Claims
- 1. A method of forming a bond pad support structure in an integrated circuit having a bond pad located thereon, comprising the steps of:forming a first bond pad support layer at least partly located below the bond pad, the first bond pad support layer comprising a plurality of radial patterns with at least one space therebetween; and forming a second bond pad support layer on the first bond pad support layer, so that the second bond pad support layer fills at least a portion of the space.
- 2. A method according to claim 1, wherein the step of forming the plurality of radial patterns includes:forming a first set of patterns having a first length; and forming a second set of patterns having a second length shorter than the first length, the second set of patterns including a larger number of members than the first set of patterns.
- 3. A method according to claim 2, wherein:the patterns in the second set of patterns begin at a radius that is further from a point beneath the center of the bond pad than the patterns in the first set of patterns.
- 4. A method according to claim 3, wherein a locus of outermost points of each of the plurality of patterns lie along a polygon having at least four sides.
- 5. A method according to claim 1, wherein the first bond pad support layer comprises a conductive metal, and the second bond pad support layer comprises a dielectric material or a metal.
- 6. A method according to claim 1, wherein each of the patterns is a line segment having about the same width as each of the other line segments.
- 7. A method according to claim 1, wherein each of the patterns is a triangle.
- 8. A method according to claim 7, wherein the step of forming the plurality of triangles includes:forming a first set of triangles, each triangle in the first set having an apex which lies within a region beneath the bond paid; and forming a second set of triangles, each triangle in the second set lying substantially outside of the region beneath the bond pad.
Parent Case Info
This application is a divisional of U.S. application Ser. No. 09/162,247, filed on Sep. 28, 1998, U.S. Pat. No. 6,087,732.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
08-111544 |
Apr 1996 |
JP |