Camera Module and Method for Forming the Camera Module

Abstract

A camera module having an inner wall installed and a method for forming the camera module are disclosed. The camera module includes a lens; a sensor component for sensing light gathered by the lens; and a fixing module, for fixing the lens. The fixing module includes an inner wall that is installed on the sensing component. The inner wall of the fixing module protects a sensing region of an image sensor from unwanted matter resulting from manufacturing or from the outside environment.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a section view of a conventional camera module.

FIG. 2 illustrates a top view of a bearing surface of a fixing module and a circuit board.

FIG. 3 illustrates a section view of a camera module according to an embodiment of the present invention.

FIG. 4 illustrates a perspective view of a holder installed on an image sensor.

FIG. 5 illustrates a perspective view of a holder and an inner wall.

FIG. 6 illustrates a top view of a bearing surface between a molding material and a circuit board.

Claims

1. A camera module, comprising: a lens;a sensor component for sensing light gathered by the lens; anda fixing module for fixing the lens, the fixing module comprising an inner wall installed on the sensor component.

2. The camera module of claim 1 wherein the fixing module comprises: a first holder for fixing the lens; anda second holder, coupled to the first holder, comprising an inner wall.

3. The camera module of claim 2 further comprising a filter component coupled to the second holder, wherein the filter component, the inner wall and the sensor component form a sealed space.

4. The camera module of claim 1 further comprising: a circuit board, the sensor component being installed on the circuit board; anda molding material filling between the inner wall, the sensor component, and the circuit board.

5. The camera module of claim 4 further comprising: a connecting wire coupled to the sensor component and the circuit board for transmitting signals outputted by the sensor component to the circuit board, or for transmitting signals outputted by the circuit board to the sensor component;wherein the molding material covers the connecting wire to fix the connecting wire.

6. The camera module of claim 4 wherein the molding material is a heat insulating material.

7. The camera module of claim 1 wherein the inner wall encircles a sensing region of the sensor component, where the sensing region is utilized for sensing light gathered by the lens.

8. A method for forming a camera module, comprising: providing a fixing module comprising an inner wall; andutilizing the fixing module to fix a lens, and installing the inner wall on a sensor component.

9. The method of claim 8 wherein the fixing module comprises a first holder and a second holder, the second holder comprises the inner wall, and the method further comprising: utilizing the first holder to fix the lens, andcoupling the second holder to the first holder.

10. The method of claim 9 further comprising: providing a filter component, and coupling the filter component to the second holder so that the filter component, the inner wall and the sensor component form a sealed space.

11. The method of claim 8 further comprising: providing a circuit board, and installing the sensor component on the circuit board; andproviding a molding material, and filling the molding material between the inner wall, the sensor component and the circuit board.

12. The method of claim 11 further comprising: providing a connecting wire, and coupling the connecting wire to the sensor component and the circuit board to transmit signals outputted by the sensor component to the circuit board, or to transmit signals outputted by the circuit board to the sensor component;wherein the step of filling the molding material between the inner wall, the sensor component and the circuit board further comprises: utilizing the molding material to cover the connecting wire to fix the connecting wire.

13. The method of claim 11 wherein the molding material is a heat insulating material.

14. The method of claim 8 wherein the inner wall encircles a sensing region of the sensor component, where the sensing region is utilized for sensing light gathered by the lens.

15. The method of claim 9 further comprising: dynamically determining a size of the first holder according to a size of the lens.

16. A camera module, comprising: a circuit board;a sensor component installed on the circuit board;a plurality of connecting wires, electrically connected to the circuit board and the sensor component; anda fixing module, comprising an inner wall installed on the sensor component.

17. The camera module of claim 16 further comprising a molding material located on the circuit board for covering the plurality of connecting wires.