The present invention pertains to MEMS (micro electro mechanical systems) technology, and particularly to wafer-to-wafer bonding. More particularly, the invention pertains to stress-related bonds.
The invention involves controlling the residual stress in a bonded wafer. Usually the goal is to minimize or virtually eliminate residual stress in wafer bonds.
a, 1b, 1c and 1d reveal a stress-impacted bonding of two wafers;
a, 2b and 2c reveal a stress-free bonding of two wafers; and
Anodic bonding is a method of joining glass to silicon without the use of adhesives. The silicon and glass wafers may be heated to a temperature (typically in the range 300 to 500 degrees C. depending on the glass type) at which the alkali-metal ions in the glass become mobile. The components may be brought into contact and a high voltage applied across them. This causes the alkali cations to migrate from the interface resulting in a depletion layer with high electric field strength. The resulting electrostatic attraction brings the silicon and glass into intimate contact. Further current flow of the oxygen anions from the glass to the silicon may result in an anodic reaction at the interface in that the glass becomes bonded to the silicon with a permanent chemical bond.
Anodic bonding, a fabrication technique commonly used in MEMS fabrication and used, in particular, for MEMS gyroscopes and accelerometers, typically results in residual stress in the bonded wafers and devices. Since the wafers are different materials, they have different rates of thermal expansion. Therefore, when the resultant bonded wafer is cooled from the bonding temperature, the two materials bonded to each other in the wafer contract at different rates resulting in significant residual stress. The temperature differential technique may be used for various types of attachment and bonding. The residual stress may be minimized or nearly eliminated. For instance, the wafers may be held at slightly different temperatures during bonding. Upon cooling down, the bonded wafers may contract at different rates and result in having an insignificant amount of residual stress between the wafers at ambient or room temperature.
Anodic bonding may be used in MEMS for joining one wafer to another, or for bonding a chip to a package (such as a glass enclosure). In general, anodic bonding may be used to join a metal or semiconductor to glass. In MEMS, the semiconductor may be silicon and the glass may be Corning 7740 (i.e., Pyrex™), Hoya SD2, or the like.
Anodic bonding is an illustrative example. There are various other wafer bonding techniques, such as “fusion” or “direct” bonding, frit bonding, eutectic bonding, and the like, which may be used with the present bonding system having stress control at the interface of the bonded materials.
One concern with bonding in general is that two different materials (e.g., silicon and Pyrex™) may be bonded at an elevated temperature, typically from about 300 to 500 degrees C. The materials may be heated up, bonded together, and then cooled back down to room temperature. As the combined materials (i.e., in a wafer or device) cool down, the difference between the thermal expansion of the two materials may result in a stress between the two materials attached to each other. When the materials are in wafer form, the stress may cause the resultant wafer to bow significantly. When the fabrication is complete, there may be a residual stress that remains between the glass portion of the device and the silicon portion of the device. Such stress may lead to layout difficulties, device performance problems, long term drifts, and/or poor reliability.
It would be desirable to bond two different materials that have exactly the same thermal expansion over the entire temperature range during bonding and device operation. However, no such two different materials appear to exist. Pyrex™ is regarded as thermally matching quite well with silicon. Despite these close thermal expansions, there still may be notable stress between the materials after bonding. Glass such as Hoya™ MSD2 may be a better match for silicon. However, for various reasons, Pyrex™ could be the material of choice for bonding with silicon. Thus, bow and residual stress may be always present.
The invention is an approach for achieving a bond with virtually no residual stress at room temperature. An example bond may be between two materials such as silicon wafer 11 and Pyrex™ wafer 12. The room temperature stress may be changed by holding the silicon wafer 11 at one temperature and the Pyrex™ wafer 12 at a different temperature at bonding time. One reason this approach works is because different differentials or changes of temperatures between bonding and a cooled-off state may compensate for the different coefficients of thermal expansion. Wafer 11 and wafer 12 at a bonding temperature (much higher than room temperature) may be matched in length before bonding (
If α1 is the thermal expansion coefficient of wafer 11, then as the wafer cools it may contract by an amount of ΔL1=α1L1ΔT. Similarly, wafer 12 may contract by an amount ΔL2=α2L2ΔT. Since L1=L2 when the wafers are at bonding temperature, the amount of contraction may differ between wafers 11 and 12 in that L1≠L2 when the wafers are at room temperature. However, if the wafers are bonded to each other, they may be constrained to contract by the same amount. The resultant constraint may lead to a residual stress and bow of the wafers 11 and 12 (
One may use a simplification that the thermal expansion coefficient does not change with temperature. In reality, the thermal expansion coefficient generally does change with temperature, but the conclusions would be still the same as if one used the simplification. The thermal expansion coefficient may be defined as α=(1/L) (ΔL/ΔT), where L is the length of the sample, and ΔL is the length change when the temperature changes by ΔT. Examples of linear thermal coefficients of expansion a , and α2 for silicon and Pyrex™ glass may be 3 and 4 parts per million per Celsius degree, respectfully.
For a silicon wafer having a length of ten centimeters, a room temperature of 20 degrees C. and a bonding temperature of 420 degrees C., ΔL1=α1L1, ΔT=3×10−6 ppm×10 cm×400 deg C.=1200×10−5 cm=1.2×10−2 cm. For a Pyrex™ glass wafer having a length of ten centimeters, a room temperature of 20 degrees C. and a bonding temperature of 420 degrees C., ΔL2=α2L2ΔT=4×10−6 ppm×10 cm×400 deg C.=1600×10−5 cm=1.6×10−2 cm. The difference of expansions may be ΔL2−ΔL1=4×10−3 cm.
Next, one may note a case where wafers 11 and 12 are held at two different temperatures for and during bonding. Then the temperature changes upon cooling of wafers 11 and 12 from the bond temperatures to the room temperature, respectively, may be different. So the applicable formulas may be ΔL1=α1L1ΔT1 and ΔL2=α2L2ΔT2. As noted before, L1=L2, but temperatures of wafers 11 and 12 may be chosen such that α1ΔT1 =α2ΔT2 or α1ΔT1 ≈α2ΔT2 and thus ΔL1=ΔL2 or ΔL1≈ΔL2, respectively. In
The bonding temperatures difference between wafers 11 and 12 is not necessarily large. Such temperature difference may be achieved with bonding equipment.
The approach may be more complicated if the thermal expansion coefficients are temperature dependent. This may make the mathematics more involved, but the extensive calculation would not generally qualitatively change the result. While the desire may typically be to achieve minimum stress at room temperature, the present approach may also be used to achieve any targeted, nonzero stress in the combined wafers 11 and 12. The concept remains the same. The starting temperatures just before bonding may be adjusted appropriately to get the targeted stress.
Wafer bonders may be equipped with a heater on both the top side and the bottom side of the wafer stack. The heaters may be independently controlled, allowing the temperatures of the top and bottom wafers to be set independently. Further, bonding the wafers in a vacuum may reduce the thermal contact between the wafers, thus making it easier to vary the wafer temperatures independently than if the wafer bonding were done in an air environment.
The above-described bonding approaches may be applied to many kinds of devices and products. Examples may include MEMS gyroscopes, MEMS accelerometers, MEMS inertial measurement devices, non-MEMS devices, and so forth.
In
Item 11 may be heated to a bonding temperature T1 by a heater element 21. Item 12 may be heated to a bonding temperature T2 by a heater element 22. T1 may be sensed by a temperature sensor 23 and T2 may be sensed by a temperature sensor 24. Actuator 27 may have an arm 28 attached to holder 17 to move holder 17 towards or away from wafer holder 18 so as to bring wafers 11 and 12 together for bonding, or apart prior to bonding for placement of the wafers, or after bonding for release of the bonded wafers.
An electronics module 29 in bonder 15 may be an interface between bonder 15 and computer/processor 31. Computer or processor 31 may be programmable so that the wafers or item 11 and 12 may be bonded resulting in a predetermined amount of stress between them at an ambient, pre-bonding, operating, storage or room temperature after bonding. The predetermined amount of stress may be selected to be insignificant or virtually zero. The heaters 21 and 22, temperature sensors 23 and 24, and actuator 27 may be connected to the computer or processor 31 via electronics 29, or electronics 29 may be designed so as to control the temperature of the wafers or items 11 and 12 for bonding. In lieu of the computer or processor 31, electronics 29 may be designed to be programmable for setting the amount of stress desired between the resultant bonded wafers or items 11 and 12. Certain external controls may be connected to electronics 29 for user interfacing. Electronics 29 may be situated in or attached to a base 32 along with holder 18 and actuator 27.
In the present specification, some of the material may be of a hypothetical or prophetic nature although stated in another manner or tense.
Although the invention has been described with respect to at least one illustrative embodiment, many variations and modifications will become apparent to those skilled in the art upon reading the present specification. It is therefore the intention that the appended claims be interpreted as broadly as possible in view of the prior art to include all such variations and modifications.
Number | Name | Date | Kind |
---|---|---|---|
3935634 | Kurtz et al. | Feb 1976 | A |
3951707 | Kurtz et al. | Apr 1976 | A |
4386453 | Giachino et al. | Jun 1983 | A |
4565096 | Knecht | Jan 1986 | A |
4578735 | Knecht et al. | Mar 1986 | A |
4603371 | Frick | Jul 1986 | A |
4609968 | Wilner | Sep 1986 | A |
4632871 | Karnezos et al. | Dec 1986 | A |
4701826 | Mikkor | Oct 1987 | A |
4730496 | Knecht et al. | Mar 1988 | A |
4852408 | Sanders | Aug 1989 | A |
4899125 | Kurtz | Feb 1990 | A |
4943032 | Zdeblick | Jul 1990 | A |
5173836 | Tomase et al. | Dec 1992 | A |
5216631 | Sliwa, Jr. | Jun 1993 | A |
5264075 | Zanini-Fisher et al. | Nov 1993 | A |
5307311 | Sliwa, Jr. | Apr 1994 | A |
5349492 | Kimura et al. | Sep 1994 | A |
5365790 | Chen et al. | Nov 1994 | A |
5441803 | Meissner | Aug 1995 | A |
5453628 | Hartsell et al. | Sep 1995 | A |
5457956 | Bowman et al. | Oct 1995 | A |
5473945 | Grieff et al. | Dec 1995 | A |
5515732 | Willcox et al. | May 1996 | A |
5520054 | Romo | May 1996 | A |
5635739 | Grieff et al. | Jun 1997 | A |
5670722 | Moser et al. | Sep 1997 | A |
5695590 | Willcox et al. | Dec 1997 | A |
5709337 | Moser et al. | Jan 1998 | A |
5725729 | Greiff | Mar 1998 | A |
5749226 | Bowman et al. | May 1998 | A |
5770883 | Mizuno et al. | Jun 1998 | A |
5824204 | Jerman | Oct 1998 | A |
5865417 | Harris et al. | Feb 1999 | A |
5877580 | Swierkowski | Mar 1999 | A |
5891751 | Kurtz et al. | Apr 1999 | A |
5914562 | Khan et al. | Jun 1999 | A |
5917264 | Maruno et al. | Jun 1999 | A |
5938923 | Tu et al. | Aug 1999 | A |
5941079 | Bowman et al. | Aug 1999 | A |
6005275 | Shinogi et al. | Dec 1999 | A |
6018211 | Kanaboshi et al. | Jan 2000 | A |
6050138 | Lynch et al. | Apr 2000 | A |
6050145 | Olson et al. | Apr 2000 | A |
6071426 | Lee et al. | Jun 2000 | A |
6077612 | Hagedorn et al. | Jun 2000 | A |
6078103 | Turner | Jun 2000 | A |
6087201 | Takahashi et al. | Jul 2000 | A |
6089099 | Sathe et al. | Jul 2000 | A |
6111351 | Pong et al. | Aug 2000 | A |
6133069 | Takahashi et al. | Oct 2000 | A |
6140762 | Pong et al. | Oct 2000 | A |
6141497 | Reinicke et al. | Oct 2000 | A |
6143583 | Hays | Nov 2000 | A |
6176753 | Pong et al. | Jan 2001 | B1 |
6194833 | DeTemple et al. | Feb 2001 | B1 |
6225737 | Pong et al. | May 2001 | B1 |
6252229 | Hays et al. | Jun 2001 | B1 |
6258704 | Turner | Jul 2001 | B1 |
6268647 | Takahashi et al. | Jul 2001 | B1 |
6277666 | Hays et al. | Aug 2001 | B1 |
6310395 | Takahashi et al. | Oct 2001 | B1 |
6321594 | Brown et al. | Nov 2001 | B1 |
6323590 | Pong et al. | Nov 2001 | B1 |
6326682 | Kurtz et al. | Dec 2001 | B1 |
6328482 | Jian | Dec 2001 | B1 |
6349588 | Brown et al. | Feb 2002 | B1 |
6356013 | Pong et al. | Mar 2002 | B1 |
6366468 | Pan | Apr 2002 | B1 |
6443179 | Benavides et al. | Sep 2002 | B1 |
6445053 | Cho | Sep 2002 | B1 |
6516671 | Romo et al. | Feb 2003 | B2 |
6527455 | Jian | Mar 2003 | B2 |
6533391 | Pan | Mar 2003 | B1 |
6548322 | Stemme et al. | Apr 2003 | B1 |
6548895 | Benavides et al. | Apr 2003 | B1 |
6596117 | Hays et al. | Jul 2003 | B2 |
6605339 | Marshall et al. | Aug 2003 | B1 |
6621135 | Sridhar et al. | Sep 2003 | B1 |
6639289 | Hays et al. | Oct 2003 | B1 |
6647794 | Nelson et al. | Nov 2003 | B1 |
6660614 | Hirschfield et al. | Dec 2003 | B2 |
6704111 | Ecklund et al. | Mar 2004 | B2 |
6758610 | Ziari et al. | Jul 2004 | B2 |
6768412 | Becka et al. | Jul 2004 | B2 |
6787885 | Esser et al. | Sep 2004 | B2 |
6793829 | Platt et al. | Sep 2004 | B2 |
6809424 | Pike et al. | Oct 2004 | B2 |
6811916 | Mallari et al. | Nov 2004 | B2 |
6821819 | Benavides et al. | Nov 2004 | B1 |
6823693 | Hofmann et al. | Nov 2004 | B1 |
6841839 | Sridhar et al. | Jan 2005 | B2 |
6897123 | Winther | May 2005 | B2 |
6906395 | Smith | Jun 2005 | B2 |
6910379 | Eskridge et al. | Jun 2005 | B2 |
6914785 | Slocum et al. | Jul 2005 | B1 |
7153759 | Wei et al. | Dec 2006 | B2 |
20010022207 | Hays et al. | Sep 2001 | A1 |
20020054737 | Jian | May 2002 | A1 |
20020130408 | Pike et al. | Sep 2002 | A1 |
20030010131 | Romo et al. | Jan 2003 | A1 |
20030034870 | Becka et al. | Feb 2003 | A1 |
20030038327 | Smith | Feb 2003 | A1 |
20030092243 | Hirschfield et al. | May 2003 | A1 |
20030108304 | Ziari et al. | Jun 2003 | A1 |
20030150267 | Challoner et al. | Aug 2003 | A1 |
20030160021 | Platt et al. | Aug 2003 | A1 |
20030178507 | Maria Rijn Van | Sep 2003 | A1 |
20030205089 | Nelson et al. | Nov 2003 | A1 |
20030226806 | Young et al. | Dec 2003 | A1 |
20040004649 | Bibl et al. | Jan 2004 | A1 |
20040008350 | Ecklund et al. | Jan 2004 | A1 |
20040056320 | Sridhar et al. | Mar 2004 | A1 |
20040081809 | Gomez et al. | Apr 2004 | A1 |
20040149888 | Costello | Aug 2004 | A1 |
20040165363 | Lifton et al. | Aug 2004 | A1 |
20040183189 | Jakobsen | Sep 2004 | A1 |
20040266048 | Platt et al. | Dec 2004 | A1 |
20050001182 | Wise et al. | Jan 2005 | A1 |
20050005676 | Crawley et al. | Jan 2005 | A1 |
20050011669 | Freeman et al. | Jan 2005 | A1 |
20050012197 | Smith et al. | Jan 2005 | A1 |
20050019986 | Pike et al. | Jan 2005 | A1 |
20050023629 | Ding et al. | Feb 2005 | A1 |
20050072189 | Tudryn et al. | Apr 2005 | A1 |
20050082581 | Hofmann et al. | Apr 2005 | A1 |
20050092107 | Eskridge et al. | May 2005 | A1 |
20050107658 | Brockway | May 2005 | A1 |
20050121298 | Sridhar et al. | Jun 2005 | A1 |
20050121735 | Smith | Jun 2005 | A1 |
20050139967 | Eskridge et al. | Jun 2005 | A1 |
20050161153 | Hofmann et al. | Jul 2005 | A1 |
20050172723 | Kato et al. | Aug 2005 | A1 |
20050178862 | Van Rijn | Aug 2005 | A1 |
Number | Date | Country |
---|---|---|
2001064041 | Mar 2001 | JP |
2005317807 | Nov 2005 | JP |
Number | Date | Country | |
---|---|---|---|
20060154443 A1 | Jul 2006 | US |