Claims
- 1. A bead inductor comprising:a conductor coil defined by a wound, coated metallic wire, an insulation coating on both end portions including longitudinally extending portions of said conductor coil being removed therefrom; a molded body being arranged such that said coil conductor is embedded in the molded body so that the end portions of said conductor coil, from which the insulation coating is removed, are exposed at both end portions of said molded body; and external terminals attached to end portions of said conductor coil at both end portions of said molded body so that the end portions of said conductor coil are electrically connected to the external terminals.
- 2. A bead inductor according to claim 1, wherein said external terminals are metallic caps which are fitted to both end portions of said molded body.
- 3. A bead inductor according to claim 1, wherein said external terminals are soldered to the exposed end portions of the conductor coil.
- 4. A bead inductor according to claim 1, wherein the molded body is formed of a resin body including ferrite powder.
- 5. A bead inductor according to claim 1, wherein the molded body is formed via injection molding.
- 6. A bead inductor according to claim 1, wherein the molded body is formed of a rubber material including ferrite powder.
- 7. A bead inductor according to claim 1, wherein the molded body is formed of a polyphenylene sulfide resin including about 88% by weight of a Ni—Cu—Zn ferrite powder.
- 8. A bead inductor according to claim 1, wherein the external terminals are attached to the ends of the coil conductor via spot welding.
- 9. A bead inductor according to claim 1, wherein the external terminals are attached to the end portions of the coil conductor via conductive paste.
- 10. A bead inductor according to claim 1, wherein the coil conductor comprises a copper coil having a polyester resin layer disposed thereon.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-175649 |
Jun 1998 |
JP |
|
Parent Case Info
This is a divisional application of application Ser. No. 09/336,010, filed on Jun. 18, 1999 now U.S. Pat. No. 6,189,204.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
6189202 |
Masuda et al. |
Feb 2001 |
B1 |
Foreign Referenced Citations (4)
Number |
Date |
Country |
63-79306 |
Apr 1988 |
JP |
5-217750 |
Aug 1993 |
JP |
6-140252 |
May 1994 |
JP |
8-191022 |
Jul 1996 |
JP |