Connecting leads to windings

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CPC
H01F41/10

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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

Current Industry

H01F41/10Connecting leads to windings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic component
- Patent number 12,094,633
- Issue date Sep 17, 2024
- Coilcraft, Incorporated
- Andrzej Klesyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor winding guide apparatus and method of use thereof
- Patent number 12,087,494
- Issue date Sep 10, 2024
- Grant A. MacLennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component and electronic component
- Patent number 12,014,861
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Hexagonal semiconductor package structure
- Patent number 11,996,227
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making and using inductive devices with splits
- Patent number 11,991,829
- Issue date May 21, 2024
- Pulse Electronics, Inc.
- Thuyen Dinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip inductor and method for manufacturing the same
- Patent number 11,990,264
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 11,978,579
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Kenichi Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of coil component
- Patent number 11,955,269
- Issue date Apr 9, 2024
- Taiyo Yuden Co., Ltd.
- Takanori Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,942,259
- Issue date Mar 26, 2024
- Murata Manufacturing Co., Ltd.
- Masayuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a coil element
- Patent number 11,935,686
- Issue date Mar 19, 2024
- Taiyo Yuden Co., Ltd.
- Hirotaka Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and electronic device
- Patent number 11,935,688
- Issue date Mar 19, 2024
- Taiyo Yuden Co., Ltd.
- Asa Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil device
- Patent number 11,935,679
- Issue date Mar 19, 2024
- TDK Corporation
- Yoshihiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device with terminal region and method for producing a t...
- Patent number 11,909,152
- Issue date Feb 20, 2024
- TDK ELECTRONICS AG
- Yun Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,869,696
- Issue date Jan 9, 2024
- Coilcraft, Incorporated
- Andrzej Klesyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transformer of the symmetric-asymmetric type with a fully-bal...
- Patent number 11,862,381
- Issue date Jan 2, 2024
- STMicroelectronics S.A.
- Vincent Knopik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component, electronic device, and coil component manufacturing...
- Patent number 11,823,829
- Issue date Nov 21, 2023
- Taiyo Yuden Co., Ltd.
- Tetsuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-axis coil for implantable medical device
- Patent number 11,813,470
- Issue date Nov 14, 2023
- Medtronic, Inc.
- Rajesh V. Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component, method of making the same, and power supply circuit...
- Patent number 11,804,326
- Issue date Oct 31, 2023
- TDK Corporation
- Masamichi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component manufacturing method
- Patent number 11,798,732
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Akio Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip inductor structure
- Patent number 11,784,211
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component magnetic base
- Patent number 11,776,727
- Issue date Oct 3, 2023
- Murata Manufacturing Co., Ltd.
- Gota Shinohara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Coil component
- Patent number 11,776,742
- Issue date Oct 3, 2023
- Murata Manufacturing Co., Ltd.
- Akio Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component
- Patent number 11,756,724
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic component
- Patent number 11,749,448
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Mitsuhiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and production method thereof
- Patent number 11,721,469
- Issue date Aug 8, 2023
- Murata Manufacturing Co., Ltd.
- Shinji Otani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor
- Patent number 11,631,528
- Issue date Apr 18, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Kitashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method for manufacturing the same
- Patent number 11,631,527
- Issue date Apr 18, 2023
- Murata Manufacturing Co., Ltd.
- Junji Kurobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component
- Patent number 11,626,231
- Issue date Apr 11, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Winding assembly
- Patent number 11,626,242
- Issue date Apr 11, 2023
- Siemens Energy Global GmbH & Co. KG
- Jürgen Gangel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the coil component
- Patent number 11,615,903
- Issue date Mar 28, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Tomohiro
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
RESONANT TRANSFORMERS WITH CALIBRATABLE FLUX-SHUNT
- Publication number 20240387096
- Publication date Nov 21, 2024
- Enphase Energy, Inc.
- Michael J. HARRISON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE COIL ASSEMBLY AND METHOD OF PRODUCING THE SAME
- Publication number 20240331938
- Publication date Oct 3, 2024
- ROGERS CORPORATION
- Vitali JUDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
- Publication number 20240321507
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20240312692
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240274347
- Publication date Aug 15, 2024
- SHENZHEN POCO MAGNETIC CO., LTD.
- ZHUOQUAN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240266101
- Publication date Aug 8, 2024
- COILCRAFT, INCORPORATED
- Andrzej Klesyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD OF MA...
- Publication number 20240258013
- Publication date Aug 1, 2024
- Taiyo Yuden Co., Ltd.
- Tomoyuki Oyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COMPONENT AND METHOD OF MANUFACTURING MAGNETIC COMPONENT
- Publication number 20240105379
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD FOR MANUFACTURING INDUCTOR
- Publication number 20240071677
- Publication date Feb 29, 2024
- Murata Manufacturing Co., Ltd.
- Keita MUNEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND INDUCTOR MANUFACTURING METHOD
- Publication number 20240006113
- Publication date Jan 4, 2024
- DARFON ELECTRONICS CORP.
- Zuei-Chown Jou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411069
- Publication date Dec 21, 2023
- TDK Corporation
- Shintarou KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD FOR MANUFACTURING INDUCTOR
- Publication number 20230411068
- Publication date Dec 21, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kiyoshi TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductors Embedded in Package Substrate and Board and Method and Sy...
- Publication number 20230395305
- Publication date Dec 7, 2023
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR
- Publication number 20230395294
- Publication date Dec 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Mutsuyasu OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR
- Publication number 20230395308
- Publication date Dec 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Mutsuyasu OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230377791
- Publication date Nov 23, 2023
- TDK Corporation
- Satoshi SUGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bobbin Wound Coil for an Electromagnetic Coupling
- Publication number 20230360829
- Publication date Nov 9, 2023
- Warner Electric Technology LLC
- Nicholas Chase Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INDUCTOR STRUCTURE
- Publication number 20230361157
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT AND METHOD FOR ADJUSTING CHARACTERISTICS...
- Publication number 20230307163
- Publication date Sep 28, 2023
- TDK Corporation
- Munehiro TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LOOPS FOR A MAGNETIC CICRUIT
- Publication number 20230282416
- Publication date Sep 7, 2023
- SAFRAN ELECTRICAL & POWER
- Edouard BONNEFOUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20230230752
- Publication date Jul 20, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Young Ji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING THE COIL COMPONENT
- Publication number 20230191484
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Takashi TOMOHIRO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
- Publication number 20230197331
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Yoshifumi MAKI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
POWER TRANSFORMER OF THE SYMMETRIC-ASYMMETRIC TYPE WITH A FULLY-BAL...
- Publication number 20230134367
- Publication date May 4, 2023
- STMicroelectronics S.A.
- Vincent Knopik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230128594
- Publication date Apr 27, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Min Sung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hexagonal Semiconductor Package Structure
- Publication number 20230116861
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INDUCTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220392694
- Publication date Dec 8, 2022
- Murata Manufacturing Co., Ltd.
- Keita MUNEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WINDING GUIDE APPARATUS AND METHOD OF USE THEREOF
- Publication number 20220384096
- Publication date Dec 1, 2022
- Grant A. MacLennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER INDUCTOR WITH BOTTOM ELECTRODE WITHOUT CARRIER AND...
- Publication number 20220367105
- Publication date Nov 17, 2022
- Cheng-Han YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost In-Package Power Inductor
- Publication number 20220351901
- Publication date Nov 3, 2022
- NXP B.V.
- Trevor Mark Newlin
- H01 - BASIC ELECTRIC ELEMENTS

Connecting leads to windings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic component

Inductor winding guide apparatus and method of use thereof

Method of manufacturing electronic component and electronic component

Hexagonal semiconductor package structure

Methods of making and using inductive devices with splits

Chip inductor and method for manufacturing the same

Coil component

Manufacturing method of coil component

Electronic component

Method for manufacturing a coil element

Coil component and electronic device

Coil device

Electrical device with terminal region and method for producing a t...

Electronic component

Power transformer of the symmetric-asymmetric type with a fully-bal...

Coil component, electronic device, and coil component manufacturing...

Multi-axis coil for implantable medical device

Coil component, method of making the same, and power supply circuit...

Coil component manufacturing method

Integrated chip inductor structure

Coil component magnetic base

Coil component

Coil electronic component

Laminated electronic component

Electronic component and production method thereof

Inductor

Coil component and method for manufacturing the same

Coil electronic component

Winding assembly

Coil component and method of manufacturing the coil component

Patents Applicationslast 30 patents

RESONANT TRANSFORMERS WITH CALIBRATABLE FLUX-SHUNT

INDUCTIVE COIL ASSEMBLY AND METHOD OF PRODUCING THE SAME

THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES

COIL STRUCTURE AND METHOD OF MAKING SAME

INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT

COIL COMPONENT, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD OF MA...

MAGNETIC COMPONENT AND METHOD OF MANUFACTURING MAGNETIC COMPONENT

INDUCTOR AND METHOD FOR MANUFACTURING INDUCTOR

INDUCTOR AND INDUCTOR MANUFACTURING METHOD

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

INDUCTOR AND METHOD FOR MANUFACTURING INDUCTOR

Inductors Embedded in Package Substrate and Board and Method and Sy...

INDUCTOR

INDUCTOR

COIL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Bobbin Wound Coil for an Electromagnetic Coupling

INTEGRATED CHIP INDUCTOR STRUCTURE

MULTILAYER COIL COMPONENT AND METHOD FOR ADJUSTING CHARACTERISTICS...

METHOD FOR MANUFACTURING LOOPS FOR A MAGNETIC CICRUIT

COIL COMPONENT

COIL COMPONENT AND METHOD OF MANUFACTURING THE COIL COMPONENT

METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

POWER TRANSFORMER OF THE SYMMETRIC-ASYMMETRIC TYPE WITH A FULLY-BAL...

ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF

Hexagonal Semiconductor Package Structure

SURFACE-MOUNT INDUCTOR AND MANUFACTURING METHOD THEREOF

INDUCTOR WINDING GUIDE APPARATUS AND METHOD OF USE THEREOF

INTEGRATED POWER INDUCTOR WITH BOTTOM ELECTRODE WITHOUT CARRIER AND...

Low Cost In-Package Power Inductor