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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/13characterised by the shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,249,546
- Issue date Mar 11, 2025
- Kyocera Corporation
- Sadamu Kajisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,237,272
- Issue date Feb 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate void filling for an integrated circuit assembly
- Patent number 12,237,300
- Issue date Feb 25, 2025
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 12,238,864
- Issue date Feb 25, 2025
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal control of a hybrid chip assembly
- Patent number 12,205,920
- Issue date Jan 21, 2025
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element housing package and electronic apparatus
- Patent number 12,198,992
- Issue date Jan 14, 2025
- Kyocera Corporation
- Masanori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit carrier with chip mounted thereon
- Patent number 12,198,993
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with recessed memory
- Patent number 12,191,281
- Issue date Jan 7, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 12,183,666
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,165,984
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20250096101
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Carsten Joachim von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP
- Publication number 20250093594
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20250096145
- Publication date Mar 20, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087590
- Publication date Mar 13, 2025
- Shinko Electric Industries Co., Ltd.
- Hisashi KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087541
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079243
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20250079284
- Publication date Mar 6, 2025
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079389
- Publication date Mar 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069967
- Publication date Feb 27, 2025
- DENSO CORPORATION
- Akinori SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070012
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Juhyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME
- Publication number 20250069965
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
C2W STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20250069966
- Publication date Feb 27, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES
- Publication number 20250062167
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250062279
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062248
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES
- Publication number 20250054823
- Publication date Feb 13, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Mounting Region for Mounting a Component
- Publication number 20250054820
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Lonis Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046661
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsin-Mao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING AIR GAP
- Publication number 20250046701
- Publication date Feb 6, 2025
- RF MATERIALS CO., LTD.
- Ki Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...
- Publication number 20250038099
- Publication date Jan 30, 2025
- CAMBRIDGE INTEGRATION LTD
- Ameer Hussein Abd JANABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...
- Publication number 20250038086
- Publication date Jan 30, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Secure semiconductor integration and method for making thereof

Nitride-based semiconductor module and method for manufacturing the...

Semiconductor package including heat dissipation layer

Electronic element mounting substrate and electronic device

Integrated circuit package and method of forming same

Alternative surfaces for conductive pad layers of silicon bridges f...

Electronic device and method of manufacturing the same

Through-substrate void filling for an integrated circuit assembly

Electronic apparatus

Deep trench capacitors embedded in package substrate

Double-sided substrate with cavities for direct die-to-die intercon...

Fabric with embedded electrical components

Method to enable 30 microns pitch EMIB or below

Embedded die on interposer packages

Method for manufacturing semiconductor device and semiconductor device

Display apparatus

Semiconductor package and method of fabricating the same

Printed circuit board and package substrate including same

Electronic device and method of manufacturing electronic device

Electronic component with metallic cap

Enhanced thermal control of a hybrid chip assembly

Electronic element housing package and electronic apparatus

Manufacturing method of circuit carrier with chip mounted thereon

Multi-chip package with recessed memory

Antenna with graded dielectirc and method of making the same

Ceramic laminated substrate, module, and method of manufacturing ce...

Multiple pixel package structure with buried chip and electronic de...

Method of manufacturing a ceramic structure with metal traces

Component carrier and method of manufacturing a component carrier

Semiconductor device package

Patents Applicationslast 30 patents

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP

ELECTRONIC PACKAGING STRUCTURE

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME

C2W STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES

Component Carrier With Mounting Region for Mounting a Component

CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE HAVING AIR GAP

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...

Submounts with Stud Protrusions for Semiconductor Packages

PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...

Submounts with Stud Protrusions for Semiconductor Packages