Claims
- 1. Cathode sputtering apparatus comprising
- a magnetic yoke which carries permanent magnets and a target,
- a top plate extending parallel to said yoke to form an assembly having parallel sides,
- spring means urging said magnetic yoke toward said top plate,
- rotatable cam means between said top plate and said yoke, said rotatable cam means being effective to move the top plate and the magnetic yoke away from each other against the urging of the spring means, thereby to adjust the distance between said top plate and said yoke when rotated, and
- bracket means effective to limit the movement of the magnetic yoke away from said top plate.
- 2. Cathode sputtering apparatus as in claim 1 wherein said spring means comprises spring bolt means which also serves to connect said magnetic yoke to said top plate.
- 3. Cathode sputtering apparatus as in claim 1 wherein said bracket means comprises at least one clamping bar on each side of said assembly, each clamping bar having a claw-like edge part extending over the top plate and a claw-like edge part extending over the magnetic yoke.
- 4. Cathode sputtering apparatus as in claim 3 wherein said claw-like edge parts extending over the yoke also extend over the target and hold said target against said yoke, whereby rotation of said cam means to a release position permits ready removal of said target from said assembly.
- 5. Cathode sputtering apparatus as in claim 3 wherein said at least one clamping bar on at least one side has an access hole aligned with said cam means to effect rotation of said cam means.
- 6. Cathode sputtering apparatus as in claim 1 wherein said cam means comprises at least one cam shaft journaled to said top plate.
Priority Claims (1)
Number |
Date |
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Kind |
195 25 007.9 |
Jul 1995 |
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Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 08/554,751 filed Nov. 7, 1995, now U.S. Pat. No. 5,616,226, incorporated herein by reference.
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5292419 |
Moses et al. |
Mar 1994 |
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5421978 |
Schuhmacher et al. |
Jun 1995 |
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Country |
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Non-Patent Literature Citations (2)
Entry |
Hieber, K. "Radio Frequency Sputter Deposition of Alloy Films" Siemens Forsch, Ber. Bd. 11, 1982 No. 3 pp. 145-148. |
Takakazu, Tadahishi et al. "High Rate and Low Temperature Deposition of Co-Cr Films" Jap. Journal of Applied Physics, vol. 24 No. 9 (1985). |
Continuation in Parts (1)
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Number |
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Parent |
554751 |
Nov 1995 |
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