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CPC
Y10T29/49144

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/49144by metal fusion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low footprint optical interconnects
- Patent number 11,726,274
- Issue date Aug 15, 2023
- WAVEFRONT RESEARCH, INC.
- Randall C. Veitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic device
- Patent number 11,652,197
- Issue date May 16, 2023
- Nichia Corporation
- Masafumi Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and method of forming the same
- Patent number 11,562,911
- Issue date Jan 24, 2023
- Hitachi Energy Switzerland AG
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low footprint optical interconnects
- Patent number 11,163,124
- Issue date Nov 2, 2021
- Wavefront Research, Inc.
- Randall C. Veitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 11,166,399
- Issue date Nov 2, 2021
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric conversion element and thermoelectric conversion module
- Patent number 11,088,309
- Issue date Aug 10, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yui Saitou
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular power conversion system and method
- Patent number 11,027,354
- Issue date Jun 8, 2021
- Illinois Tool Works Inc.
- Jason Alan Dunahoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,018,086
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic device
- Patent number 10,950,770
- Issue date Mar 16, 2021
- Nichia Corporation
- Masafumi Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging circuits
- Patent number 10,811,278
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method and laser processing apparatus
- Patent number 10,796,959
- Issue date Oct 6, 2020
- Hamamatsu Photonics K.K.
- Fumitsugu Fukuyo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection verification technique
- Patent number 10,717,141
- Issue date Jul 21, 2020
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing conductive material, conductive material obtai...
- Patent number 10,573,795
- Issue date Feb 25, 2020
- Nichia Corporation
- Masafumi Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 10,524,347
- Issue date Dec 31, 2019
- Schoeller Electronics Systems GmbH
- Jan Hendrik Berkel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging circuits
- Patent number 10,453,704
- Issue date Oct 22, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 10,349,568
- Issue date Jul 9, 2019
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a liquid crystal polymer solder mask and r...
- Patent number 10,342,126
- Issue date Jul 2, 2019
- Harris Corporation
- Louis Joseph Rendek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a heavy-current transformer
- Patent number 10,325,720
- Issue date Jun 18, 2019
- Fronius International GmbH
- Bernhard Artelsmair
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20230008716
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC DEVICE
- Publication number 20210167264
- Publication date Jun 3, 2021
- Nichia Corporation.
- Masafumi KURAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20210125923
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...
- Publication number 20190394912
- Publication date Dec 26, 2019
- SKYWORKS SOLUTIONS, INC.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20190362988
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...
- Publication number 20190326493
- Publication date Oct 24, 2019
- Nichia Corporation.
- Masafumi KURAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20190115298
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20180068897
- Publication date Mar 8, 2018
- HAMAMATSU PHOTONICS K. K.
- Fumitsugu Fukuyo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION VERIFICATION TECHNIQUE
- Publication number 20180043450
- Publication date Feb 15, 2018
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...
- Publication number 20180013045
- Publication date Jan 11, 2018
- Nichia Corporation.
- Masafumi KURAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20170339785
- Publication date Nov 23, 2017
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20170312841
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURED SUBSTRATE FOR OPTICAL FIBER ALIGNMENT
- Publication number 20170261706
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
MODULAR POWER CONVERSION SYSTEM AND METHOD
- Publication number 20140374395
- Publication date Dec 25, 2014
- Jason Alan Dunahoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING SYSTEM FOR FORMING THREE DIMENSIONAL OBJECTS
- Publication number 20140345521
- Publication date Nov 27, 2014
- 3D Systems, Inc.
- Kia Silverbrook
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347822
- Publication date Nov 27, 2014
- Murata Manufacturing Co., Ltd.
- Masaaki MIZUSHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBE CARD
- Publication number 20140347085
- Publication date Nov 27, 2014
- Yung-Hsin KUO
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...
- Publication number 20140332260
- Publication date Nov 13, 2014
- Koji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20140321089
- Publication date Oct 30, 2014
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...
- Publication number 20140304984
- Publication date Oct 16, 2014
- VALEO ETUDES ELECTRONIQUES
- Laurent VIVET
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by metal fusion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Chip-transferring system and chip-transferring method

Solderless interconnection structure and method of forming same

Stacked microfeature devices and associated methods

Panel-molded electronic assemblies

Passive devices in package-on-package structures and methods for fo...

Low footprint optical interconnects

Method for manufacturing an electronic module and electronic module

Method for producing an electronic device

Power semiconductor module and method of forming the same

Stacked microfeature devices and associated methods

System for processing semiconductor devices

Low footprint optical interconnects

Overmolded electronic module with an integrated electromagnetic shi...

Thermoelectric conversion element and thermoelectric conversion module

Electronic module

Solderless interconnection structure and method of forming same

Modular power conversion system and method

Passive devices in package-on-package structures and methods for fo...

Method for producing an electronic device

Method for packaging circuits

Laser processing method and laser processing apparatus

Connection verification technique

Method for producing conductive material, conductive material obtai...

Voiding control using solid solder preforms embedded in solder paste

Circuit board

Method for packaging circuits

Overmolded electronic module with an integrated electromagnetic shi...

Electronic device having a liquid crystal polymer solder mask and r...

Method for producing a heavy-current transformer

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

Tools and Systems for Processing Semiconductor Devices, and Methods...

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

ELECTRONIC MODULE

Solderless Interconnection Structure and Method of Forming Same

METHOD FOR PRODUCING AN ELECTRONIC DEVICE

Passive Devices in Package-on-Package Structures and Methods for Fo...

OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...

METHOD FOR PACKAGING CIRCUITS

METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...

Solderless Interconnection Structure and Method of Forming Same

Passive Devices in Package-on-Package Structures and Methods for Fo...

Tools and Systems for Processing Semiconductor Devices, and Methods...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

CONNECTION VERIFICATION TECHNIQUE

METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

CHIP JOINING BY INDUCTION HEATING

STRUCTURED SUBSTRATE FOR OPTICAL FIBER ALIGNMENT

MODULAR POWER CONVERSION SYSTEM AND METHOD

PRINTING SYSTEM FOR FORMING THREE DIMENSIONAL OBJECTS

MODULE AND METHOD FOR MANUFACTURING THE SAME

TEST PROBE CARD

METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...