CARRIER STRUCTURE FOR SEMICONDUCTOR PACKAGE

Abstract

An exemplary carrier structure (20) for carrying workpieces includes a body (23) and an adhesive tape (27). The body defines a receiving hole (21) therethrough for receiving one or more of the workpieces therein. The adhesive tape is attached to one side of the body and covers the receiving hole thereby allowing one or more of the workpieces to be received in the receiving hole and on the adhesive tape.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present carrier structure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the carrier structure and its potential applications. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a schematic view of a carrier structure in accordance with a first preferred embodiment of the present invention;

FIG. 2 is a cut-away view of the carrier structure along line II-II in FIG. 1;

FIG. 3 is a schematic view of a carrier structure in accordance with a second preferred embodiment of the present invention;

FIG. 4 is a schematic view of a carrier structure in accordance with a third preferred embodiment of the present invention;

FIG. 5 is a schematic view of a carrier structure in accordance with a fourth preferred embodiment of the present invention; and

FIG. 6 is a schematic view of a carrier structure in accordance with a fifth preferred embodiment of the present invention.

Claims

1. A carrier structure configured for carrying workpieces, comprising: a body defining a receiving hole therethrough, the receiving hole being configured for receiving one or more of the workpieces therein; and an adhesive tape attached to one side of the body and covering the receiving hole thereby allowing the one or more of the workpieces to be received in the receiving hole and on the adhesive tape.

2. The carrier structure as claimed in claim 1, wherein the body is a substantially thin board in shape.

3. The carrier structure as claimed in claim 1, wherein the body is made of a hard material produced by anodic oxidation.

4. The carrier structure as claimed in claim 3, wherein the body is made of a material selected from a group consisting of stainless steel and aluminium alloy.

5. The carrier structure as claimed in claim 1, wherein the body has a bent portion configured for increasing the breaking tension of the body.

6. The carrier structure as claimed in claim 5, wherein the bent portion is V-shaped.

7. The carrier structure as claimed in claim 1, further comprising a plurality of other receiving holes defined through the body thereby forming a plurality of connecting portions between two adjacent receiving holes.

8. The carrier structure as claimed in claim 7, wherein the adhesive tape attached to the connecting portion defines an elliptic hole therein.

9. The carrier structure as claimed in claim 7, wherein the receiving holes are aligned along a line in the body.

10. The carrier structure as claimed in claim 7, wherein the receiving holes are aligned along two lines in the body.

11. The carrier structure as claimed in claim 1, wherein the adhesive tape is made of a flexile material capable of resisting high temperature.

12. The carrier structure as claimed in claim 1, wherein the adhesive tape is made of polyimide.

13. The carrier structure as claimed in claim 1, wherein a glue layer of the adhesive tape is made of silicone.