Bonding of two components

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CPC
B81C3/001

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C3/00Assembling of devices or systems from individually processed components

Current Industry

B81C3/001Bonding of two components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,168,605
- Issue date Dec 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates and separating a portion of the bonded...
- Patent number 12,116,303
- Issue date Oct 15, 2024
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchannel chip and method for manufacturing same
- Patent number 12,091,308
- Issue date Sep 17, 2024
- Zeon Corporation
- Hiroya Nishioka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer fluidic devices and methods for their fabrication
- Patent number 12,017,214
- Issue date Jun 25, 2024
- Illumina, Inc.
- Jeffrey S. Fisher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carbyne-based sensing device for high spatial resolution in DNA seq...
- Patent number 12,012,329
- Issue date Jun 18, 2024
- Board of Trustees of the University of Arkansas
- Steve Tung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,970,388
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Watch component, watch movement and watch
- Patent number 11,927,916
- Issue date Mar 12, 2024
- Seiko Epson Corporation
- Kazuyuki Miyashita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-opto-mechanical system sensor, arrangement and manufacturing...
- Patent number 11,898,899
- Issue date Feb 13, 2024
- MIRAEX SA
- Mitchell Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum bag having integral ultrasonic transducers
- Patent number 11,828,730
- Issue date Nov 28, 2023
- The Boeing Company
- Keith Daniel Humfeld
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,752,499
- Issue date Sep 12, 2023
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for manufacturing mems device
- Patent number 11,753,296
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Extended acid etch for oxide removal
- Patent number 11,655,146
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment method for microfluidic device
- Patent number 11,571,692
- Issue date Feb 7, 2023
- PhysioLogic Devices, Inc.
- Peter C. Lord
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchip
- Patent number 11,542,157
- Issue date Jan 3, 2023
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power electronics assemblies with CIO bonding layers and double sid...
- Patent number 11,527,458
- Issue date Dec 13, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid ultrasonic transducer and method of forming the same
- Patent number 11,508,902
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic cartridge for processing and detecting nucleic acids
- Patent number 11,485,968
- Issue date Nov 1, 2022
- NeuMoDx Molecular, Inc.
- Michael T. Kusner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,430,728
- Issue date Aug 30, 2022
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS sensor
- Patent number 11,390,519
- Issue date Jul 19, 2022
- Robert Bosch GmbH
- Sebastian Schuler-Watkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20240375099
- Publication date Nov 14, 2024
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING
- Publication number 20240253974
- Publication date Aug 1, 2024
- Rosemount Aerospace Inc.
- Roger Backman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20240217808
- Publication date Jul 4, 2024
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240092631
- Publication date Mar 21, 2024
- Rohm Co., Ltd.
- Yoshiyuki INUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS
- Publication number 20240036345
- Publication date Feb 1, 2024
- Carl Zeiss SMT GMBH
- Stefan SCHUETTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Anchor Structure
- Publication number 20240017987
- Publication date Jan 18, 2024
- SensorTek technology Corp.
- Shih-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
- Publication number 20230406698
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230382713
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- RAMACHANDRAMURTHY PRADEEP YELEHANKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD
- Publication number 20230365400
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Guoqiang WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment Method for Microfluidic Device
- Publication number 20230364604
- Publication date Nov 16, 2023
- PhysioLogic Devices, Inc.
- Peter C. Lord
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE
- Publication number 20230331546
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTENDED ACID ETCH FOR OXIDE REMOVAL
- Publication number 20230264949
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME
- Publication number 20230212000
- Publication date Jul 6, 2023
- ZEON CORPORATION
- Hiroya NISHIOKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
- Publication number 20230100911
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES
- Publication number 20220367339
- Publication date Nov 17, 2022
- GENERAL ELECTRIC COMPANY
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE
- Publication number 20220340416
- Publication date Oct 27, 2022
- TOP TECHNOLOGY LTD
- Youngho LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20220325396
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220315411
- Publication date Oct 6, 2022
- DENSO CORPORATION
- Keitaro ITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS H-FRAME DEVICE
- Publication number 20220289559
- Publication date Sep 15, 2022
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SUBSTRATES AND SEPARATING A PORTION OF THE BONDED...
- Publication number 20220289615
- Publication date Sep 15, 2022
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS, AND A WAFER
- Publication number 20220289567
- Publication date Sep 15, 2022
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding of two components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and a method of manufacturing the same

Conductive bond structure to increase membrane sensitivity in MEMS...

Undercut-free patterned aluminum nitride structure and methods for...

Microelectronics package with vertically stacked MEMS device and co...

Microelectronics H-frame device

Method of bonding substrates and separating a portion of the bonded...

Method of bonding substrates, microchip and method of manufacturing...

Microchannel chip and method for manufacturing same

Multilayer fluidic devices and methods for their fabrication

Carbyne-based sensing device for high spatial resolution in DNA seq...

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Package structure and method for manufacturing the same

Bonded structures

Watch component, watch movement and watch

Micro-opto-mechanical system sensor, arrangement and manufacturing...

Wafer level stacked structures having integrated passive features

Semiconductor package with built-in vibration isolation, thermal st...

Vacuum bag having integral ultrasonic transducers

Support structure for MEMS device with particle filter

Substrate assembly and method of bonding substrates

MEMS device and method for manufacturing mems device

Extended acid etch for oxide removal

Attachment method for microfluidic device

Microchip

Power electronics assemblies with CIO bonding layers and double sid...

Hybrid ultrasonic transducer and method of forming the same

Microfluidic cartridge for processing and detecting nucleic acids

Wafer level stacked structures having integrated passive features

Method for manufacturing a MEMS sensor

Patents Applicationslast 30 patents

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

BONDED STRUCTURES

BONDED STRUCTURES

MEMS SENSOR AND MANUFACTURING METHOD THEREOF

MEMS DEVICE MANUFACTURING

METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS

Anchor Structure

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD

Attachment Method for Microfluidic Device

MEMS STRUCTURE

EXTENDED ACID ETCH FOR OXIDE REMOVAL

MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME

PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

BONDED STRUCTURES

WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES

A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONICS H-FRAME DEVICE

METHOD OF BONDING SUBSTRATES AND SEPARATING A PORTION OF THE BONDED...

METHOD FOR BONDING WAFERS, AND A WAFER