Integrated circuits

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H01L2924/14

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14Integrated circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,250,830
- Issue date Mar 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, memory system and method of controlling semic...
- Patent number 12,243,606
- Issue date Mar 4, 2025
- AP Memory Technology Corporation
- Hsin-Nan Chueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiving circuit
- Patent number 12,243,862
- Issue date Mar 4, 2025
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- Ygal Arbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having laterally extending capacitors of different le...
- Patent number 12,238,917
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top circuit and an IC with a gap over th...
- Patent number 12,237,247
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable large system based on organic interconnect
- Patent number 12,237,269
- Issue date Feb 25, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages
- Patent number 12,237,319
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device for increasing reliability of data detect...
- Patent number 12,230,330
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Myeongwoo Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device
- Patent number 12,230,331
- Issue date Feb 18, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087608
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...
- Publication number 20250086106
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Byungsue JUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...
- Publication number 20250087565
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250089253
- Publication date Mar 13, 2025
- KIOXIA Corporation
- Ryusuke KON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20250089257
- Publication date Mar 13, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087607
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- HYEONMIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fine Pitch Organic Inte...
- Publication number 20250087499
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087541
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
- Publication number 20250079263
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...
- Publication number 20250079266
- Publication date Mar 6, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079283
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081473
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079249
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079424
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079319
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongseok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...
- Publication number 20250079358
- Publication date Mar 6, 2025
- Tesla, Inc.
- Abel Misrak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20250079375
- Publication date Mar 6, 2025
- CXMT Corporation
- Hengrong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079403
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250079308
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...
- Publication number 20250079377
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, CHIP STACKED STRUCTURE, AND MEMORY
- Publication number 20250079406
- Publication date Mar 6, 2025
- CXMT Corporation
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250072011
- Publication date Feb 27, 2025
- SK HYNIX INC.
- Jung Shik JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...
- Publication number 20250067942
- Publication date Feb 27, 2025
- Lightmatter, Inc
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS

Integrated circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method manufacturing the same

3D semiconductor memory devices and structures

Semiconductor device including penetration via structure

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Semiconductor device, memory system and method of controlling semic...

Thermocompression bonding with passivated nickel-based contacting m...

Devices, systems, and methods for stacked die packages

Optical receiving circuit

Alternative surfaces for conductive pad layers of silicon bridges f...

Display with embedded pixel driver chips

3D semiconductor device and structure with metal layers and memory...

3D stack of split graphics processing logic dies

Semiconductor package

Deep trench capacitors embedded in package substrate

Semiconductor device having plural stacked first chips sealed in a...

Chip bump interface compatible with different orientations and type...

Integrated circuit structure

Memory device having laterally extending capacitors of different le...

Semiconductor package with top circuit and an IC with a gap over th...

Semiconductor device and method for manufacture of semiconductor de...

Semiconductor package and method for fabricating the same

Scalable large system based on organic interconnect

Semiconductor device and manufacturing method thereof

Integrated circuit package having wirebonded multi-die stack

Stacked-chip packages

Interposers for microelectronic devices

Package device

Nonvolatile memory device for increasing reliability of data detect...

Memory device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

Advanced Substrates for Large, High Performance Power Packages

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Making a Fine Pitch Organic Inte...

SEMICONDUCTOR PACKAGE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...

PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE

STIFFENER WITH INTEGRATED CONNECTORS

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP AND A CONDUCTI...

MEMORY CHIP, CHIP STACKED STRUCTURE, AND MEMORY

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...

SEMICONDUCTOR PACKAGE