I Inc.
Ludek Zavodny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
Publication number
20250044733
Publication date
Feb 6, 2025
Canon Kabushiki Kaisha
JUNYA HONDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
Publication number
20250048552
Publication date
Feb 6, 2025
Canon Kabushiki Kaisha
SHUICHI NAKAMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
Publication number
20250040026
Publication date
Jan 30, 2025
Unimicron Technology Corp.
Ming-Hao Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
Publication number
20250040028
Publication date
Jan 30, 2025
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Patrick LENHARDT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
Publication number
20250016908
Publication date
Jan 9, 2025
Telefonaktiebolaget LM Ericsson (publ)
Agneta Ljungbro
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cooling Methodology for Package-on-Package Structures
Publication number
20250006673
Publication date
Jan 2, 2025
Intel Corporation
Siva Prasad JANGILI GANGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
Publication number
20240422894
Publication date
Dec 19, 2024
Telefonaktiebolaget LM Ericsson (publ)
Agneta Ljungbro
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20240422908
Publication date
Dec 19, 2024
LG Innotek Co., Ltd.
Kyo Hun KOO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INKJET PRINTING DEDICATED TEST PINS
Publication number
20240421105
Publication date
Dec 19, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
Publication number
20240418943
Publication date
Dec 19, 2024
Nubis Communications, Inc.
Peter Johannes Winzer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
Publication number
20240363479
Publication date
Oct 31, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
KAI-MOU CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
Publication number
20240357730
Publication date
Oct 24, 2024
Harman Becker Automotive Systems GmbH
Paul-Alexandru BILIGA-NISIPEANU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC CIGARETTE
Publication number
20240324689
Publication date
Oct 3, 2024
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
Jinyang Li
G01 - MEASURING TESTING
Information
Patent Application
ELECTRONIC SYSTEM
Publication number
20240314920
Publication date
Sep 19, 2024
MEDIATEK INC.
Tso-Ju YI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
Publication number
20240314919
Publication date
Sep 19, 2024
ADVANCED MICRO DEVICES, INC.
Paul Theodore ARTMAN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY
Publication number
20240306287
Publication date
Sep 12, 2024
MELLANOX TECHNOLOGIES, LTD.
Tahir Cader
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
Publication number
20240292541
Publication date
Aug 29, 2024
Black & Decker Inc.
Joshua M. Lewis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
Publication number
20240292576
Publication date
Aug 29, 2024
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLU...
Publication number
20240290685
Publication date
Aug 29, 2024
NXP USA, Inc.
Eduard Jan Pabst
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
Publication number
20240260237
Publication date
Aug 1, 2024
Western Digital Technologies, Inc.
Wei Hong Tew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT
Publication number
20240255132
Publication date
Aug 1, 2024
Valeo Vision
Alexandre VAL
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
Publication number
20240260168
Publication date
Aug 1, 2024
VITESCO TECHNOLOGIES GMBH
Detlev Bagung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal Management in Circuit Board Assemblies
Publication number
20240206048
Publication date
Jun 20, 2024
Kuprion Inc.
Alfred A. Zinn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMMUNICATION CHIP PACKAGE WITH ANTENNA AND HEAT DISSIPATION GROUND
Publication number
20240178123
Publication date
May 30, 2024
Korea Electronics Technology Institute
Soo Chang CHAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPROVED DATA THROUGHPUT USING A FIN STACK
Publication number
20240172355
Publication date
May 23, 2024
Micron Technology, Inc.
Suresh Reddy Yarragunta
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WIRING MODULE AND IMAGING APPARATUS
Publication number
20240130034
Publication date
Apr 18, 2024
Sony Semiconductor Solutions Corporation
YUTARO YAMASHITA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
Publication number
20240114614
Publication date
Apr 4, 2024
ICP TECHNOLOGY CO., LTD.
HO-CHIEH YU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SWITCHING POWER CONVERTER MODULE WITH A HEAT DISSIPATION STRUCTURE
Publication number
20240098876
Publication date
Mar 21, 2024
Navitas Semiconductor Limited
Xiucheng Huang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR