BRIEF DESCRIPTION OF THE DRAWINGS
The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
FIGS. 1A and 1B (prior art) are schematic planar and cross-sectional views showing a prior carrier board structure with a semiconductor chip embedded therein.
FIG. 2 is a schematic planar view showing the rectangular cavity formed in the carrier board in accordance the first preferred embodiment of the present invention;
FIGS. 3A to 3C are schematic planar views showing the formation of the breaches at the corners of the rectangular cavity of the carrier board in accordance with the first preferred embodiment of the present invention;
FIG. 4A is a schematic planar view showing a semiconductor chip being disposed into the rectangular cavity in accordance with the first preferred embodiment of the present invention;
FIG. 4B is a schematic perspective view showing the rectangular cavity of the carrier board with a semiconductor chip embedded therein in accordance with the first preferred embodiment of the present invention;
FIGS. 5A to 5C are schematic planar views showing the formation of the breach at the corners of the rectangular cavity in accordance with the second preferred embodiment of the present invention; and
FIG. 6 is a schematic planar view showing a semiconductor chip being disposed into the rectangular cavity in accordance with the second preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention is described in the following with specific embodiments, so that one skilled in the pertinent art can easily understand other advantages and effects of the present invention from the disclosure of the invention. The present invention may also be implemented and applied according to other embodiments, and the details may be modified based on different views and applications without departing from the spirit of the invention.
Referring to FIG. 2, FIGS. 3A to 3C and FIG. 4, FIG. 2, FIGS. 3A to 3C and FIG. 4 are the top views of a carrier board with a semiconductor chip embedded therein according to the first preferred embodiment of the invention.
As shown in FIG. 2, a carrier board 20 is provided, and a rectangular cavity 201 is formed at a predetermined position of the carrier board 20 through a cutting process along the predetermined cutting line by means of mechanical or laser drilling. The carrier board 20 is one selected from the group consisting of an insulation board, a metallic board, and a circuit board finished with front-end wiring processes.
As shown in FIGS. 3A to 3C, breaches, which extend form the rectangular cavity 201, are formed at the corners of the rectangular cavity 201 by means of mechanical drilling, laser drilling, or pressing. The breach can be composed of a plurality of drilling holes formed by a combination of a large drilling hole 21a and two small drilling holes 21b adjacent to the large drilling hole 21a (as shown in FIG. 3A), or formed by a combination of a small drilling hole 21b and two large drilling holes 21a adjacent to the small drilling hole 21b (as shown in FIG. 3B) or formed by a plurality of large drilling holes 21a (as shown in FIG. 3C), so as to eliminate the arc-shaped corners, which are formed in process of cutting the rectangular cavity 201. It should be understood that the number of the breaches formed has no specific limitation; namely, the breach may be formed at a single corner, or more than one corner, or each of the four corners of the rectangular cavity 201.
As shown in FIGS. 4A and 4B, which are illustrated based on the carrier board of FIG. 3A, a semiconductor chip 22 is disposed into the rectangular cavity 201. Because each of the corners of the rectangular cavity 201 forms a breach composed of a plurality of drilling holes, it forms a larger accessible space for the rectangular cavity 201 to accommodate the semiconductor chip 22. As a result, the corners 221 of the semiconductor chip 22 are allowed to be accommodated in either the large drilling holes 21a or the small drilling holes 21b, such that rectangular cavity 201 is not interfered with the semiconductor chip 22 at the time of disposing the semiconductor chip 22 into the rectangular cavity 201. Moreover, it is beneficial to the subsequent fabricating procedures.
A gap is formed between the periphery of the semiconductor chip 22 and the periphery of the rectangular cavity 201 of the carrier board 20, and is in a range of from 10 μm to 200 μm. The gap between the rectangular cavity 201 in the carrier board 20 and the semiconductor chip 22 is further filled with an adhesive material 24, so as to secure the semiconductor chip 22 in position in the rectangular cavity 201 of the carrier board 20.
FIGS. 5A to 5C, and FIG. 6 are top views showing the fabricating method of a carrier board with a semiconductor chip embedded therein, in accordance with the second preferred embodiment of the invention. The difference between this embodiment and the foregoing first embodiment is that breaches are formed on the carrier board before forming the rectangular cavity.
As shown in FIGS. 5A to 5C, a carrier board 20 is provided. Breaches extending from predetermined positions 23 corresponding to the corners of the rectangular cavity to be formed in the carrier board 20 are formed. The breaches are formed by means of mechanical drilling, laser drilling, or pressing, and can be in a form of a combination of a large drilling hole 21a and two small drilling holes 21b adjacent to the large drilling hole 21a (as shown in FIG. 5A), or a combination of a small drilling hole 21b and two large drilling holes 21a adjacent to the small drilling hole 21b (as shown in FIG. 5B), or formed by a plurality of large drilling holes 21a (as shown in FIG. 5C). The carrier board 20 is one selected from the group consisting of an insulation board, a metallic board, and a circuit board finished with front-end wiring processes.
Subsequently, as shown in FIG. 6, illustrated based on the carrier board of FIG. 5A, a rectangular cavity 201 is formed by means of mechanical drilling or laser drilling at locations of the carrier board 20 corresponding to the predetermined positions 23, allowing the large drilling holes 21a to be formed at the corners of the rectangular cavity 201.
The invention has been described using exemplary preferred embodiments. However, it is to be understood that the scope of the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Patent Application
20070241444
