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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/13characterised by the shape

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric Stackup Structure for SoC package substrates
- Patent number 12,322,721
- Issue date Jun 3, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,322,684
- Issue date Jun 3, 2025
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,315,789
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 12,317,619
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,345
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates and related methods
- Patent number 12,300,558
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 12,300,594
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,293,950
- Issue date May 6, 2025
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,274,079
- Issue date Apr 8, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with substrate cavity for bridge-attach
- Patent number 12,272,650
- Issue date Apr 8, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,261,108
- Issue date Mar 25, 2025
- BITMAIN TECHNOLOGIES INC.
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and method for assembling same and spliced display de...
- Patent number 12,262,474
- Issue date Mar 25, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Kanmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,249,546
- Issue date Mar 11, 2025
- Kyocera Corporation
- Sadamu Kajisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate void filling for an integrated circuit assembly
- Patent number 12,237,300
- Issue date Feb 25, 2025
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250183181
- Publication date Jun 5, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device and Manufacturing Method thereof
- Publication number 20250183188
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183194
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jingyu BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250185173
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
- Publication number 20250174503
- Publication date May 29, 2025
- Minebea Power Semiconductor Device Inc.
- Norio NAKAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR
- Publication number 20250174507
- Publication date May 29, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174600
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Donghoon WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...
- Publication number 20250174570
- Publication date May 29, 2025
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174502
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Liqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...
- Publication number 20250167169
- Publication date May 22, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250167059
- Publication date May 22, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167056
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF EMI SHIELDING
- Publication number 20250167132
- Publication date May 22, 2025
- Applied Materials, Inc.
- Ghaleb Saleh Ghaleb Al-Duhni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...
- Publication number 20250157999
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Jinwen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...
- Publication number 20250158006
- Publication date May 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE ON INTERPOSER PACKAGES
- Publication number 20250149462
- Publication date May 8, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED DIRECT COOLED POWER MODULE
- Publication number 20250149417
- Publication date May 8, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE
- Publication number 20250140682
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- JIYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140707
- Publication date May 1, 2025
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with underfill

Semiconductor device

Asymmetric Stackup Structure for SoC package substrates

Method of manufacturing electronic devices and corresponding electr...

Window ball grid array (WBGA) package and method for manufacturing...

Microelectronic assemblies

Solid-state imaging device and electronic device

Wiring board, semiconductor device, and method of manufacturing wir...

Semiconductor package

Photonic wafer communication systems and related packages

Package for power semiconductor devices

Semiconductor device including differential height PCB

Substrates and related methods

Fan-out semiconductor package and electronic device including the same

Liquid cooled interposer for integrated circuit stack

Semiconductor devices and methods of manufacturing semiconductor de...

Microelectronic assemblies

Fan-out semiconductor package

Semiconductor package and manufacturing method thereof

Deep trench capacitors embedded in package substrate

Microelectronic package with substrate cavity for bridge-attach

Chip heat dissipating structure, chip structure, circuit board and...

Display panel and method for assembling same and spliced display de...

Secure semiconductor integration and method for making thereof

Nitride-based semiconductor module and method for manufacturing the...

Semiconductor package including heat dissipation layer

Electronic element mounting substrate and electronic device

Integrated circuit package and method of forming same

Alternative surfaces for conductive pad layers of silicon bridges f...

Through-substrate void filling for an integrated circuit assembly

Patents Applicationslast 30 patents

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

Electric Device and Manufacturing Method thereof

SEMICONDUCTOR PACKAGE

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE

METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE

METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...

POWER CONVERSION DEVICE

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

SEMICONDUCTOR PACKAGE

NOVEL METHOD OF EMI SHIELDING

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...

EMBEDDED DIE ON INTERPOSER PACKAGES

SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

SINGLE-SIDED DIRECT COOLED POWER MODULE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE