This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201310239723.2 filed in China, P.R.C. on Jun. 17, 2013, the entire contents of which are hereby incorporated by reference.
1. Technical Field of the Invention
The disclosure relates to a case structure for an electronic device and manufacturing method thereof, more particularly to a case structure for an electronic device formed by injection molding and the manufacturing method thereof
2. Description of the Related Art
As technology advances and high-tech industries develop, the market competition for electronic devices (e.g., laptops, mobile phones, tablets, electronic dictionaries or portable game consoles) is more intense. In order to satisfy the customers' requirements for the performance of the electronic devices, in related industries invest a large amount of money on the research and development for improving the performance of the electronic devices. As a result, the performance of the electronic devices improves incessantly.
Since the performance of the electronic devices has been improved, the heat generated by the electronic devices has increased. In order to eliminate the heat from the electronic devices, the aluminum foil and the graphite sheet are usually attached on the case made by plastic, so as to perform the heat dissipation. However, this approach requires additional working which increases the cost in the production line. Furthermore, since the shapes of the cases vary, the aluminum foil and the graphite sheet cannot be attached to the case evenly, and this affects the heat dissipation result negatively. Hence, how to manufacture a case without the additional processing of the aluminum foil and the graphite sheet is a problem needed to be solved by the related industries.
A method for a case for an electronic device is disclosed. In the method, a first plastic layer is formed by injection molding. A PCM (phase change material microcapsule) layer is formed on one side of the first plastic layer.
The disclosure further provides a case structure for an electronic device comprising a first plastic layer and a PCM microcapsule layer. The PCM microcapsule layer is disposed on one side of the first plastic layer.
The present disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus does not limit the present disclosure, wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Referring to
The first embodiment of the disclosure provides a method for forming a case for an electronic device. The method comprises:
S1: Forming a first plastic layer by injection molding. Specifically, as shown in
S2: Forming a PCM microcapsule layer on one side of the first plastic layer by injection molding. Specifically, as shown in
Moreover, the disclosure provides a case structure for the electronic device. Referring to
After the injection molding machine 10 forms the PCM microcapsule layer 163 on one side of the first plastic layer 161, the users may remove the case structure 16 for the electronic device from the mold 15. The case structure 16 for the electronic device comprises a first plastic layer 161 and a PCM microcapsule layer 163. The PCM microcapsule layer 163 is disposed on one side of the first plastic layer 161.
In the case structure for the electronic device and the manufacturing method thereof according to the first embodiment of the disclosure, the PCM microcapsule layer 163 is disposed on one side of the first plastic layer 161, and the PCM has a great latent heat. That is, the PCM is capable of absorbing a large amount of heat when phase is changing. Therefore, the heat dissipation performance of the case structure 16 for the electronic device is improved, and this approach does not require attaching the aluminum foil and the graphite sheet on the surface of the case. Thereby, the additional working cost caused by attaching the aluminum foil and the graphite sheet to the case surface, as mentioned in the related art, is eliminated.
The second embodiment of the disclosure provides a manufacturing method for a case structure for an electronic device. Referring to
The manufacturing method for the case structure for the electronic device according to the second embodiment is similar to that in the first embodiment, wherein the difference is that a step S3 is added after
Specifically, as shown in
Moreover, the second embodiment of the disclosure provides a case structure for the electronic device. Referring to
After the injection molding machine 10 forms the second plastic layer 26 on one side of the PCM microcapsule layer 363, the users may remove the case structure 30 for the electronic device from the mold 15. The case structure 30 for the electronic device comprises a first plastic layer 361, a second plastic layer 365 and a PCM microcapsule layer 363. The first plastic layer 361 and the second plastic layer 365 surround the PCM microcapsule layer 363.
In the case structure for the electronic device and the manufacturing method thereof according to the second embodiment of the disclosure, since the case structure 30 for the electronic device comprises the PCM microcapsule layer 363, and the PCM has a great latent heat. That is, the PCM is capable of absorbing a large amount of heat when phase is changing. Therefore, the heat dissipation performance of the case structure 30 for the electronic device is improved, and this approach does not require attaching the aluminum foil and the graphite sheet on the surface of the case. Thereby, the additional working cost caused by attaching the aluminum foil and the graphite sheet to the case surface, as mentioned in the related art, is eliminated.
In the case structure for the electronic device and the manufacturing method thereof according to the above-mentioned embodiments, since the case structure for the electronic device comprises the PCM microcapsule layer, the heat dissipation performance can be improved. Furthermore, this approach does not require attaching the aluminum foil and the graphite sheet to the case surface. Thereby, the additional working cost of attaching the aluminum foil and the graphite sheet can be eliminated.
It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments. It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims and their equivalents.
Number | Date | Country | Kind |
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201310239723.2 | Jun 2013 | CN | national |