Claims
- 1. A biometric sensor, comprising:a housing; connecting leads disposed one of on and in said housing; a sensor chip disposed in said housing, said sensor chip having a top, a field sensor, and connecting contacts in a form of electrically conductive bumps, said electrically conductive bumps making contact with said connecting leads and having a given height; a scratch protection covering disposed on said top of said sensor chip; and an adhesive layer disposed between said scratch protection covering and said housing, said adhesive layer disposed at least around said sensor field, said adhesive layer having a thickness matched to said given height of said electrically conductive bumps creating a leak-tight connection between said sensor chip and housing.
- 2. The sensor according to claim 1, including at least one further supporting bump disposed on said top of said sensor chip at a point which prevents said sensor chip from tilting relative to said housing.
- 3. The sensor according to claim 1, wherein said adhesive layer is a frame-shaped adhesive film.
- 4. The sensor according to claim 1, wherein said housing is an injection-molded housing.
- 5. The sensor according to claim 1, wherein said connecting leads are embedded in said housing and are routed to an outer edge of said housing.
Priority Claims (1)
Number |
Date |
Country |
Kind |
198 31 570 |
Jul 1998 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation of copending International Application PCT/DE99/02146, filed Jul. 12, 1999, which designated the United States.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE99/02146 |
Jul 1999 |
US |
Child |
09/761806 |
|
US |