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H01L27/14618

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14618Containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Edge seals for semiconductor packages
- Patent number 12,211,865
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TOF camera module and projection module thereof, and electronic device
- Patent number 12,206,964
- Issue date Jan 21, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Hangang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module particle capture by sticky dust trap epoxy
- Patent number 12,200,332
- Issue date Jan 14, 2025
- Apple Inc.
- Paulom Shah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Digital cameras with direct luminance and chrominance detection
- Patent number 12,200,374
- Issue date Jan 14, 2025
- Intellectual Ventures II LLC
- Richard Ian Olsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,177,996
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules and wafer-level methods for manufacturing th...
- Patent number 12,169,315
- Issue date Dec 17, 2024
- ams Sensors Singapore Pte. Ltd.
- Qi Chuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, imaging module, electronic device, and imaging system
- Patent number 12,165,049
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package, method of manufacturing the same, and imaging device
- Patent number 12,160,650
- Issue date Dec 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Dobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having curved imager
- Patent number 12,154,920
- Issue date Nov 26, 2024
- Denso Corporation
- Kouji Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure, connection structure,...
- Patent number 12,142,621
- Issue date Nov 12, 2024
- Dexerials Corporation
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device, and method of manufacturing s...
- Patent number 12,132,061
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tsuyoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera package, method for manufacturing camera package, and electr...
- Patent number 12,132,064
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroyasu Matsugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor substrate
- Patent number 12,132,062
- Issue date Oct 29, 2024
- LG Innotek Co., Ltd
- Jung Shik Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, method of manufacturing the same, and electronic appa...
- Patent number 12,125,860
- Issue date Oct 22, 2024
- Sony Corporation
- Hiroshi Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with photosensitive element mounted to back...
- Patent number 12,119,361
- Issue date Oct 15, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having packaged light detecting components within...
- Patent number 12,113,081
- Issue date Oct 8, 2024
- Taiwan RedEye Biomedical Inc.
- Shuo-Ting Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,113,082
- Issue date Oct 8, 2024
- Tong Hsing Electronic Industries, Ltd.
- Ya-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device including groove with recessed and proje...
- Patent number 12,107,106
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomohiko Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-flare semiconductor packages and related methods
- Patent number 12,107,102
- Issue date Oct 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, packaging method, camera module, and electronic...
- Patent number 12,107,101
- Issue date Oct 1, 2024
- Shanghai AVIC OPTO Electronics Co., Ltd.
- Kerui Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with tolerance optimizing interconnects
- Patent number 12,100,716
- Issue date Sep 24, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor package
- Patent number 12,100,720
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor assembly
- Patent number 12,094,902
- Issue date Sep 17, 2024
- Leica Camera AG
- Benjamin Hopp
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Imaging device
- Patent number 12,087,796
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Susumu Ooki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,080,636
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
- Publication number 20250040275
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIEN-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20250040276
- Publication date Jan 30, 2025
- Powertech Technology Inc.
- Hung-Hsin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE,...
- Publication number 20250031468
- Publication date Jan 23, 2025
- DEXERIALS CORPORATION
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, RADIATION DETECTOR, AND RADIATION IMAGING SYSTEM
- Publication number 20250022906
- Publication date Jan 16, 2025
- Canon Kabushiki Kaisha
- YU KATASE
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUST...
- Publication number 20250015105
- Publication date Jan 9, 2025
- KANEKA CORPORATION
- Ayumu OGAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20250006755
- Publication date Jan 2, 2025
- Sony Semiconductor Solutions Corporation
- KOSUKE HAREYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING MODULE MANUFACTURING METHOD
- Publication number 20250006756
- Publication date Jan 2, 2025
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS
- Publication number 20250006772
- Publication date Jan 2, 2025
- Dexerials Corporation
- Yuina KOKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240429253
- Publication date Dec 26, 2024
- Sony Semiconductor Solutions Corporation
- TASUKU OGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...
- Publication number 20240429260
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Cheng Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20240405042
- Publication date Dec 5, 2024
- PixArt Imaging Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND APPARATUS
- Publication number 20240407098
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240387577
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- HyunKyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND METHOD THEREOF
- Publication number 20240387588
- Publication date Nov 21, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240379701
- Publication date Nov 14, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING PACKAGE STRUCTURE
- Publication number 20240379707
- Publication date Nov 14, 2024
- Lite-On Technology Corporation
- I-CHEN CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGE
- Publication number 20240371895
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240371896
- Publication date Nov 7, 2024
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge seals for semiconductor packages

Camera module, and photosensitive assembly and manufacturing method...

Reliable semiconductor packages

TOF camera module and projection module thereof, and electronic device

Camera module particle capture by sticky dust trap epoxy

Digital cameras with direct luminance and chrominance detection

Sensor package structure

Optoelectronic modules and wafer-level methods for manufacturing th...

Reliable semiconductor packages

Imaging device, imaging module, electronic device, and imaging system

Sensor package, method of manufacturing the same, and imaging device

Camera module having curved imager

Method of manufacturing connection structure, connection structure,...

Semiconductor device, imaging device, and method of manufacturing s...

Camera package, method for manufacturing camera package, and electr...

Image sensor substrate

Image sensor, method of manufacturing the same, and electronic appa...

Circuit board assembly with photosensitive element mounted to back...

Sensor package structure

Package structure having packaged light detecting components within...

Sensor package structure

Solid-state imaging device including groove with recessed and proje...

Anti-flare semiconductor packages and related methods

Package structure, packaging method, camera module, and electronic...

Image sensor with tolerance optimizing interconnects

Wafer level image sensor package

Reliable semiconductor packages

Image sensor assembly

Imaging device

Semiconductor package and manufacturing method of semiconductor pac...

Patents Applicationslast 30 patents

SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF

IMAGE SENSOR PACKAGE

METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE,...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

ELECTRONIC COMPONENT, RADIATION DETECTOR, AND RADIATION IMAGING SYSTEM

SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUST...

SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT

IMAGE SENSING MODULE MANUFACTURING METHOD

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS

SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

RELIABLE SEMICONDUCTOR PACKAGES

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

MODULE AND APPARATUS

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

IMAGE SENSOR PACKAGES AND METHOD THEREOF

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD

SENSING PACKAGE STRUCTURE

WAFER LEVEL IMAGE SENSOR PACKAGE

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME