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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/6835using temporarily an auxiliary support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED and method of manufacturing same
- Patent number 12,362,335
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Chilkeun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display projector systems and devices for augmented-reality
- Patent number 12,355,022
- Issue date Jul 8, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including photo imageable dielectric
- Patent number 12,354,974
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Yuseon Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding structures for wafer bonding
- Patent number 12,347,717
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 12,341,142
- Issue date Jun 24, 2025
- INNOLUX CORPORATION
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including resin layers
- Patent number 12,341,024
- Issue date Jun 24, 2025
- Kioxia Corporation
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,051
- Issue date Jun 24, 2025
- Fuji Electric Co., Ltd.
- Kazuhiro Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 12,334,465
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for mass transfer of mini light-emitting diodes (mini-LEDs)...
- Patent number 12,336,324
- Issue date Jun 17, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including photonic package having embedded optica...
- Patent number 12,334,362
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 12,327,811
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure
- Patent number 12,322,686
- Issue date Jun 3, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...
- Publication number 20250226225
- Publication date Jul 10, 2025
- SOITEC
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20250227855
- Publication date Jul 10, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT
- Publication number 20250218850
- Publication date Jul 3, 2025
- EPISTAR CORPORATION
- Chang-Tai HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250218848
- Publication date Jul 3, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR...
- Publication number 20250215276
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Kenta NISHIJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
- Publication number 20250218847
- Publication date Jul 3, 2025
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20250218849
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250210401
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES
- Publication number 20250210398
- Publication date Jun 26, 2025
- Intel Corporation
- Clay ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFER PRINTING METHODS
- Publication number 20250210399
- Publication date Jun 26, 2025
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...
- Publication number 20250201616
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)...
- Publication number 20250204089
- Publication date Jun 19, 2025
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250191963
- Publication date Jun 12, 2025
- Kokusai Electric Corporation
- Toshiki FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Semiconductor Device Fabrication Involving Porous Silico...
- Publication number 20250194125
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
- Publication number 20250191941
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER LAYER FOR A SEMICONDUCTOR WAFER AND METHOD FOR APPLYING SUC...
- Publication number 20250183087
- Publication date Jun 5, 2025
- ROBERT BOSCH GmbH
- Benjamin Zillmann
- H01 - BASIC ELECTRIC ELEMENTS

using temporarily an auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Method for manufacturing display device, and transfer substrate for...

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Display device using micro LED and method of manufacturing same

Method for fabricating a chip package

3D semiconductor memory device and structure

Semiconductor devices and methods of manufacturing

Chip package assembly, electronic device, and preparation method of...

Method for splitting semiconductor wafers

Display projector systems and devices for augmented-reality

Semiconductor package including photo imageable dielectric

Debonding structures for wafer bonding

Semiconductor packages

Microdevice integration into system substrate

Electronic device and manufacturing method of electronic device

Method for manufacturing semiconductor device including resin layers

Manufacturing method of semiconductor device

Semiconductor package and method of forming same

Device for mass transfer of mini light-emitting diodes (mini-LEDs)...

Package structure including photonic package having embedded optica...

Encapsulated package including device dies connected via interconne...

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Ion implantation with annealing for substrate cutting

Semiconductor device and manufacturing method thereof

Method of manufacturing display device using semiconductor light em...

Redistribution layer structure

Package structure with underfill

Patents Applicationslast 30 patents

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...

METAL FOIL WITH CARRIER

SEMICONDUCTOR DEVICE ARRANGEMENT

COMPONENT PROCESSING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

Semiconductor Packages And Methods Of Forming The Same

METHOD OF MANUFACTURING DISPLAY DEVICE

ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR...

CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...

WAFER BONDING APPARATUS

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES

MICRO-TRANSFER PRINTING METHODS

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...

DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)...

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

Methods of Semiconductor Device Fabrication Involving Porous Silico...

Integrated Devices in Semiconductor Packages and Methods of Forming...

METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

PLANARIZATION METHOD OF WAFER

CARRIER LAYER FOR A SEMICONDUCTOR WAFER AND METHOD FOR APPLYING SUC...