The present invention relates to battery modules that require cell temperature monitoring, and more particularly to a battery module with a novel temperature sensing apparatus.
High power battery modules comprising a number of co-packaged and interconnected lithium-ion or other battery cells frequently require individual cell temperature monitoring to optimize battery module life and prevent temperature-related failures. The temperature of a battery cell can be adequately measured with a thermistor that is in contact with the case of the battery cell, particularly with a metal-case battery cell, but it is difficult to accurately and reliably place the thermistors in high-volume manufacturing processes. And there are further manufacturing difficulties associated with handling and routing the thermistor leads. Accordingly, what is needed is an improved thermistor mounting arrangement that ensures reliable thermal coupling between the thermistor and the battery cell, and eliminates problems associated with the handling and routing of thermistor leads.
The present invention is directed to a battery module having an improved thermistor mounting apparatus for sensing battery cell temperatures. A printed circuit board mounted on the battery module over the battery cells is provided with an array of openings in alignment with selected battery cells for receiving temperature-sensing units that electrically couple with conductor pads formed on the printed circuit board and resiliently engage the selected battery cells. Each such temperature-sensing unit includes a printed circuit board mountable lamp socket, and a lamp socket insert including a thermistor in thermal proximity to a respective battery cell and a compressible support element that resiliently maintains the thermistor in thermal proximity to the battery cell when the sensor unit is installed in a respective printed circuit board opening. In a first embodiment, the insert is seated in a neo-wedge-base lamp socket, and comprises a radial leaded thermistor and a compressible sleeve that resiliently supports the thermistor element relative to the lamp socket. In a second embodiment, the insert is seated in a wedge-base lamp socket, and comprises a surface-mount thermistor attached to a flexible circuit that is over-molded with a compressible moldable material such as silicone rubber.
Referring to the drawings, and particularly to
The battery cells 12A-12L of the module 10 are provided with oppositely disposed terminals 20 that are connected in a series chain by sets of bus-bars 22 located on either side of the module 10. Each terminal 20 includes an integral vertically extending tab 24, and the circuit board 14 is provided with a set of corresponding plated through-holes 26 that receive the terminal tabs 24. In this way, the terminal tabs 24 support the circuit board 14 over the battery cells 12A-12L, in addition to providing cell voltage sensing nodes at each of the through-holes 26. Conductor traces (not shown) on the circuit board 14 electrically couple the plated through-holes 26, and hence the terminal tabs 24, to signal conditioning circuitry (not shown) for producing a set of output signals representing various cell voltages of the module 10.
According to this invention, the circuit board 14 also provides a mounting platform for the temperature-sensing units 16, 18. To this end, the circuit board 14 is provided with a set of notched circular openings 28 that are vertically aligned with the top surfaces of selected battery cells, and a temperature-sensing unit 16 or 18 is mounted in each of the circuit board openings 28 as indicated in
As mentioned above, the temperature-sensing units 16, 18 depicted in
Referring to
Referring to
When the insert 18b is pressed into the lamp socket 18a, the terminals 56 each electrically and mechanically contact a set of spring terminals (not shown) formed in the base of lamp socket 18a to electrically couple the terminals 56 to the lamp socket 18a as well as to mechanically retain insert 18b in the lamp socket 18a. The spring terminals in the base of lamp socket 18a are coupled to a set of contacts (not shown) formed on a peripheral flange 58 of lamp socket 18a, and such contacts are brought into engagement with a set of circuit board conductor pads 32a, 32b when the unit 18 is inserted into a circuit board opening 28. When the unit 18 is inserted into a circuit board opening 28, the insert 18b and the riser portion 60 of the lamp socket 18a extend through the opening 28, and the outboard end of insert 18b contacts the battery cell case 30. The compressible over-molded material 54 of insert 18b compresses in the axial direction (i.e., in the direction of its insertion) as the unit 18 is fully inserted and twisted to mechanically lock it to circuit board 14. And in the locked position, the contacts on lamp socket flange 58 engage the circuit board conductor pads 32a, 32b to electrically couple the thermistor 50 to the conductor pads 32a, 32b. In the installed condition, the thermistor 50 is electrically insulated from the battery cell case 30 by the insulative substrate of flexible circuit 52 and a thin layer of over-molding material 54, but is nevertheless in thermal proximity to the battery cell case 30.
In summary, the present invention provides an improved thermistor mounting arrangement for a battery module that ensures reliable thermal coupling between the thermistor 34, 50 and the battery cell case 30, The temperature-sensing units 16, 18 of the present invention ensure each of the following: (1) mechanical contact between the unit 16, 18 and the battery cell case 30 for reliable cell temperature sensing; (2) electrical contact between the unit 16, 18 and the circuit board 14; and (3) mechanical retention of the unit 16, 18 to the circuit board. The usual problems associated with handling, routing and soldering thermistor leads are eliminated, and the units 16, 18 are quickly and easily installed with a simple insert-and-twist motion.
While the present invention has been described with respect to the illustrated embodiment, it is recognized that numerous modifications and variations in addition to those mentioned herein will occur to those skilled in the art. Accordingly, it is intended that the invention not be limited to the disclosed embodiment, but that it have the full scope permitted by the language of the following claims.
temperature-sensing unit is installed in a respective printed circuit board opening.
Number | Name | Date | Kind |
---|---|---|---|
4603026 | Martin | Jul 1986 | A |
4642600 | Gummelt et al. | Feb 1987 | A |
5197889 | Rizzo et al. | Mar 1993 | A |
5342126 | Heston et al. | Aug 1994 | A |
5459388 | Illingworth et al. | Oct 1995 | A |
5660473 | Noma et al. | Aug 1997 | A |
5749656 | Boehm et al. | May 1998 | A |
5966014 | Zhang et al. | Oct 1999 | A |
6082895 | Janicek | Jul 2000 | A |
6104301 | Golden | Aug 2000 | A |
6607302 | Lyle | Aug 2003 | B2 |
6610439 | Kimoto et al. | Aug 2003 | B1 |
7410294 | Shiraki et al. | Aug 2008 | B2 |
7910243 | Koh et al. | Mar 2011 | B2 |
20030124417 | Bertness et al. | Jul 2003 | A1 |
20030223474 | Roepke | Dec 2003 | A1 |
20050181242 | Suzuki et al. | Aug 2005 | A1 |
20060028183 | Izawa et al. | Feb 2006 | A1 |
20070152631 | Seo | Jul 2007 | A1 |
20090185597 | Khan et al. | Jul 2009 | A1 |
20100062329 | Muis | Mar 2010 | A1 |
20100124693 | Kosugi et al. | May 2010 | A1 |
20100285340 | Matsunaga | Nov 2010 | A1 |
20100309949 | Akaboshi et al. | Dec 2010 | A1 |
20110024205 | Nishihara et al. | Feb 2011 | A1 |
20110044374 | Bergeron | Feb 2011 | A1 |
20110195284 | Yasui et al. | Aug 2011 | A1 |
20110229745 | Barter et al. | Sep 2011 | A1 |
20120092018 | Scheucher | Apr 2012 | A1 |
20120126820 | Tan et al. | May 2012 | A1 |
Number | Date | Country |
---|---|---|
0161398 | Nov 1985 | EP |
1278262 | Jan 2003 | EP |
2387232 | Oct 2003 | GB |
2002124305 | Apr 2002 | JP |
2005189080 | Jul 2005 | JP |
2008304295 | Dec 2008 | JP |
2009093758 | Jul 2009 | WO |
Number | Date | Country | |
---|---|---|---|
20100136392 A1 | Jun 2010 | US |