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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/6835
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Patents Grants
last 30 patents
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
Patent number
12,362,276
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing display device, and transfer substrate for...
Patent number
12,362,220
Issue date
Jul 15, 2025
LG Electronics Inc.
Jungsub Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
Patent number
12,362,325
Issue date
Jul 15, 2025
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
12,362,326
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device using micro LED and method of manufacturing same
Patent number
12,362,335
Issue date
Jul 15, 2025
LG Electronics Inc.
Chilkeun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
12,362,178
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor memory device and structure
Patent number
12,362,219
Issue date
Jul 15, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing
Patent number
12,362,341
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chang-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package assembly, electronic device, and preparation method of...
Patent number
12,354,967
Issue date
Jul 8, 2025
Huawei Technologies Co., Ltd.
Zhaozheng Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for splitting semiconductor wafers
Patent number
12,356,700
Issue date
Jul 8, 2025
Infineon Technologies AG
Christian Beyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display projector systems and devices for augmented-reality
Patent number
12,355,022
Issue date
Jul 8, 2025
Meta Platforms Technologies, LLC
Rajendra D. Pendse
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package including photo imageable dielectric
Patent number
12,354,974
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Yuseon Heo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Debonding structures for wafer bonding
Patent number
12,347,717
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Ting Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,347,749
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and manufacturing method of electronic device
Patent number
12,341,142
Issue date
Jun 24, 2025
INNOLUX CORPORATION
Shun-Yuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device including resin layers
Patent number
12,341,024
Issue date
Jun 24, 2025
Kioxia Corporation
Eiji Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
12,341,051
Issue date
Jun 24, 2025
Fuji Electric Co., Ltd.
Kazuhiro Kitahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming same
Patent number
12,334,465
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device for mass transfer of mini light-emitting diodes (mini-LEDs)...
Patent number
12,336,324
Issue date
Jun 17, 2025
GUANGDONG UNIVERSITY OF TECHNOLOGY
Yun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including photonic package having embedded optica...
Patent number
12,334,362
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
12,334,464
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
12,334,476
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lthc as charging barrier in info package formation
Patent number
12,334,489
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion implantation with annealing for substrate cutting
Patent number
12,327,811
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Huicheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,327,812
Issue date
Jun 10, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing display device using semiconductor light em...
Patent number
12,328,979
Issue date
Jun 10, 2025
LG Electronics Inc.
Mihee Heo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer structure
Patent number
12,322,686
Issue date
Jun 3, 2025
Innolux Corporation
Hung-Sheng Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with underfill
Patent number
12,322,704
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
Publication number
20250232977
Publication date
Jul 17, 2025
II-VI Delaware, Inc.
Jeremy Andre Turcaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
Publication number
20250233002
Publication date
Jul 17, 2025
KULICKE & SOFFA NETHERLANDS B.V.
Matthew R. Semler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
Publication number
20250233108
Publication date
Jul 17, 2025
TOKYO ELECTRON LIMITED
Mark L. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
Publication number
20250233301
Publication date
Jul 17, 2025
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...
Publication number
20250226225
Publication date
Jul 10, 2025
SOITEC
Bruno Ghyselen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FOIL WITH CARRIER
Publication number
20250227855
Publication date
Jul 10, 2025
Mitsui Mining and Smelting Co., Ltd.
Toshimi NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT
Publication number
20250218850
Publication date
Jul 3, 2025
EPISTAR CORPORATION
Chang-Tai HSIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT PROCESSING APPARATUS
Publication number
20250218830
Publication date
Jul 3, 2025
PlayNitride Display Co., Ltd.
Yen-Mu Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
Publication number
20250219020
Publication date
Jul 3, 2025
Samsung Electronics Co., Ltd.
Junho CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages And Methods Of Forming The Same
Publication number
20250219024
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE
Publication number
20250218848
Publication date
Jul 3, 2025
SAMSUNG DISPLAY CO., LTD.
Jae Gwang UM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR...
Publication number
20250215276
Publication date
Jul 3, 2025
LINTEC CORPORATION
Kenta NISHIJIMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
Publication number
20250218847
Publication date
Jul 3, 2025
Intel Corporation
Veronica A. Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING APPARATUS
Publication number
20250218849
Publication date
Jul 3, 2025
Samsung Electronics Co., Ltd.
Sangjun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Publication number
20250210401
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES
Publication number
20250210398
Publication date
Jun 26, 2025
Intel Corporation
Clay ARRINGTON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-TRANSFER PRINTING METHODS
Publication number
20250210399
Publication date
Jun 26, 2025
X-CELEPRINT LIMITED
Ronald S. Cok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
Publication number
20250210457
Publication date
Jun 26, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
Publication number
20250210400
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Taehoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
Publication number
20250201762
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Sungmin MOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...
Publication number
20250201616
Publication date
Jun 19, 2025
KIOXIA Corporation
Yuusuke TAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)...
Publication number
20250204089
Publication date
Jun 19, 2025
Guangdong University of Technology
Yun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20250191963
Publication date
Jun 12, 2025
Kokusai Electric Corporation
Toshiki FUJINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Semiconductor Device Fabrication Involving Porous Silico...
Publication number
20250194125
Publication date
Jun 12, 2025
INFINEON TECHNOLOGIES AG
Hans-Joachim SCHULZE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
Publication number
20250192080
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
Publication number
20250191941
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
Publication number
20250192008
Publication date
Jun 12, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyung Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANARIZATION METHOD OF WAFER
Publication number
20250191925
Publication date
Jun 12, 2025
NANYA TECHNOLOGY CORPORATION
Kai ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER LAYER FOR A SEMICONDUCTOR WAFER AND METHOD FOR APPLYING SUC...
Publication number
20250183087
Publication date
Jun 5, 2025
ROBERT BOSCH GmbH
Benjamin Zillmann
H01 - BASIC ELECTRIC ELEMENTS