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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/13characterised by the shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 12,165,984
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,971
- Issue date Oct 29, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Shohei Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package substrate, sensor module including the same, and ele...
- Patent number 12,125,754
- Issue date Oct 22, 2024
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with cavity in interposer
- Patent number 12,125,755
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stem for semiconductor package including eyelet and lead
- Patent number 12,113,329
- Issue date Oct 8, 2024
- Shinko Electric Industries Co., Ltd.
- Masao Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,113,011
- Issue date Oct 8, 2024
- Fuji Electric Co., Ltd.
- Hiroto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module comprising shield and sealing resin cov...
- Patent number 12,113,030
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having undercut portion for stress mitigation
- Patent number 12,113,032
- Issue date Oct 8, 2024
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,185
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Kakoiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,057,424
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of recesses and molding m...
- Patent number 12,057,357
- Issue date Aug 6, 2024
- Samsung Electronics Co, Ltd.
- Kyong Hwan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,058,101
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip on film assembly, display panel, and display module
- Patent number 12,057,382
- Issue date Aug 6, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421061
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20240413027
- Publication date Dec 12, 2024
- KYOCERA CORPORATION
- Yoshimasa SUGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Publication number 20240404896
- Publication date Dec 5, 2024
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPLEX WITH EMBEDDED INTERPOSER
- Publication number 20240404897
- Publication date Dec 5, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240363515
- Publication date Oct 31, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355723
- Publication date Oct 24, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
- Publication number 20240347402
- Publication date Oct 17, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347401
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-TYPE WIND SPEED SENSOR AND METHOD OF MANUFACTURING TH...
- Publication number 20240339380
- Publication date Oct 10, 2024
- TECH UNIVERSITY OF KOREA Industry Academic Cooperation Foundation
- Chang Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240332272
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240332208
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BOARD
- Publication number 20240334607
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Co., Ltd.
- Mitsunori HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTR...
- Publication number 20240297108
- Publication date Sep 5, 2024
- KYOCERA CORPORATION
- Kanae HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED SPACE UTILIZATION AND METHOD FO...
- Publication number 20240290671
- Publication date Aug 29, 2024
- STATS ChipPAC Pte Ltd.
- Gwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240290750
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun LEE
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Seamless interconnect thresholds using dielectric fluid channels

Semiconductor package and antenna module comprising the same

Multi-chip package

Microelectronic assemblies

Semiconductor module

Sensor package substrate, sensor module including the same, and ele...

Chip package structure with cavity in interposer

Copper/ceramic joined body and insulating circuit substrate

Multi-chip package and method of providing die-to-die interconnects...

Stem for semiconductor package including eyelet and lead

Heat removal from silicon photonics chip using a recessed side-by-s...

Semiconductor device and method of manufacturing the same

Electronic component module comprising shield and sealing resin cov...

Substrate having undercut portion for stress mitigation

Semiconductor device, semiconductor module, vehicle, and manufactur...

Interconnection between chips by bridge chip

High density interconnect device and method

Through-hole electrode substrate

Semiconductor device

Isolated 3D semiconductor device package with transistors attached...

Multi-die fine grain integrated voltage regulation

Package structure and method for forming the same

Semiconductor package including plurality of recesses and molding m...

Package structure and method of forming the same

Chip on film assembly, display panel, and display module

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

THROUGH-HOLE ELECTRODE SUBSTRATE

CIRCUIT BOARD

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY

CHIP COMPLEX WITH EMBEDDED INTERPOSER

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR-TYPE WIND SPEED SENSOR AND METHOD OF MANUFACTURING TH...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

PRINTED CIRCUIT BOARD

MOUNTING BOARD

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

ELECTRONIC ELEMENT MOUNTING BOARD, ELECTRONIC COMPONENT, AND ELECTR...

SEMICONDUCTOR PACKAGE WITH IMPROVED SPACE UTILIZATION AND METHOD FO...

SEMICONDUCTOR PACKAGES