1. Field
The present disclosure relates to a carrier for holding a packaged chip, and a handler equipped with test trays having the carrier.
2. Background
A test handler puts packaged chips through electrical tests at the conclusion of a packaging process. The handler transfers the packaged chips from a user tray to a test tray, and then supplies the test tray containing the packaged chips to a tester. The tester includes a test board with a plurality of sockets. The handler makes the packaged chips in the test tray individually contact with sockets of the test board. The tester then performs the electrical tests on the packaged chips. After sorting the packaged chips according to test results, the handler transfers them from the test tray to the corresponding user trays.
The packaged chips are mounted in the carriers of a test tray before the test tray is transferred to different locations in the handler. The carriers of the test tray prevent the packaged chips from dropping from the test tray as the test tray is moved.
The carriers are arranged in rows and columns on a test tray. One packaged chip is placed into each carrier. When a packaged chip is placed into a carrier, a latch of the carrier holds it firmly in place. When the latch releases the packaged chip, it can be removed from the carrier.
The carrier 1 is subject to outside impact or shock in most environments. When the coil spring 18 is not sufficiently strong to resist such shocks, the latch fails to hold the packaged chips firmly in place. Thus, the packaged chip is prone to drop from the carrier 1.
The embodiments will be described in detail with reference to the following drawings, in which like reference numerals refer to like elements, and wherein:
As shown in
The holding space 112 is a hole vertically pierced through the housing 110. The holding space 112 is where the packaged chip is placed. The housing 110 also includes a supporting part 114 protruding from the inside lateral surface thereof toward the holding space 112. The supporting part 114 serves to support the packaged chip placed into the holding space 112.
The upper end of the guiding hole 116 is closed, and the lower end is opened. The guiding hole 116 includes a first portion 117, along which the guiding block 140 ascends and descends, and a second portion 118, along which the latch 130 moves backwards and forwards as the guiding block 140 ascends and descends.
The guiding block 140 has an opening in the side. The latch 130 is inserted into the opening in the guiding block 140. The latch 130 moves backwards and forwards inside of the guiding block 140 as the guiding block 140 ascends and descends in the guiding hole 116.
The guiding block 140 has an elongated longitudinal hole 142, piercing opposing sides thereof, with its length being parallel to the direction in which a pushing pin 170 ascends and descends, and also parallel to the direction the guiding block travels within the guiding hole. The latch 130 also has an elongated hole 132, piercing opposite sides thereof, with its length being oriented at an angle with respect to the length of the elongated longitudinal hole 142 on the guiding block. A guiding pin 120 is inserted into the first and second longitudinal holes 142 and 132, and one or both ends of the guiding pin are attached to the housing.
When the guiding block 140 reaches the lower end of the guiding hole 116, the upper end of the elongated hole 132 on the latch is positioned at the same height as the upper end of the elongated longitudinal hole 142 on the guiding block. When the guiding block 140 reaches the upper end of the guiding hole 116, the lower end of the elongated longitudinal hole 132 of the latch is positioned at the same height as the lower end of the elongated longitudinal hole 142 on the guiding block. At this point, the upper end of the elongated hole 132 of the latch may be positioned further from the holding space 112 than the lower end of the elongated hole 132 of the latch. This occurs because the elongated hole 132 of the latch is oriented at an angle to the elongated longitudinal hole 142 of the guiding block.
As shown in
A pushing pin 170 which is a part of a test handler pushes the guiding block 140 upwards to cause the latch to release a chip. When the guiding block 140 ascends from the lower end of the guiding hole 116 to the upper end of the guiding hole 116, the guiding pin moves along the elongated holes. Because the elongated hole of the latch is angled, this upward movement causes the latch 130 to withdraw from the holding space 112 and into the guiding block 140.
The elastic member 150 presses the guiding block 140 downwards. Because the elastic member 150 pushes the guiding block 140 downwards, unless the carrier is given a shock or impact, the guiding block remains positioned at the lower end of the guiding hole 116, which causes the latch 130 to hold the packaged chip firmly in place.
A space between the latch 130 and the guiding block 140 may be small enough to make the latch 130 supportable by the internal sides of the guiding block 140. This ensures that the latch 130 only begins to move upon movement of the guiding block. As a result, the latch 130, although given shock or impact, is not permitted to move unless the guiding block 140 moves.
The latch 130 is not permitted to protrude from the guiding block 140 into the holding space 112, when the latch reaches the upper end of the guiding hole 116. This is done to allow a transferring unit, such as a picker, to pick up the packaged chip from the holding space 112 or to place a chip into the holding space 112.
Referring to
After this is done, the transferring unit, such as the picker, places a packaged chip into the holding space 112 or removes it from the holding space 112.
The pushing pin 170 then descends and at the same time the elastic member 150, inserted into the guiding hole 116, presses the guiding block 140 downwards. Thus the guiding block 140 descends. As the guiding block 140 descends, the latch 130 descends, and the latch 130 extends out of the guiding block 140 so that it protrudes into the holding space 112 to hold the packaged chip firmly in place.
As shown in
The test tray 205 includes a plurality of the carriers 100 described above. The packaged chips are placed into the carriers 100. The handler includes at least one picker (250a, 250b, 250c, or 250d) to load the packaged chips S into or unload them from the test tray. The loading picker picks up the packaged chips S to place them into the carriers of the test tray 205, and the unloading picker picks up the tested packaged chips S from the carriers 100 of the test tray 205 to place them into the second user tray 220.
As shown in
The handler may further include a test system 240. The test system 240 includes several chambers, provided behind the handler, where the packaged chips contained in the test tray are heated or cooled to extremely high or low temperature, tested, and cooled or heated to room temperature. The test chamber is where the packaged chips come in contact with sockets of a test board in an outside tester to receive electrical tests.
As shown in
The base plate 291 may further include two or more guiding pins 293. The guiding pins 293 are provided on an upper side of the base plate 291, adjacent to the pushing pins 292. The guiding pins 293 are longer than the pushing pins 292, and they are inserted into a guiding hole ahead of the pushing pins 292. Thus, the guiding pins 293 guide the pushing pins 292.
A carrier as described above provides an advantage of holding the packaged chips firmly in place regardless of applied forces. Thus the packaged chips are prevented from dropping from the carrier while the test tray containing them moves in the handler.
Any reference in this specification to “one embodiment,” “an embodiment,” “example embodiment,” etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature, structure, or characteristic in connection with other ones of the embodiments.
Although a number of illustrative embodiments have been described, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, variations and modifications are possible in the component parts and/or the subject combinations which would fall within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
Number | Date | Country | Kind |
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10-2007-0038049 | Apr 2007 | KR | national |