Claims
- 1. A bonder tool cleaning mechanism for use in a semiconductor bonder of the type which comprises a bonding stage that positions and carries bumps and a bonder tool which pressure-bonds leads of a film carrier to said bumps, said bonder tool cleaning mechanism comprising at least a coarse grindstone, a finishing grindstone, and wire brush provided in the vicinity of said bonding stage and an X Y table for moving successively said coarse grindstone, finishing grindstone and wire brush into contact with said bonding tool and then for reciprocating successively in an X Y plane each of said coarse grindstone, finishing grindstone and wire brush to clean said bonding tool.
Parent Case Info
This is a continuation of application Ser. No. 616,194, filed Nov. 20, 1990, now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0246643 |
May 1984 |
JPX |
0016956 |
Jan 1988 |
JPX |
3161272 |
Jul 1991 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
616194 |
Nov 1990 |
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