1. Field of the Invention
The present invention relates to a burn-in socket for electrically connecting an electronic package such as an integrated circuit (IC) with a circuit substrate such as a burn-in board.
2. Description of the Prior Art
Electronic packages, such as integrated circuits (ICs), are miniaturized electronic devices in which a number of active and passive circuit elements are located on or within a continuous body of material to perform certain function of a complete circuit. To ensure reliability in use, the ICs require prior burning in to test their durability. The ICs are operated at a high temperature for an extended period of time to accelerate potential failure points. This helps eliminate early product failures once the ICs are sold and/or assembled onto electronic end products. A burn-in socket is used to receive an IC therein, and electrically connects the IC with a burn-in board for operation of the IC at high temperature. Normally, a temperature sensor with a digital output is mounted near the IC to measure the temperature of the assembly. The digital output is connected with a controller. The sensor provides signals to the controller through the digital output. The controller can control the temperature of the assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature. Pertinent example of the burn-in socket is disclosed in U.S. Pat. No. 5,172,049.
Generally, a burn-in socket comprises a socket, an IC mounted onto the socket and electrically connected with a number of electrical terminals of the socket, a cap mounted on a top side of the socket and having a generally rectangular first window in a middle portion thereof, and a heat sink mounted on a top surface of the IC and in the first window of the cap. A heater is mounted in the cap to heat the assembly. A temperature sensor is mounted in the cap over the heater to measure the temperature of the assembly. The sensor has a wire connected with and providing signals to a controller. During burn-in, the controller can control the temperature of the assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.
However, in the above-mentioned burn-in socket, the sensor is mounted on the cap away from the IC. The temperature measured by the sensor is liable to be higher than the actual temperature of the IC. The IC is operated under a temperature which is lower than a desired temperature. Therefore, all early product failures are unlikely to be eliminated before sale and/or being assembled onto electronics end products.
In the view of the above, a new burn-in socket that overcomes the above-mentioned disadvantages is desired.
An object of the invention is to provide a burn-in socket for electrically connecting an electronic package such as an integrated circuit (IC) with a circuit substrate such as a burn-in board, wherein the burn-in socket is configured so as to hold a sensor adjacent the IC thereby reliably controlling the IC in a desired temperature during burn-in.
To achieve the above-mentioned object, a burn-in socket in accordance with a preferred embodiment is provided. The burn-in socket comprises an insulative base, a multiplicity of electrical contacts received in the base, and a pressing member. The base defines an elongated slot in a front wall thereof extending in a lengthwise direction. A bore is defined in and through the front wall in a lateral direction. The pressing member comprises an elongated lever and a pair of screws for securing the lever on the front wall. A sensor is received in the bore and securely sandwiched by the lever and the step of the base to provide signals to a controller during being operated at high temperature. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.
Other objects, advantages or novel features of the invention will become more apparent from the following detailed description when taken in adjunction with the accompanying drawings, in which:
Reference will now be made to the drawings to describe the present invention in detail.
Referring to
The burn-in socket 1 comprises an insulative base 10, a multiplicity of electrical contacts 12 received in the base 10, and a pressing member 14 for securely holding the sensor 2 on the burn-in socket 1.
The base 10 comprises a body portion 100, a pair of front and end walls 102, 104 extending upwardly from front and end sides of the body portion 100, and a pair of sidewalls 108 extending upwardly from two opposite lateral sides of the body portion 100 respectively. The front and end walls 102, 104 and sidewalls 108 form a generally rectangular cavity 103 therebetween for receiving the IC therein. A pair of projections 105 is formed at two ends of a diagonal of the base 10. A recess 106 is defined in a middle portion of the body portion 100. A multiplicity of passageways 101 is defined in the body portion 100 therethrough and arranged around the recess 106.
The contact 12 are accommodated in the passageways 101 respectively. Each contact 12 comprises a first contact portion (not labeled) for electrically contacting the IC and a second contact portion (not labeled) for electrically contacting the burn-in board. Thus, the burn-in socket 1 can connect the IC with the burn-in board.
Referring to
Referring to
Referring to
In used, the burn-in socket is mounted onto and electrically connected with the burn-in board. The IC is received in the cavity 103 and electrically connected with the contacts 12 of the burn-in socket 1. In this position, the burn-in socket 1 and the IC can be operated at high temperature for an extended period of time to accelerate potential failure points. During operation, the sensor 2 provides signals to a controller (not shown) via the wires 22 thereof. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor 2, thereby avoiding damage of the IC by exorbitant temperature. After burn-in, the above-mentioned actions are repeated, and a new IC (not shown) can be assembled in the burn-in socket 1 to be operated.
From the foregoing it will be recognized that the principles of the invention may be employed in various arrangements to obtain the features, advantages and benefits described above. It is to be understood, therefore, that even though numerous characteristics and advantages of the invention have been set forth together with details of the structure and function of the invention, this disclosure is to be considered illustrative only. Various changes and modifications may be made in detail, especially in matters of size, shape and arrangements of parts, without departing from the spirit and scope of the invention as defined by the appended claims.
Number | Date | Country | Kind |
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92213183 | Jul 2003 | TW | national |