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H01L27/14618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14618Containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic modules and wafer-level methods for manufacturing th...
- Patent number 12,169,315
- Issue date Dec 17, 2024
- ams Sensors Singapore Pte. Ltd.
- Qi Chuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, imaging module, electronic device, and imaging system
- Patent number 12,165,049
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package, method of manufacturing the same, and imaging device
- Patent number 12,160,650
- Issue date Dec 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Dobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having curved imager
- Patent number 12,154,920
- Issue date Nov 26, 2024
- Denso Corporation
- Kouji Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure, connection structure,...
- Patent number 12,142,621
- Issue date Nov 12, 2024
- Dexerials Corporation
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device, and method of manufacturing s...
- Patent number 12,132,061
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tsuyoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera package, method for manufacturing camera package, and electr...
- Patent number 12,132,064
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroyasu Matsugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor substrate
- Patent number 12,132,062
- Issue date Oct 29, 2024
- LG Innotek Co., Ltd
- Jung Shik Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, method of manufacturing the same, and electronic appa...
- Patent number 12,125,860
- Issue date Oct 22, 2024
- Sony Corporation
- Hiroshi Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with photosensitive element mounted to back...
- Patent number 12,119,361
- Issue date Oct 15, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having packaged light detecting components within...
- Patent number 12,113,081
- Issue date Oct 8, 2024
- Taiwan RedEye Biomedical Inc.
- Shuo-Ting Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,113,082
- Issue date Oct 8, 2024
- Tong Hsing Electronic Industries, Ltd.
- Ya-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device including groove with recessed and proje...
- Patent number 12,107,106
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomohiko Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-flare semiconductor packages and related methods
- Patent number 12,107,102
- Issue date Oct 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, packaging method, camera module, and electronic...
- Patent number 12,107,101
- Issue date Oct 1, 2024
- Shanghai AVIC OPTO Electronics Co., Ltd.
- Kerui Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with tolerance optimizing interconnects
- Patent number 12,100,716
- Issue date Sep 24, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor package
- Patent number 12,100,720
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor assembly
- Patent number 12,094,902
- Issue date Sep 17, 2024
- Leica Camera AG
- Benjamin Hopp
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Imaging device
- Patent number 12,087,796
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Susumu Ooki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,080,636
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic apparatus, and method for manufact...
- Patent number 12,074,182
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 12,074,183
- Issue date Aug 27, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element and method of manufacturing imaging element
- Patent number 12,074,180
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshikazu Shibayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus and method for manufacturing the soli...
- Patent number 12,074,181
- Issue date Aug 27, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor module
- Patent number 12,069,400
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Yutaka Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding photosensitive assembly, and camera module and electronic d...
- Patent number 12,068,344
- Issue date Aug 20, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package having a light blocking member
- Patent number 12,068,345
- Issue date Aug 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20240405042
- Publication date Dec 5, 2024
- PixArt Imaging Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND APPARATUS
- Publication number 20240407098
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240387577
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- HyunKyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND METHOD THEREOF
- Publication number 20240387588
- Publication date Nov 21, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240379701
- Publication date Nov 14, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING PACKAGE STRUCTURE
- Publication number 20240379707
- Publication date Nov 14, 2024
- Lite-On Technology Corporation
- I-CHEN CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGE
- Publication number 20240371895
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240371896
- Publication date Nov 7, 2024
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20240363655
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE AND ELECTRONIC DEVICE
- Publication number 20240363656
- Publication date Oct 31, 2024
- Sony Semiconductor Solutions Corporation
- Yoshiaki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND FINGERPRINT-RECOGNITION DEVICE
- Publication number 20240363659
- Publication date Oct 31, 2024
- Rayprus Technology (Foshan) Co., Ltd.
- YUAN-HSU CHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR STABLIZING LINE-OF-SIGHT FALLING POINT
- Publication number 20240363670
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA
- Publication number 20240364992
- Publication date Oct 31, 2024
- MAGNA ELECTRONICS INC.
- Yuesheng Lu
- B60 - VEHICLES IN GENERAL
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355850
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS
- Publication number 20240355859
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...
- Publication number 20240355845
- Publication date Oct 24, 2024
- KYOCERA CORPORATION
- Kenichi KOHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEXTURE RECOGNITION MODULE AND DISPLAY DEVICE
- Publication number 20240355844
- Publication date Oct 24, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Yue GENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR CURVED-SURFACE IMAGE SENSOR
- Publication number 20240355846
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTOR UNIT, DETECTOR ARRAY, DETECTOR ARRAY MOTHERBOARD, DETECTOR...
- Publication number 20240355854
- Publication date Oct 24, 2024
- Hesai Technology Co., Ltd.
- You WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE, MANUFACTURING METHOD THEREOF AND CAMERA MODULE...
- Publication number 20240357220
- Publication date Oct 24, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jang Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optoelectronic modules and wafer-level methods for manufacturing th...

Reliable semiconductor packages

Imaging device, imaging module, electronic device, and imaging system

Sensor package, method of manufacturing the same, and imaging device

Camera module having curved imager

Method of manufacturing connection structure, connection structure,...

Semiconductor device, imaging device, and method of manufacturing s...

Camera package, method for manufacturing camera package, and electr...

Image sensor substrate

Image sensor, method of manufacturing the same, and electronic appa...

Circuit board assembly with photosensitive element mounted to back...

Sensor package structure

Package structure having packaged light detecting components within...

Sensor package structure

Solid-state imaging device including groove with recessed and proje...

Anti-flare semiconductor packages and related methods

Package structure, packaging method, camera module, and electronic...

Image sensor with tolerance optimizing interconnects

Wafer level image sensor package

Reliable semiconductor packages

Image sensor assembly

Imaging device

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device, electronic apparatus, and method for manufact...

Semiconductor packaging method and semiconductor package device

Imaging element and method of manufacturing imaging element

Solid-state imaging apparatus and method for manufacturing the soli...

Sensor module

Molding photosensitive assembly, and camera module and electronic d...

Image sensor package having a light blocking member

Patents Applicationslast 30 patents

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

RELIABLE SEMICONDUCTOR PACKAGES

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

MODULE AND APPARATUS

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

IMAGE SENSOR PACKAGES AND METHOD THEREOF

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD

SENSING PACKAGE STRUCTURE

WAFER LEVEL IMAGE SENSOR PACKAGE

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

IMAGE SENSOR MODULE

IMAGING ELEMENT PACKAGE AND ELECTRONIC DEVICE

IMAGING DEVICE AND FINGERPRINT-RECOGNITION DEVICE

METHOD FOR STABLIZING LINE-OF-SIGHT FALLING POINT

CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...

TEXTURE RECOGNITION MODULE AND DISPLAY DEVICE

APPARATUS AND METHOD FOR CURVED-SURFACE IMAGE SENSOR

DETECTOR UNIT, DETECTOR ARRAY, DETECTOR ARRAY MOTHERBOARD, DETECTOR...

IMAGE SENSOR MODULE, MANUFACTURING METHOD THEREOF AND CAMERA MODULE...