James B. Intrater, "Microanalysis Of A Copper-To-Graphite Solder Bond", Mat. Res. Soc. Symp. Proc. vol. 314 .COPYRGT. 1993 Material Research Society, pp. 95-102. |
J. Intrater, "Review of Some Processes For Ceramic-To-Metal Joining", Materials & Manufacturing Processes8(3), 353-373 (1993). |
"Sputtering Target Bonding", ATI Materials. |
"A New Direction In Surface Analysis", TTS 100 Oryx Technology Corporation. |
"Electromagnet Systems", ATI Magnetics. |
"SurgX.TM. ESD Protection On Board", Oryx Technology Corporation, Feb. 1995. |
James Intrater, "Intragene.TM. Metallization On 96% A1.sub.2 0.sub.3 And A1N: Solder Pull Strength Data", pp. 1-3, Oryx Technology Corporation. |
James Intrater, "Intragene.TM. Metallization On CVD-Diamond Coated Si.sub.3 N.sub.4 ", pp. 1-3, Oryx Technology Corporation. |
James Intrater, "The Challenge of Bonding Metals to Ceramics", Technical Bulletin, Ceramic/Metal Bonding, Advanced Technology, Inc., Reprinted from Machine Design Nov. 23, 1989. |
James Intrater, "How to Select the Right Metallizationh/Joining Method", Advanced Technology, Inc., Reprinted from Ceramic Industry Feb. 1991, Business News Publishing Company. |