Target holders (includes backing plates and endblocks)

Industry

CPC
H01J37/3435

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/3435Target holders (includes backing plates and endblocks)

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modular sputtering target with precious metal insert and skirt
- Patent number 12,359,303
- Issue date Jul 15, 2025
- Materion Corporation
- Matthew Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ and tunable deposition of a film
- Patent number 12,359,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition (PVD) with target erosion profile monitoring
- Patent number 12,334,319
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multifocal magnetron design for physical vapor deposition processin...
- Patent number 12,283,470
- Issue date Apr 22, 2025
- Intevac, Inc.
- Samuel D. Harkness
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus
- Patent number 12,249,497
- Issue date Mar 11, 2025
- Samsung Display Co., Ltd.
- Hyun-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter deposition
- Patent number 12,249,498
- Issue date Mar 11, 2025
- Dyson Technology Limited
- Michael Edward Rendall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target and sputtering apparatus including the same
- Patent number 12,221,686
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Hyuneok Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Profiled sputtering target and method of making the same
- Patent number 12,217,951
- Issue date Feb 4, 2025
- Honeywell International Inc.
- Shih-Yao Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target, method of bonding target material and backing pl...
- Patent number 12,217,948
- Issue date Feb 4, 2025
- Sumitomo Chemical Company, Limited
- Masahiro Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetically enhanced high density plasma-chemical vapor deposition...
- Patent number 12,217,949
- Issue date Feb 4, 2025
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stage, film-forming apparatus, and film-processing apparatus
- Patent number 12,211,710
- Issue date Jan 28, 2025
- NHK Spring Co., Ltd.
- Toshihiko Hanamachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon sputtering target with special surface treatment and good p...
- Patent number 12,205,804
- Issue date Jan 21, 2025
- Tosoh SMD, Inc.
- Yongwen Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus, film formation method, and method for manufac...
- Patent number 12,205,805
- Issue date Jan 21, 2025
- Canon Kabushiki Kaisha
- Kazuya Demura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molten liquid transport for tunable vaporization in ion sources
- Patent number 12,154,754
- Issue date Nov 26, 2024
- Applied Materials, Inc.
- Craig R. Chaney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for reducing misalignment between sputtering target and shield
- Patent number 12,136,543
- Issue date Nov 5, 2024
- Honeywell International Inc.
- Bo Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method for tuning magnetic field distribution of deposit...
- Patent number 12,129,541
- Issue date Oct 29, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target, film forming apparatus, and method of manufacturing film fo...
- Patent number 12,125,690
- Issue date Oct 22, 2024
- JSW AFTY CORPORATION
- Hironori Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cathode unit for magnetron sputtering apparatus and magnetron sputt...
- Patent number 12,112,929
- Issue date Oct 8, 2024
- ULVAC, Inc.
- Koji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition apparatus and method thereof
- Patent number 12,094,698
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Backing plate, sputtering target, and production methods therefor
- Patent number 12,057,302
- Issue date Aug 6, 2024
- Sumitomo Chemical Company, Limited
- Koji Nishioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target, method of bonding target material and backing pl...
- Patent number 12,051,577
- Issue date Jul 30, 2024
- Sumitomo Chemical Company, Limited
- Masahiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning of SIN with CCP plasma or RPS clean
- Patent number 12,027,354
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Jothilingam Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter trap having a thin high purity coating layer and method of...
- Patent number 11,981,991
- Issue date May 14, 2024
- Honeywell International Inc.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus
- Patent number 11,978,615
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Hyun-Woo Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 11,961,710
- Issue date Apr 16, 2024
- Canon Anelva Corporation
- Tadashi Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid sputter target
- Patent number 11,952,654
- Issue date Apr 9, 2024
- EVATEC AG
- Dominik Jaeger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film formation apparatus
- Patent number 11,955,367
- Issue date Apr 9, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Shohei Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tilted PVD source with rotating pedestal
- Patent number 11,948,784
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Harish Penmethsa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cleaning of sin with CCP plasma or RPS clean
- Patent number 11,915,918
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Jothilingam Ramalingam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUPPORT DEVICE AND METHOD OF PREVENTING OCCURRENCE OF ARCING
- Publication number 20250218723
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Soon Cheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING APPARATUS
- Publication number 20250183021
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- HYUN-WOO KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DYNAMIC VACUUM SEAL SYSTEM FOR PHYSICAL VAPOR DEPOSITION SPUTTER AP...
- Publication number 20250149303
- Publication date May 8, 2025
- Tosoh SMD, Inc.
- Joseph BUCKFELLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PL...
- Publication number 20250125131
- Publication date Apr 17, 2025
- Sumitomo Chemical Company, Limited
- Masahiro FUJITA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20250092508
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING APPARATUS AND METHOD FOR THIN FILM ELECTRODE DEPOSITION
- Publication number 20250029819
- Publication date Jan 23, 2025
- SAMSUNG DISPLAY CO., LTD.
- You Jong LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE
- Publication number 20250014878
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Andreas SCHMID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
- Publication number 20240429036
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
- Publication number 20240420937
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yu Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME
- Publication number 20240271271
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING APPARATUS
- Publication number 20240258088
- Publication date Aug 1, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYUN-WOO KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTU...
- Publication number 20240213006
- Publication date Jun 27, 2024
- SEMES CO., LTD.
- Sun Il KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESS APPARATUS
- Publication number 20240212980
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaesuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING APPARATUS
- Publication number 20240194462
- Publication date Jun 13, 2024
- EMD CORPORATION
- Akinori EBE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION APPARATUS
- Publication number 20240183027
- Publication date Jun 6, 2024
- TOKYO ELECTRON LIMITED
- Naoki TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME
- Publication number 20240183029
- Publication date Jun 6, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYUNEOK SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME
- Publication number 20240084441
- Publication date Mar 14, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYUNEOK SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING APPARATUS
- Publication number 20240063003
- Publication date Feb 22, 2024
- Canon ANELVA Corporation
- Susumu KARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR REDUCING MISALIGNMENT BETWEEN SPUTTERING TARGET AND SHIELD
- Publication number 20240021422
- Publication date Jan 18, 2024
- Honeywell International Inc.
- Bo Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLTEN LIQUID TRANSPORT FOR TUNABLE VAPORIZATION IN ION SOURCES
- Publication number 20230402247
- Publication date Dec 14, 2023
- Applied Materials, Inc.
- Craig R. Chaney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU AND TUNABLE DEPOSITION OF A FILM
- Publication number 20230374654
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20230366079
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET-BACKING PLATE ASSEMBLY, MANUFACTURING METHOD THER...
- Publication number 20230360897
- Publication date Nov 9, 2023
- FURUYA METAL CO., LTD.
- Tomohiro Maruko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION APPARATUS AND METHOD THEREOF
- Publication number 20230307218
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PL...
- Publication number 20230274921
- Publication date Aug 31, 2023
- Sumitomo Chemical Company, Limited
- Masahiro FUJITA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING APPARATUS
- Publication number 20230167542
- Publication date Jun 1, 2023
- TOKYO ELECTRON LIMITED
- Junichi TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETRON TARGET COUPLING AND SUPPORT DEVICE
- Publication number 20230154733
- Publication date May 18, 2023
- VON ARDENNE Asset GmbH & Co. KG
- Goetz GROSSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHROMIC DEVICES
- Publication number 20230144179
- Publication date May 11, 2023
- VIEW, INC.
- Zhongchun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...
- Publication number 20230143320
- Publication date May 11, 2023
- Honeywell International Inc.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATHODE UNIT FOR MAGNETRON SPUTTERING APPARATUS AND MAGNETRON SPUTT...
- Publication number 20230138552
- Publication date May 4, 2023
- Ulvac, Inc.
- Koji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Target holders (includes backing plates and endblocks)

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular sputtering target with precious metal insert and skirt

In situ and tunable deposition of a film

Physical vapor deposition (PVD) with target erosion profile monitoring

Multifocal magnetron design for physical vapor deposition processin...

Sputtering apparatus

Sputter deposition

Sputtering target and sputtering apparatus including the same

Profiled sputtering target and method of making the same

Sputtering target, method of bonding target material and backing pl...

Magnetically enhanced high density plasma-chemical vapor deposition...

Stage, film-forming apparatus, and film-processing apparatus

Silicon sputtering target with special surface treatment and good p...

Sputtering apparatus, film formation method, and method for manufac...

PVD target design and semiconductor devices formed using the same

Molten liquid transport for tunable vaporization in ion sources

Device for reducing misalignment between sputtering target and shield

Deposition method for tuning magnetic field distribution of deposit...

Target, film forming apparatus, and method of manufacturing film fo...

Cathode unit for magnetron sputtering apparatus and magnetron sputt...

Physical vapor deposition apparatus and method thereof

Backing plate, sputtering target, and production methods therefor

Sputtering target, method of bonding target material and backing pl...

Cleaning of SIN with CCP plasma or RPS clean

Sputter trap having a thin high purity coating layer and method of...

Sputtering apparatus

Plasma processing apparatus

Liquid sputter target

Film formation apparatus

Tilted PVD source with rotating pedestal

Cleaning of sin with CCP plasma or RPS clean

Patents Applicationslast 30 patents

SUBSTRATE SUPPORT DEVICE AND METHOD OF PREVENTING OCCURRENCE OF ARCING

SPUTTERING APPARATUS

DYNAMIC VACUUM SEAL SYSTEM FOR PHYSICAL VAPOR DEPOSITION SPUTTER AP...

SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PL...

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

SPUTTERING APPARATUS AND METHOD FOR THIN FILM ELECTRODE DEPOSITION

WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING

GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA

PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME

SPUTTERING APPARATUS

CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTU...

PLASMA PROCESS APPARATUS

SPUTTERING APPARATUS

FILM FORMATION METHOD AND FILM FORMATION APPARATUS

DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME

SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME

SPUTTERING APPARATUS

DEVICE FOR REDUCING MISALIGNMENT BETWEEN SPUTTERING TARGET AND SHIELD

MOLTEN LIQUID TRANSPORT FOR TUNABLE VAPORIZATION IN ION SOURCES

IN SITU AND TUNABLE DEPOSITION OF A FILM

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

SPUTTERING TARGET-BACKING PLATE ASSEMBLY, MANUFACTURING METHOD THER...

PHYSICAL VAPOR DEPOSITION APPARATUS AND METHOD THEREOF

SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PL...

FILM FORMING APPARATUS

MAGNETRON TARGET COUPLING AND SUPPORT DEVICE

ELECTROCHROMIC DEVICES

SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...

CATHODE UNIT FOR MAGNETRON SPUTTERING APPARATUS AND MAGNETRON SPUTT...