Patent Application
20060141348
The present invention relates to computer systems; more particularly, the present invention relates to dissipating heat generated while providing power to a computer system.
Mobile computer systems, such as notebook computers, include one or more battery packs to provide power to the system whenever a permanent power source is not available. However, the high battery operational ambient temperature environment found in most notebook computers is the major contributor to the premature failure of the battery pack.
Generally, the heat sources within the notebook may originate from the battery itself which generates heat during charging and discharging. This becomes more apparent as the battery ages, with its internal impedance increases as it ages. Moreover, thermal generation will continue to become more of a concern as overall system power continues to rise as a result of increasing subsystem and component performance for the CPU, chipset, peripherals, voltage regulators, etc.
The invention is illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which:
A battery pack cooling mechanism is described. In the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.
Reference in the specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.
A chipset 107 is also coupled to bus 105. Chipset 107 includes a memory control hub (MCH) 110. MCH 110 may include a memory controller 112 that is coupled to a main system memory 115. Main system memory 115 stores data and sequences of instructions that are executed by CPU 102 or any other device included in system 100. In one embodiment, main system memory 115 includes dynamic random access memory (DRAM); however, main system memory 115 may be implemented using other memory types. Additional devices may also be coupled to bus 105, such as multiple CPUs and/or multiple system memories.
MCH 110 is coupled to an input/output control hub (ICH) 140 via a hub interface. ICH 140 provides an interface to input/output (I/O) devices within computer system 100. In addition, computer system 100 includes a power supply 165 and a multitude of voltage regulators that are used to provide power to various components within computer system 100. CPU voltage regulator module (VRM) 160 provides voltage to CPU 102. VRM 175 supplies voltage for both MCH 110 and ICH 140 within chipset 107.
In addition, motherboard 200 includes a battery pack 265 and a battery connector 268. Battery pack 265 represents the power supply 165 that provides power to the components of motherboard 200. Connector 268 serves as an interface between battery pack 265 and motherboard 200 where the battery pack 265 power is provided to motherboard 200.
Battery pack 265 includes cylindrical battery cells 340, thermal plates 350 and covering piece 360. Note that other battery cell geometries may also be incorporated, such as a prismatic battery. In this embodiment, battery cells 340 are cylindrical battery cells that provide power to computer system 100. Thermal plates 350 include a thermal conductive material which is integrated on the battery pack 265 housing. The thermal conductive material may include copper, graphite fiber, aluminum, heat pipes, etc. In one embodiment, thermal plates 350 are mounted in parallel with battery cells 340. However in other embodiments, thermal plates 350 may be mounted perpendicular to battery cells 340.
Thermal plates 350 are coupled to cover piece 360, which is located at the rear of the battery pack. In one embodiment, cover piece 360 extends out from chassis 300 to provide additional space for a battery pack 340. In a further embodiment, cover piece 360 includes passive heat convection and radiating fins to enable thermal energy to dissipate via natural convection or radiation cooling. Moreover, for the above-described the cylindrical battery pack 265 design, the corner areas of cover piece 360 are utilized for the passive fin design. In other embodiments, the system exhaust may be used to increase heat transfer from these extended surfaces.
In one embodiment, cover piece 360 also includes vent holes to assist the venting of the heat from the heat radiating fins. Further, heat spreading and dissipation may be augmented with heat pipes, system venting, and forced air cooling. In a further embodiment, the above-described mechanism is also be extended to dissipate thermal energy generated by circuit 320, which is typically overlooked in the thermal design of chassis 300 because of the transitory nature of circuit 320.
The thermal design of above-described battery pack lowers the battery pack temperature, and reduces the cooling penalty on the remainder of a notebook system (e.g., charging system), thereby extending the life span of the battery and potentially other components in the system.
Whereas many alterations and modifications of the present invention will no doubt become apparent to a person of ordinary skill in the art after having read the foregoing description, it is to be understood that any particular embodiment shown and described by way of illustration is in no way intended to be considered limiting. Therefore, references to details of various embodiments are not intended to limit the scope of the claims which in themselves recite only those features regarded as essential to the invention.
